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STM32L476MGY3TR

STMicroelectronics

STM32L476MGY3TR by STMicroelectronics

STM32L476MGY3TR from STMicroelectronics is a versatile 32-bit microcontroller featuring a max supply voltage of 3.6V, 16 ADC channels, and an operating temp range of -40 °C to 125 °C. Ideal for automotive applications, it supports various connectivity options like CAN and USB. With its low power consumption and rich peripherals, it's perfect for IoT devices and smart sensors.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,589 parts In-Stock

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6,589

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Digiode

USA . 4,621 parts In-Stock

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4,621

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Anansix

USA . 1,106 parts In-Stock

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1,106

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 360 parts In-Stock

1+ parts

$18.710

100+ parts

-

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360

$18.710

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Microchip USA

USA . 7,511 parts In-Stock

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$25.862

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7,511

$25.862

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IDEA Electronic Components Group

UK . 167 parts In-Stock

1+ parts

$70.052

100+ parts

-

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$63.047

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167

$70.052

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$63.047

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MKK Technologies

India . 1,721 parts In-Stock

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$131.729

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1,721

$131.729

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DigiPath Technology Company

USA . 1,721 parts In-Stock

1+ parts

$131.729

100+ parts

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1,721

$131.729

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Corphita

USA . 4,136 parts In-Stock

1+ parts

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4,136

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,649 parts In-Stock

1+ parts

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$83.758

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1,649

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$83.758

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Overview

Unlock innovation with the STM32L476MGY3TR microcontroller from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This powerful, energy-efficient device is designed for diverse applications, from smart home systems to automotive technologies. Experience unparalleled performance and reliability, empowering your projects with connectivity options, advanced processing capabilities, and exceptional versatility. Choose quality you can trust and elevate your design to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into automated assembly processes.

Maximum Supply Voltage: 3.6 V

This low maximum voltage supports energy-efficient designs and is compatible with most battery-operated devices.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient use of space on printed circuit boards (PCBs).

Bit Size: 32

A 32-bit architecture provides a good balance between processing power and energy efficiency for complex applications.

DAC Channels: YES

Inclusion of Digital to Analog Conversion enhances the controller's capability to handle audio and other signals.

No. of Terminals: 81

A higher number of terminals enables more versatile connection options for peripherals and sensors.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile minimizes space usage, perfect for modern compact electronic devices.

Minimum Supply Voltage: 1.71 V

The wide voltage range allows for flexible power supply options and better adaptation in low-power applications.

Maximum Operating Temperature: 125 °C

High-temperature tolerance ensures reliable operation in demanding environments such as automotive applications.

CPU Family: CORTEX-M4

The ARM Cortex-M4 core provides robust performance with advanced signal processing capabilities.

Minimum Operating Temperature: -40 °C

Low-temperature capability makes this microcontroller suitable for harsh environmental conditions.

ADC Channels: YES

Analog to Digital Conversion allows the microcontroller to interact with sensors for various measurement applications.

DMA Channels: YES

Direct Memory Access support enables efficient data transfer without CPU intervention, improving overall processing speed.

Terminal Position: BOTTOM

Bottom terminal positioning is advantageous for specific PCB layouts and helps in minimizing space.

ROM Words: 1048576

Large ROM capacity empowers the microcontroller to store complex programs and user applications.

Maximum Seated Height: 0.585 mm

The low profile design aids in compact PCB designs where height restrictions are a concern.

Digital To Analog Converters: 2-Ch 12-Bit

These converters offer precision in audio and control applications, enhancing functionality and user experience.

Width: 3.7594 mm

Compact width makes it ideal for space-limited applications in portable electronics.

Peripherals: BOD, COMPARATOR(2), DMA(14), LCD, POR, RTC, TIMER(17)

The extensive set of peripherals enables the microcontroller to handle a wide range of tasks in various applications.

Maximum Clock Frequency: 48 MHz

A higher clock frequency allows for quick processing and responsive applications, improving overall performance.

Length: 4.4084 mm

Short length ensures a compact form factor well-suited for modern electronic devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and performance under severe temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances execution speed and efficiency, making it suitable for a diverse range of applications.

No. of Timers: 17

Many timers provide advanced timing functionalities, which is essential for various real-time applications.

RAM Bytes: 131072

Ample RAM ensures that the microcontroller can handle complex programs and multitasking effectively.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing system reliability.

Terminal Form: BALL

Ball terminal form factor allows for dense packaging and efficient thermal management on PCBs.

Analog To Digital Converters: 16-Ch 12-Bit

A high number of ADC channels provide flexibility for connecting multiple sensors, broadening application versatility.

Nominal Supply Voltage: 3 V

Nominal voltage aligns with standard battery levels, making it suitable for portable electronics.

No. of DMA Channels: 14

A generous number of DMA channels allows for efficient data handling, optimizing the CPU usage.

PWM Channels: YES

Presence of PWM channels enables precise control over lighting and motor applications.

Connectivity: CAN, I2C(3), I2S(2), IRDA, LIN, SAI(2), SDMMC, SPI(3), UART(3), USART(3), USB

Extensive connectivity options facilitate integration with various peripherals, ensuring versatile application development.

ROM Programmability: FLASH

Flash programmability allows for in-field upgrades, enhancing the product's longevity and adaptability.

Terminal Pitch: 0.4 mm

A fine terminal pitch allows for higher density designs, making it suitable for advanced applications.

Speed: 80 rpm

Adequate speed for applications involving motors and other electromechanical systems, ensuring responsive control.

On Chip Program ROM Width: 8

An 8-bit width for program ROM improves efficiency in storing data and executing instructions.

No. of I/O Lines: 65

A large number of I/O lines afford flexibility in interfacing with components, improving overall application versatility.

Technical Specifications

Microcontrollers STM32L476MGY3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B81

Length:

4.4084 mm

No. of DMA Channels:

14

No. of I/O Lines:

65

No. of Terminals:

81

No. of Timers:

17

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.7594 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), I2S(2), IRDA, LIN, SAI(2), SDMMC, SPI(3), UART(3), USART(3), USB

Peripherals:

BOD, COMPARATOR(2), DMA(14), LCD, POR, RTC, TIMER(17)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L476MGY3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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