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STM32L462VEI6TR

STMicroelectronics

STM32L462VEI6TR by STMicroelectronics

STM32L462VEI6TR from STMicroelectronics is a low-power 32-bit microcontroller featuring a Cortex-M4 CPU, with a max clock of 48 MHz. It supports 16 ADC channels and has integrated DMA for efficient data handling. Ideal for industrial applications, it operates b/w -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,602 parts In-Stock

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4,602

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Digiode

USA . 3,719 parts In-Stock

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Anansix

USA . 1,913 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 2,276 parts In-Stock

1+ parts

$5.650

100+ parts

-

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2,276

$5.650

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AZTECH Wire

Italy . 688 parts In-Stock

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$17.250

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688

$17.250

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Microchip USA

USA . 3,969 parts In-Stock

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$18.092

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3,969

$18.092

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IDEA Electronic Components Group

UK . 1,011 parts In-Stock

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$38.370

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$34.533

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1,011

$38.370

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$34.533

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MKK Technologies

India . 813 parts In-Stock

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$72.151

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$72.151

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DigiPath Technology Company

USA . 813 parts In-Stock

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$72.151

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$72.151

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Component Stockers USA

USA . 909 parts In-Stock

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$92.240

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$92.240

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 2,406 parts In-Stock

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Parana Technologies

USA . 88 parts In-Stock

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$45.877

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88

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$45.877

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Overview

Unlock unparalleled performance with the STM32L462VEI6TR microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers robust solutions perfect for IoT devices, wearable tech, and industrial applications. With its ultra-low power consumption, versatile connectivity options, and integrated peripherals, this microcontroller empowers you to create smart, efficient designs—maximizing value and enhancing user experience. Elevate your projects with trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Offers durability and resistance to environmental factors.

Integrated Cache: YES

Improves performance by allowing faster access to frequently used data.

Surface Mount: YES

Enables compact design and easy integration into modern electronics.

Maximum Supply Voltage: 3.6 V

Provides flexibility in design, accommodating various system requirements.

On Chip Data RAM Width: 8

Optimizes data handling for 8-bit applications, enhancing efficiency.

Package Shape: SQUARE

Facilitates efficient layout and space-saving in circuit design.

Bit Size: 32

Supports advanced computing capabilities, making it suitable for complex applications.

DAC Channels: YES

Enables analog signal output, providing versatility for various applications.

No. of Terminals: 100

Allows for extensive connectivity options and peripheral interfacing.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables high-density mounting, essential for modern compact electronic devices.

Minimum Supply Voltage: 1.71 V

Supports low-power applications, ideal for battery-operated devices.

Maximum Operating Temperature: 85 °C

Suitable for high-temperature environments, ensuring reliable operation in demanding conditions.

CPU Family: CORTEX-M4

Offers high performance with low power consumption, ideal for embedded systems.

No. of External Interrupts: 16

Facilitates responsive interactions with external devices, enhancing functionality.

Minimum Operating Temperature: -40 °C

Provides robustness in extreme cold environments, suitable for industrial applications.

ADC Channels: YES

Enables digital conversion of analog signals, essential for sensors and other inputs.

DMA Channels: YES

Allows efficient data transfer without CPU intervention, optimizing processing tasks.

Terminal Position: BOTTOM

Facilitates easy soldering and efficient thermal management.

ROM Words: 524288

Ample storage for firmware and applications, supporting complex program needs.

Maximum Seated Height: 0.6 mm

Ensures compatibility with space-constrained designs while maintaining performance.

Digital To Analog Converters: 1-Ch 12-bit

Delivers high-resolution analog output, catering to precise applications.

RAM Words: 163840

Provides substantial memory for data handling, supporting multifunctional applications.

Width: 7 mm

Compact size allows integration into space-limited designs without sacrificing functionality.

Boundary Scan: YES

Facilitates built-in testing and debugging, enhancing manufacturing reliability.

Peripherals: BOR, COMPARATOR(2), DMA(14), RTC, TIMER(10), WDT(2)

Offers a rich set of peripherals for varied applications, increasing design flexibility.

Maximum Clock Frequency: 48 MHz

Delivers sufficient processing speed for many embedded applications.

Length: 7 mm

Compact physical footprint is ideal for designing miniaturized electronic systems.

Temperature Grade: INDUSTRIAL

Ensures reliability and performance under harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Enhances performance and efficiency, making it suitable for high-speed applications.

No. of Timers: 12

Allows multitasking and complex timing operations, beneficial for sophisticated applications.

RAM Bytes: 163840

Significant memory space supports demanding data processing tasks.

Technology: CMOS

Offers low power consumption and high-speed operation, ideal for portable devices.

Terminal Form: BALL

Enables efficient heat dissipation and compact footprint in circuit boards.

Analog To Digital Converters: 16-Ch 12-Bit

Provides extensive input options with high-resolution conversion, suitable for complex sensors.

Nominal Supply Voltage: 1.8 V

Optimized for low-power operation, extending battery life in portable devices.

No. of DMA Channels: 14

Enhances data throughput and frees CPU resources for other tasks.

PWM Channels: YES

Supports motor control and signal modulation applications, increasing versatility.

Connectivity: CAN, I2C(4), LPUART, QSPI, SAI, SPI(3), SDMMC, UART, USART(3), USB

Provides extensive communication options, facilitating integration into complex systems.

ROM Programmability: FLASH

Allows for easy firmware updates and modifications during the product lifecycle.

Terminal Pitch: 0.5 mm

Facilitates high-density PCB designs, optimizing space utilization.

Format: FLOATING POINT

Enables efficient calculations for complex algorithms, beneficial for signal processing.

Speed: 80 rpm

Indicates the microcontroller's capability for low-speed applications, ensuring smooth operation.

Low Power Mode: YES

Extends battery life in devices by reducing power consumption when idle.

On Chip Program ROM Width: 8

Enhances compatibility with 8-bit instructions, optimizing processing tasks.

No. of I/O Lines: 83

Provides ample interfacing capabilities for peripherals and external components.

Technical Specifications

Microcontrollers STM32L462VEI6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

83

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

163840

RAM Words:

163840

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), LPUART, QSPI, SAI, SPI(3), SDMMC, UART, USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), RTC, TIMER(10), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-bit

Trade Compliance

STM32L462VEI6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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