Loading...

STM32L451CCU3TR

STMicroelectronics

STM32L451CCU3TR by STMicroelectronics

STM32L451CCU3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 125 °C, and supports low power modes. It includes 14 DMA channels and multiple connectivity options like CAN and USB. Ideal for automotive applications, it combines performance with energy efficiency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,091

-

-

-

-

Digiode

USA . 4,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,331

-

-

-

-

Anansix

USA . 355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

355

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,291 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

1,291

$4.170

-

-

-

AZTECH Wire

Italy . 448 parts In-Stock

1+ parts

$21.550

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$21.550

-

-

-

Microchip USA

USA . 6,450 parts In-Stock

1+ parts

$31.146

100+ parts

-

1k+ parts

-

10k+ parts

-

6,450

$31.146

-

-

-

IDEA Electronic Components Group

UK . 1,963 parts In-Stock

1+ parts

$40.633

100+ parts

-

1k+ parts

$36.569

10k+ parts

-

1,963

$40.633

-

$36.569

-

MKK Technologies

India . 1,553 parts In-Stock

1+ parts

$76.407

100+ parts

-

1k+ parts

-

10k+ parts

-

1,553

$76.407

-

-

-

DigiPath Technology Company

USA . 1,553 parts In-Stock

1+ parts

$76.407

100+ parts

-

1k+ parts

-

10k+ parts

-

1,553

$76.407

-

-

-

Eastek

USA . 52,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

52,500

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Parana Technologies

USA . 2,377 parts In-Stock

1+ parts

-

100+ parts

$48.583

1k+ parts

-

10k+ parts

-

2,377

-

$48.583

-

-

Corphita

USA . 1,754 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,754

-

-

-

-

Overview

Unlock the power of innovation with the STM32L451CCU3TR microcontroller from STMicroelectronics. Renowned for exceptional quality and reliability, STMicroelectronics delivers cutting-edge technology ideal for energy-efficient applications ranging from IoT devices to automotive solutions. Experience seamless integration, robust performance, and a plethora of connectivity options, empowering your projects while maximizing efficiency and longevity. Elevate your designs with this versatile chip that embodies excellence!

Feature Benefit Bullets

Integrated Cache: YES

The presence of an integrated cache enhances the performance by reducing the time it takes to access frequently used data, making the microcontroller suitable for high-speed applications.

Surface Mount: YES

Being a surface mount device allows for a compact design, facilitating space-saving in PCB layout and ease of automation in manufacturing.

Maximum Supply Voltage: 3.6 V

The microcontroller can operate at a maximum supply voltage of 3.6V, making it compatible with a wide range of power sources and applications.

On Chip Data RAM Width: 8

The 8-bit data RAM width provides efficient data handling for embedded applications, allowing for simpler byte-oriented operations.

Package Shape: SQUARE

The square package shape aids in heat dissipation and provides a symmetrical layout for efficient PCB design.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and address larger memory spaces effectively.

DAC Channels: YES

The inclusion of DAC channels allows for smooth analog output control, which is essential in applications requiring precise signal generation.

No. of Terminals: 48

With 48 terminals, it offers adequate GPIO pins to support numerous peripherals, enhancing versatility in design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style provides excellent thermal management potential, crucial for automotive applications where heat can be a concern.

Minimum Supply Voltage: 1.71 V

Operating down to 1.71V allows for low-power applications, making it ideal for battery-operated devices.

Maximum Operating Temperature: 125 °C

This high maximum operating temperature rating ensures reliability and performance in extreme environmental conditions, particularly in automotive settings.

CPU Family: CORTEX-M4

The Cortex-M4 core allows for efficient signal processing and better performance in a range of applications, from automotive to industrial.

No. of External Interrupts: 16

Having 16 external interrupts enables the microcontroller to respond promptly to different external events, enhancing its responsiveness.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, it is designed to function reliably in harsh environments, perfect for industrial and automotive applications.

ADC Channels: YES

The presence of ADC channels facilitates easy integration of analog sensors, enhancing flexibility in application development.

DMA Channels: YES

Having DMA channels allows for high-speed data transfer without CPU intervention, improving efficiency in data-intensive applications.

Terminal Position: QUAD

The quad terminal position provides robust connections for mounting, contributing to the reliability of the microcontroller in various applications.

ROM Words: 262144

A substantial amount of ROM enables the storage of larger programs and data, suitable for complex applications.

Maximum Seated Height: 0.6 mm

The low seated height allows for a slim design, making it ideal for space-constrained applications.

Digital To Analog Convertors: 1-Ch 12-Bit

The 12-bit resolution in the DAC provides high precision in signal representation, crucial for applications requiring fine control.

RAM Words: 163840

With 163840 words of RAM, it can support complex applications requiring significant data manipulation without compromising performance.

Width: 7 mm

A compact width of 7 mm makes this microcontroller suitable for use in small electronic devices.

Boundary Scan: YES

Boundary scan capability allows for easier debugging and testing, improving reliability and reducing time to market.

Peripherals: BOR, COMPARATOR(2), DMA(14), PWM, RTC, TIMER(10), WDT(2)

A wide range of peripherals enhances the microcontroller’s functionality, making it versatile for various application needs.

Maximum Clock Frequency: 48 MHz

With a maximum clock frequency of 48 MHz, it delivers adequate processing speed for most real-time applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller ensures reliability and durability in vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides efficient instruction execution, which is essential for performance-critical embedded systems.

No. of Timers: 12

Having multiple timers allows for precise timing operations, which is often required in control applications.

RAM Bytes: 163840

This large amount of RAM facilitates complex computation and data processing needs, enhancing the microcontroller's capability.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption alongside higher speeds, making it energy-efficient.

Terminal Form: NO LEAD

The no-lead terminal form factor promotes a smaller footprint and minimizes PCB space usage.

Analog To Digital Convertors: 10-Ch 12-Bit

The 10-channel 12-bit ADC allows for multiple simultaneous analog inputs, enhancing flexibility in sensor applications.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8V optimizes energy efficiency, crucial for battery-operated devices.

No. of DMA Channels: 14

Having 14 DMA channels improves data transfer rates, freeing up CPU resources for other tasks.

PWM Channels: YES

PWM channels allow for efficient motor control and analog signal simulation, crucial in various applications such as robotics.

Connectivity: CAN, I2C(4), LPUART, QSPI, SAI, SPI(3), UART, USART(3), USB

Robust connectivity options ensure compatibility with numerous peripheral devices, enhancing integration opportunities in diverse applications.

ROM Programmability: FLASH

The use of flash memory allows for reprogrammability, providing flexibility for application updates and improvements.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for higher component density on PCBs, making it suitable for compact designs.

Format: FLOATING POINT

The floating-point format enables the processing of a wider range of numerical values, crucial for complex mathematical calculations.

Speed: 80 rpm

Though primarily a microcontroller, specified speed of 80 rpm suggests suitability for timing-based applications.

Low Power Mode: YES

Low power mode extends battery life in portable applications by reducing energy consumption during idle periods.

On Chip Program ROM Width: 8

The 8-bit width in the program ROM facilitates efficient storage and execution of application code.

No. of I/O Lines: 38

With 38 I/O lines, it provides ample options for interacting with external devices, fostering support for complex functionalities.

Technical Specifications

Microcontrollers STM32L451CCU3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

163840

RAM Words:

163840

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), LPUART, QSPI, SAI, SPI(3), UART, USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), PWM, RTC, TIMER(10), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32L451CCU3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20