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STM32L451RCY6TR

STMicroelectronics

STM32L451RCY6TR by STMicroelectronics

STM32L451RCY6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w 1.71V and 3.6V, and includes 16 ADC channels. Ideal for low-power applications, it supports various connectivity options like CAN and I2C. Its compact design ensures efficient performance in industrial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,862 parts In-Stock

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Vyrian

USA . 2,206 parts In-Stock

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Anansix

USA . 1,401 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 2,317 parts In-Stock

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$7.102

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2,317

$7.102

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AZTECH Wire

Italy . 376 parts In-Stock

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$10.120

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376

$10.120

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IDEA Electronic Components Group

UK . 2,299 parts In-Stock

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$14.155

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$12.740

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2,299

$14.155

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$12.740

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MKK Technologies

India . 1,967 parts In-Stock

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$26.618

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1,967

$26.618

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DigiPath Technology Company

USA . 1,967 parts In-Stock

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$26.618

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$26.618

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Component Stockers USA

USA . 705 parts In-Stock

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$99.990

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$99.990

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Corphita

USA . 2,316 parts In-Stock

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Vigor

Singapore . 1,236 parts In-Stock

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Parana Technologies

USA . 742 parts In-Stock

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$16.925

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742

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$16.925

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Overview

Unlock the full potential of your next project with the STM32L451RCY6TR microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics brings you a versatile and energy-efficient solution perfect for industrial and consumer applications. With advanced features like low-power modes and integrated connectivity options, this microcontroller ensures seamless performance while maximizing battery life, making it ideal for IoT devices, smart home solutions, and wearable technology. Elevate your designs with reliability and efficiency today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and protection against environmental factors, making it suitable for various applications.

Integrated Cache: YES

An integrated cache improves data access speeds, leading to enhanced overall performance during processing-intensive tasks.

Surface Mount: YES

Surface mount capability allows for smaller device footprints and makes assembly easier and more cost-effective.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power supplies while maintaining efficient operation.

On Chip Data RAM Width: 8

An 8-bit data RAM width strikes a balance between processing efficiency and resource utilization for a variety of applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space and layout for integration into different circuit boards.

Bit Size: 32

A 32-bit architecture supports advanced computing tasks and larger data operations, catering to high-performance applications.

DAC Channels: YES

Digital-to-Analog Converter (DAC) channels allow for more versatile output controls, enhancing application adaptability.

No. of Terminals: 100

With 100 terminals, this microcontroller offers extensive interfacing options, making it suitable for complex applications.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch and thin profile of the grid array design enable dense circuit layouts without sacrificing performance.

Minimum Supply Voltage: 1.71 V

With a low minimum supply voltage, this microcontroller is energy-efficient, ideal for battery-powered devices.

Maximum Operating Temperature: 85 °C

The ability to operate at elevated temperatures makes it suitable for industrial applications where heat is a factor.

CPU Family: CORTEX-M4

The Cortex-M4 CPU provides optimized performance and efficient power consumption, essential for embedded systems.

No. of External Interrupts: 16

Having 16 external interrupts increases responsiveness to real-world events, enhancing real-time processing capabilities.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold conditions makes it suited for harsh environments or outdoor applications.

ADC Channels: YES

Analog-to-Digital Converter (ADC) channels allow the microcontroller to interact with analog signals, essential for sensor applications.

DMA Channels: YES

The presence of Direct Memory Access (DMA) channels increases efficiency by allowing data transfers without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal positioning can facilitate better thermal management and reduce board space requirements.

ROM Words: 262144

With 262144 ROM words, there is ample space for program storage, making it suitable for complex applications.

Maximum Seated Height: 0.585 mm

A low seated height helps in minimizing the overall device profile, which is essential for compact designs.

Digital To Analog Converters: 1-Ch 12-Bit

A 12-bit DAC channel provides a good resolution for analog output applications, enhancing output quality.

RAM Words: 163840

Additional RAM words allow for better handling of data-heavy applications, improving processing capabilities.

Width: 3.357 mm

A compact width assists in creating smaller, more efficient circuit designs that fit into constrained spaces.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, facilitating easier design validation and production.

Peripherals: BOR, COMPARATOR(2), DMA(14), PWM, RTC, TIMER(10), WDT(2)

A rich set of peripherals expands the microcontroller's functionality, making it versatile for various applications.

Maximum Clock Frequency: 48 MHz

The 48 MHz maximum clock frequency delivers robust processing power while maintaining energy efficiency.

Length: 3.657 mm

A short length contributes to a smaller overall device size, which is crucial for space-constrained applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliable performance in challenging environments, suitable for industrial automation.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC architecture provides efficient processing capabilities, making it a strong choice for embedded systems.

No. of Timers: 12

Having 12 timers allows for precise timing control in applications like motor control and signal processing.

RAM Bytes: 163840

A substantial amount of RAM supports complex processes and multi-tasking, essential for advanced applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for portable applications.

Terminal Form: BALL

Ball terminal form allows for easier mounting and soldering, increasing reliability in connection.

Analog To Digital Convertors: 16-Ch 12-Bit

With 16 channels, this microcontroller can handle multiple analog input signals, increasing application versatility.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V balances performance with low power requirements, suitable for energy-sensitive designs.

No. of DMA Channels: 14

Having 14 DMA channels enhances data transfer capabilities, allowing for increased system efficiency.

PWM Channels: YES

PWM channels enable precise control over motors and other devices, enhancing the capability in control applications.

Connectivity: CAN, I2C(4), LPUART, QSPI, SAI, SDMMC, SPI(3), UART, USART(3), USB

Diverse connectivity options allow for integration into various systems and facilitate communication with multiple devices.

ROM Programmability: FLASH

Flash programmability offers ease of updating firmware, making maintenance and upgrades simpler.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch is optimal for fine-pitch applications, enhancing connection density while reducing size.

Format: FLOATING POINT

The support for floating-point format enhances mathematical computations, crucial for applications requiring high precision.

Speed: 80 rpm

A speed of 80 rpm indicates reliable performance in controlled applications, suitable for various robotic tasks.

Low Power Mode: YES

Low power mode extends battery life and increases efficiency, making it ideal for portable and IoT devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width enhances compatibility with various code architectures, promoting versatility.

No. of I/O Lines: 83

With 83 I/O lines, this microcontroller can manage a large number of peripherals, allowing for extensive interfacing possibilities.

Technical Specifications

Microcontrollers STM32L451RCY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B64

Length:

3.657 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

83

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

163840

RAM Words:

163840

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.357 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), LPUART, QSPI, SAI, SDMMC, SPI(3), UART, USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), PWM, RTC, TIMER(10), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32L451RCY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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