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STM32L451RCT3TR

STMicroelectronics

STM32L451RCT3TR by STMicroelectronics

STM32L451RCT3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. Ideal for automotive applications, it supports low power modes and offers extensive connectivity options. With integrated cache and up to 48 MHz clock speed, it's perfect for efficient processing tasks.

Median Price

$8.280

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 350 parts In-Stock

1+ parts

$8.280

100+ parts

$4.790

1k+ parts

$3.650

10k+ parts

-

350

$8.280

$4.790

$3.650

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,517 parts In-Stock

1+ parts

$6.555

100+ parts

-

1k+ parts

-

10k+ parts

-

3,517

$6.555

-

-

-

Vyrian

USA . 6,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,393

-

-

-

-

Anansix

USA . 1,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,690

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,648 parts In-Stock

1+ parts

$6.210

100+ parts

-

1k+ parts

-

10k+ parts

-

4,648

$6.210

-

-

-

Microchip USA

USA . 4,534 parts In-Stock

1+ parts

$14.791

100+ parts

-

1k+ parts

-

10k+ parts

-

4,534

$14.791

-

-

-

IDEA Electronic Components Group

UK . 389 parts In-Stock

1+ parts

$23.684

100+ parts

-

1k+ parts

$21.316

10k+ parts

-

389

$23.684

-

$21.316

-

MKK Technologies

India . 1,041 parts In-Stock

1+ parts

$44.537

100+ parts

-

1k+ parts

-

10k+ parts

-

1,041

$44.537

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-

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DigiPath Technology Company

USA . 1,041 parts In-Stock

1+ parts

$44.537

100+ parts

-

1k+ parts

-

10k+ parts

-

1,041

$44.537

-

-

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Parana Technologies

USA . 1,446 parts In-Stock

1+ parts

-

100+ parts

$28.318

1k+ parts

-

10k+ parts

-

1,446

-

$28.318

-

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Overview

Unlock the potential of your next project with the STM32L451RCT3TR microcontroller from STMicroelectronics—an industry leader renowned for innovation and reliability. Designed for low-power applications, this high-performance chip seamlessly integrates advanced features like multiple ADC channels and rich connectivity options, making it perfect for IoT, automotive, and industrial solutions. Elevate your product's efficiency and longevity with a trusted partner in technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making this microcontroller suitable for various applications.

Integrated Cache: YES

The presence of an integrated cache enhances data retrieval speeds, improving overall processing performance.

Surface Mount: YES

Surface mount technology allows for compact design and easy assembly on printed circuit boards, which is ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V helps to ensure compatibility with a wide range of power sources, adding flexibility in circuit design.

On Chip Data RAM Width: 8

An 8-bit RAM width allows for efficient data manipulation in embedded systems, making it suitable for a variety of tasks.

Package Shape: SQUARE

The square package shape enables efficient layout and design in electronic circuits, promoting thoughtful space utilization.

Bit Size: 32

A 32-bit architecture allows for superior performance and the ability to handle complex computations and data types.

DAC Channels: YES

With DAC channels available, this microcontroller supports high-quality analog signal output for various applications, including audio and control systems.

No. of Terminals: 64

Having 64 terminals provides extensive connectivity options, making it versatile for different interfacing needs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style contributes to a smaller footprint and ease of integration into compact systems.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage allows for operation in energy-sensitive applications, emphasizing efficiency.

Maximum Operating Temperature: 125 °C

The high operating temperature range makes this microcontroller suitable for harsh environments, such as automotive or industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 family provides high performance with low power consumption, suitable for complex processing tasks while maintaining efficiency.

No. of External Interrupts: 16

With 16 external interrupts, this microcontroller can handle multiple tasks and events effectively, improving responsiveness in applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures reliable performance in cold environments, suitable for various industrial applications.

ADC Channels: YES

Integrated ADC channels facilitate monitoring and processing of analog signals, enhancing usability in sensor applications.

DMA Channels: YES

Dedicated DMA channels help optimize data transfers without CPU intervention, improving overall system efficiency.

Terminal Position: QUAD

Quad terminal positioning allows for easier soldering and layout on PCB, making assembly more straightforward.

ROM Words: 262144

A large ROM capacity allows for extensive program storage, enabling more complex applications and functionality.

Maximum Seated Height: 1.6 mm

The low seated height enhances compatibility with compact designs and helps in maintaining a low profile.

Digital To Analog Converters: 1-Ch 12-Bit

A 12-bit DAC provides high-resolution analog output, which is crucial for precise control applications.

RAM Words: 163840

Ample RAM capacity allows for complex data manipulation and storage, supporting sophisticated algorithms effectively.

Width: 10 mm

The compact width allows for versatile placement options on printed circuit boards, making it adaptable to various designs.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of circuit boards, reducing production time and improving reliability.

Peripherals: BOR, COMPARATOR(2), DMA(14), PWM, RTC, TIMER(10), WDT(2)

An extensive array of peripherals offers a wide range of functionalities, enabling integration in diverse application scenarios.

Maximum Clock Frequency: 48 MHz

A clock frequency of 48 MHz allows for fast processing and execution of tasks, enhancing overall performance.

Length: 10 mm

This length fits snugly into various enclosure designs, helping maintain a compact product profile.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability in demanding conditions and safety-critical applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances performance and efficiency, making it suitable for resource-constrained environments.

No. of Timers: 12

Having 12 timers allows for sophisticated timing operations, essential for multitasking and precise event management.

RAM Bytes: 163840

A generous amount of RAM supports advanced applications with multiple active processes or data sets.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull-wing terminal form provides a stable solder joint, enhancing reliability in manufacturing and operation.

Analog To Digital Converters: 16-Ch 12-Bit

With 16 channels of 12-bit ADCs, this microcontroller can handle multiple sensors simultaneously, ideal for complex monitoring systems.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V balances performance and efficiency, suitable for low-power designs.

No. of DMA Channels: 14

Having 14 DMA channels facilitates efficient data handling without burdening the CPU, enhancing processing capabilities.

PWM Channels: YES

PWM capability allows for precise control over motor speeds and lighting, essential in automation and control applications.

Connectivity: CAN, I2C(4), LPUART, QSPI, SAI, SDMMC, SPI(3), UART, USART(3), USB

Rich connectivity options ensure seamless integration with a wide range of devices and communication protocols.

ROM Programmability: FLASH

Flash programmability enables easy updates and firmware changes, enhancing the longevity and adaptability of the device.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for compact layouts while maintaining usability and minimizing the risk of short circuits.

Format: FLOATING POINT

Floating point support enables the handling of complex mathematical calculations with high precision, ideal for DSP applications.

Speed: 80 rpm

Low-speed operation within 80 rpm makes it suitable for applications requiring gradual, controlled movement.

Low Power Mode: YES

Low power mode extends battery life in portable applications and reduces power consumption in stationary devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports essential data handling in embedded systems, making it efficient for embedded software.

No. of I/O Lines: 52

52 I/O lines provide extensive interfacing capabilities, enabling integration with various peripherals and components.

Technical Specifications

Microcontrollers STM32L451RCT3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

163840

RAM Words:

163840

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), LPUART, QSPI, SAI, SDMMC, SPI(3), UART, USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), PWM, RTC, TIMER(10), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32L451RCT3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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