Loading...

STM32L476JGY3TR

STMicroelectronics

STM32L476JGY3TR by STMicroelectronics

STM32L476JGY3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w 1.71V and 3.6V, and supports up to 16 ADC channels. Ideal for low-power applications, it includes multiple connectivity options like CAN and USB. Its automotive-grade design ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Quantum Digital Technology

USA . 8,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,056

-

-

-

-

K-1 Technologies

USA . 7,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,324

-

-

-

-

Sensible Micro Corp

USA . 7,324 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,324

-

-

-

-

Vyrian

USA . 6,617 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,617

-

-

-

-

Digiode

USA . 1,678 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,678

-

-

-

-

Anansix

USA . 547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

547

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,477 parts In-Stock

1+ parts

$7.870

100+ parts

-

1k+ parts

-

10k+ parts

-

1,477

$7.870

-

-

-

AZTECH Wire

Italy . 1,093 parts In-Stock

1+ parts

$14.730

100+ parts

-

1k+ parts

-

10k+ parts

-

1,093

$14.730

-

-

-

IDEA Electronic Components Group

UK . 2,108 parts In-Stock

1+ parts

$40.762

100+ parts

-

1k+ parts

$36.685

10k+ parts

-

2,108

$40.762

-

$36.685

-

MKK Technologies

India . 206 parts In-Stock

1+ parts

$76.649

100+ parts

-

1k+ parts

-

10k+ parts

-

206

$76.649

-

-

-

DigiPath Technology Company

USA . 206 parts In-Stock

1+ parts

$76.649

100+ parts

-

1k+ parts

-

10k+ parts

-

206

$76.649

-

-

-

GreenTree Electronics

Israel . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,000

-

-

-

-

Corphita

USA . 4,932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,932

-

-

-

-

Parana Technologies

USA . 975 parts In-Stock

1+ parts

-

100+ parts

$48.737

1k+ parts

-

10k+ parts

-

975

-

$48.737

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Unlock the potential of your next project with the STM32L476JGY3TR microcontroller from STMicroelectronics. Renowned for their cutting-edge technology and unwavering quality, STMicroelectronics delivers exceptional performance and reliability. This versatile microcontroller excels in low-power applications, making it ideal for wearable devices, smart sensors, and IoT solutions. Experience enhanced efficiency and seamless connectivity, ensuring your innovations stand out in a competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space.

Maximum Supply Voltage: 3.6 V

A versatile maximum voltage range supports a wide range of applications, enhancing compatibility.

On Chip Data RAM Width: 8

An 8-bit RAM width provides efficient data processing capability suitable for embedded applications.

Address Bus Width: 2

A 2-bit address bus allows for efficient memory addressing, optimizing performance in smaller designs.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout and design for various electronic applications.

Bit Size: 32

A 32-bit architecture enables high performance in computation and effective handling of modern applications.

DAC Channels: YES

The inclusion of Digital-to-Analog converters allows for versatile signal processing in analog applications.

No. of Terminals: 72

A high number of terminals supports extensive peripheral connectivity for complex systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style facilitates high-density layouts and efficient thermal management in compact designs.

Minimum Supply Voltage: 1.71 V

Operating at a low supply voltage enhances energy efficiency, making it ideal for portable applications.

Maximum Operating Temperature: 125 °C

The capability to operate at high temperatures makes it suitable for automotive and harsh environment applications.

CPU Family: CORTEX-M4

The Cortex-M4 core provides powerful processing capabilities with efficient energy consumption.

No. of External Interrupts: 16

With 16 external interrupts, this microcontroller can handle multiple external events effectively.

Minimum Operating Temperature: -40 °C

A wide temperature operating range ensures reliability in extreme environmental conditions.

ADC Channels: YES

Having multiple Analog-to-Digital converters allows for accurate data collection from various sensors.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency, minimizing CPU workload.

Terminal Position: BOTTOM

Bottom-terminal positioning aids in easy installation and reduces PCB real estate usage.

ROM Words: 1048576

A large ROM capacity allows for ample firmware storage and complex application development.

Maximum Seated Height: 0.585 mm

A low height profile is beneficial for space-sensitive applications, ensuring a compact assembly.

Digital To Analog Convertors: 2 Ch 12-Bit

12-bit resolution in DAC channels enables high-quality signal output for precision applications.

RAM Words: 65536

Sufficient RAM support allows for effective data handling, enhancing program execution and performance.

Width: 3.7594 mm

A narrow width provides flexibility in PCB design, allowing for higher-density layouts.

Boundary Scan: YES

Boundary scan capability aids in efficient testing and debugging during the development process.

Peripherals: BOR, COMPARATOR(2), LCD, RTC, TIMER(14), WDT(2)

A rich set of peripherals supports various functionalities, promoting versatility in application development.

Maximum Clock Frequency: 48 MHz

A high clock frequency ensures quick processing and responsiveness in applications.

Length: 4.4084 mm

A compact length supports space-efficient designs, particularly important in portable devices.

Temperature Grade: AUTOMOTIVE

Automotive grade rating guarantees robustness and reliability in vehicle applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture optimizes processing efficiency and performance, ideal for embedded control applications.

No. of Timers: 17

Multiple timers enable precise timing control, crucial for real-time applications.

RAM Bytes: 131072

An adequate RAM size supports more complex operations and tasks in embedded applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, advantageous for energy-sensitive applications.

Terminal Form: BALL

Ball grid array design enhances solder reliability and assembly efficiency.

Analog To Digital Convertors: 16-Ch 12-Bit

A 16-channel ADC with 12-bit resolution allows extensive sensor interfacing and data accuracy.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage decreases power consumption, extending battery life in portable devices.

No. of DMA Channels: 14

A high number of DMA channels supports efficient data handling and system performance.

PWM Channels: YES

Availability of PWM channels facilitates motor control and other timed activities in applications.

Connectivity: CAN, I2C(3), SAI(2), SPI(4), UART(3), USART(3), USB

Diverse connectivity options promote easy integration into complex systems and enhance communication capabilities.

ROM Programmability: FLASH

Flash programming allows for easier updates and extensive modifications of embedded applications.

Terminal Pitch: 0.4 mm

A fine terminal pitch enables higher integration density, vital for modern compact designs.

Format: FLOATING POINT

Floating-point support allows for complex mathematical calculations, enhancing processing capabilities.

Speed: 80 rpm

Operational speed at 80 rpm allows the microcontroller to handle moderate tasks efficiently.

Low Power Mode: YES

Low power modes extend battery life significantly, ideal for IoT and other portable applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width contributes to efficient instruction processing and execution.

No. of I/O Lines: 57

57 I/O lines offer extensive control and interfacing capabilities for various peripherals and sensors.

Technical Specifications

Microcontrollers STM32L476JGY3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

2

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B72

Length:

4.4084 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

57

No. of Terminals:

72

No. of Timers:

17

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA72,9X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

RAM Words:

65536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.7594 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), SAI(2), SPI(4), UART(3), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), LCD, RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32L476JGY3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20