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STM32L451RCT3

STMicroelectronics

STM32L451RCT3 by STMicroelectronics

STM32L451RCT3 microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 125 °C, and supports up to 48 MHz clock speed. With 16 ADC channels and low power modes, it's ideal for battery-operated devices. Its compact design and multiple connectivity options make it versatile for IoT applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Verical

USA . 760 parts In-Stock

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760

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Vyrian

USA . 8,090 parts In-Stock

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8,090

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Digiode

USA . 586 parts In-Stock

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586

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Anansix

USA . 134 parts In-Stock

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134

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Distributors (Availability)

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Vigor

Singapore . 1,897 parts In-Stock

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$4.620

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1,897

$4.620

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Microchip USA

USA . 1,963 parts In-Stock

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$14.791

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1,963

$14.791

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AZTECH Wire

Italy . 601 parts In-Stock

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$16.540

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601

$16.540

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IDEA Electronic Components Group

UK . 2,276 parts In-Stock

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$36.855

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$33.170

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2,276

$36.855

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$33.170

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Component Stockers USA

USA . 2,236 parts In-Stock

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$53.210

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2,236

$53.210

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MKK Technologies

India . 1,069 parts In-Stock

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$69.304

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1,069

$69.304

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DigiPath Technology Company

USA . 1,069 parts In-Stock

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$69.304

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1,069

$69.304

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Parana Technologies

USA . 1,867 parts In-Stock

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$44.066

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1,867

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$44.066

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Glotronic Ltd.

UK . 608 parts In-Stock

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Corphita

USA . 315 parts In-Stock

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Overview

Elevate your projects with the STM32L451RCT3 microcontroller from STMicroelectronics, renowned for its exceptional quality and reliability. Designed to power innovative applications ranging from wearables to smart home devices, this low-power MCU excels in performance while minimizing energy consumption. Experience the advantage of seamless connectivity and integrated peripherals that simplify design, ultimately enhancing your product's efficiency and effectiveness. Choose STM32L451RCT3 for unmatched performance and remarkable value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V is suitable for many battery-operated applications, ensuring energy efficiency.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient processing and managing of data for various applications.

Package Shape: SQUARE

The square package shape facilitates uniform mounting on printed circuit boards, optimizing space.

Bit Size: 32

The 32-bit architecture enhances computational power, enabling the execution of complex algorithms.

DAC Channels: YES

Integrated DAC channels provide superior signal processing capabilities for audio and control applications.

No. of Terminals: 64

With 64 terminals, the microcontroller offers multiple connection points, allowing for versatility in design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile design minimizes height and fits well in compact electronic devices.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage enhances compatibility with a variety of power sources, including batteries.

Maximum Operating Temperature: 125 °C

This microcontroller can operate in high-temperature environments, making it suitable for industrial applications.

CPU Family: CORTEX-M4

Belonging to the efficient Cortex-M4 family, this microcontroller balances performance and power consumption.

No. of External Interrupts: 16

Multiple external interrupts allow for responsive interactions with external devices and sensors.

Minimum Operating Temperature: -40 °C

A wide operating temperature range makes this product suitable for harsh environments.

ADC Channels: YES

Integrated ADC channels enable accurate sensing and data conversion from analog to digital formats.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency, allowing for faster processing without CPU overhead.

Terminal Position: QUAD

Quad terminal positioning offers flexible layout options, facilitating easier PCB routing.

ROM Words: 262144

A large ROM capacity supports complex application codes and allows for extensive firmware updates.

Maximum Seated Height: 1.6 mm

The low seated height is ideal for low-profile designs, contributing to space-saving in multilayer PCBs.

Digital To Analog Convertors: 1-Ch 12-Bit

A 12-bit DAC provides high-resolution output, enabling smoother signal transitions and better audio performance.

Width: 10 mm

A compact width of 10 mm is well-suited for space-constrained applications.

Boundary Scan: YES

Boundary scan capabilities allow for easier testing and debugging of PCBs, enhancing product reliability.

Peripherals: BOR, COMPARATOR(2), DMA(14), PVD, PVM, PWM, RTC, TEMPERATURE SENSOR, TIMER(9), WDT(2)

A rich set of peripherals enhances flexibility and functionality, making it adaptable for various applications.

Maximum Clock Frequency: 48 MHz

A clock frequency of 48 MHz allows for rapid processing, efficient computation, and responsive system performance.

Length: 10 mm

The 10 mm length aids in compact designs, making it suitable for small-scale electronics.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-based microcontroller, it offers high performance with low power consumption.

No. of Timers: 12

The presence of 12 timers supports advanced timing operations, crucial for real-time control systems.

RAM Bytes: 163840

A significant RAM capacity allows for efficient execution of data-heavy applications without bottlenecks.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy mounting and soldering, ensuring reliable connections.

Analog To Digital Convertors: 16-Ch 12-Bit

The 16-channel, 12-bit ADC enables high precision in data acquisition and makes it suitable for sensor applications.

Maximum Supply Current: 11.5 mA

Low supply current enhances energy efficiency, extending battery life in portable applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V optimally balances power consumption and system performance.

No. of DMA Channels: 14

An extensive number of DMA channels allows for smoother data handling and processing capabilities.

No. of Serial I/Os: 5

Multiple serial I/O options provide connectivity versatility, enabling communication with various peripherals.

PWM Channels: YES

The inclusion of PWM channels allows for precise control of motors and other devices requiring modulation.

Connectivity: CAN, I2C(4), LPUART, QSPI, SAI, SPI(3), UART, USART(3)

Diverse connectivity options ensure compatibility with various communication protocols, enhancing the microcontroller’s versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updating and modifying of the firmware, enhancing product longevity.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch ensures fine pitch flexibility in PCB designs, catering to modern manufacturing standards.

Format: FLOATING POINT

The floating-point support allows for efficient handling of complex mathematical calculations common in advanced applications.

Speed: 80 rpm

Operating at 80 rpm indicates good responsiveness for control applications requiring swift actuations.

Low Power Mode: YES

The low power mode feature helps to conserve energy during inactivity, making it ideal for battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit ROM width facilitates effective storage and execution of programs with lower overhead.

No. of I/O Lines: 52

With 52 I/O lines available, this microcontroller can interface with multiple devices, sensors, and actuators.

Technical Specifications

Microcontrollers STM32L451RCT3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Serial I/Os:

5

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

163840

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

11.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), LPUART, QSPI, SAI, SPI(3), UART, USART(3)

Peripherals:

BOR, COMPARATOR(2), DMA(14), PVD, PVM, PWM, RTC, TEMPERATURE SENSOR, TIMER(9), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32L451RCT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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