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STM32L471QGI6TR

STMicroelectronics

STM32L471QGI6TR by STMicroelectronics

STM32L471QGI6TR by STMicroelectronics is a 32-bit microcontroller with 26-bit address bus width, 132 terminals, and 1048576 ROM words. It features 2 DAC channels, 19 ADC channels, and peripherals like BOR, CRC, DMA(14), RTC. Ideal for industrial applications requiring a max clock frequency of 48 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,127 parts In-Stock

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11,127

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Digiode

USA . 3,061 parts In-Stock

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3,061

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Anansix

USA . 1,957 parts In-Stock

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1,957

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Semicontronic

India . 168 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

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-

168

$6.000

$5.850

$5.820

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Vigor

Singapore . 4,789 parts In-Stock

1+ parts

$7.550

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4,789

$7.550

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AZTECH Wire

Italy . 379 parts In-Stock

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$18.212

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379

$18.212

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Ampacity Inc.

Singapore . 1,498 parts In-Stock

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$21.000

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$21.000

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IDEA Electronic Components Group

UK . 1,288 parts In-Stock

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$29.326

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$26.393

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$29.326

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$26.393

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Aztec Data Supply Inc.

USA . 2,297 parts In-Stock

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$51.710

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$51.710

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MKK Technologies

India . 1,447 parts In-Stock

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$55.145

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$55.145

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DigiPath Technology Company

USA . 1,447 parts In-Stock

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$55.145

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$55.145

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Corohmni

South Africa . 34 parts In-Stock

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$72.520

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34

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Continental Prestige Electronics

USA . 1,935 parts In-Stock

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Corphita

USA . 1,287 parts In-Stock

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Parana Technologies

USA . 1,097 parts In-Stock

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$35.064

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$35.064

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Argo Parts USA

USA . 586 parts In-Stock

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586

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Advanced Electronics

New Zealand . 70 parts In-Stock

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70

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Discover the STM32L471QGI6TR microcontroller by STMicroelectronics, a top-quality product designed to meet the highest industry standards. With its advanced technology and versatile applications in various industries, this microcontroller offers unparalleled value and benefits to customers. From its efficient connectivity options to its impressive speed and performance, the STM32L471QGI6TR is the perfect choice for your next project. Trust STMicroelectronics to deliver reliable and innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in different power supply configurations.

Address Bus Width: 26

Having a wide address bus allows for large memory addressing capability, which is essential for handling complex tasks and data processing.

Package Shape: SQUARE

The square package shape facilitates easier PCB layout and integration within a compact space.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle larger data sizes and calculations efficiently.

DAC Channels: YES

Having Digital-to-Analog Converter channels allows for the output of analog signals, expanding the range of applications this microcontroller can be used for.

No. of Terminals: 132

With a high number of terminals, this microcontroller offers ample connectivity options for interfacing with various external components and peripherals.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes this microcontroller suitable for industrial applications where temperature fluctuations are common.

ADC Channels: YES

Analog-to-Digital Converter channels enable the microcontroller to read analog sensor data, making it versatile for a wide range of sensor-based applications.

Technical Specifications

Microcontrollers STM32L471QGI6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B132

Length:

7 mm

No. of I/O Lines:

109

No. of Terminals:

132

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), LPUART, SAI(2), SPI(3), SDMMC, SWPMI, UART(2), USART(3)

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(14), PWC, RTC, TIMER(14), TSC, WDT(2)

Analog To Digital Convertors:

19 Ch 12-Bit(3)

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32L471QGI6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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