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STM32L443RCY6TR

STMicroelectronics

STM32L443RCY6TR by STMicroelectronics

STM32L443RCY6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w 1.71V and 3.6V, and supports up to 48 MHz clock speed. With integrated DAC, ADC channels, and low power modes, it's ideal for industrial applications. Its compact design includes 64 terminals in a very thin profile package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 40,000 parts In-Stock

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ComSIT USA

USA . 40,000 parts In-Stock

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Vyrian

USA . 7,751 parts In-Stock

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7,751

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Digiode

USA . 2,281 parts In-Stock

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Anansix

USA . 2,037 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 40 parts In-Stock

1+ parts

$5.700

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40

$5.700

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AZTECH Wire

Italy . 549 parts In-Stock

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$9.210

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549

$9.210

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IDEA Electronic Components Group

UK . 335 parts In-Stock

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$30.614

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$27.553

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335

$30.614

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$27.553

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MKK Technologies

India . 1,748 parts In-Stock

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$57.567

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1,748

$57.567

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DigiPath Technology Company

USA . 1,748 parts In-Stock

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$57.567

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1,748

$57.567

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 3,370 parts In-Stock

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3,370

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Parana Technologies

USA . 328 parts In-Stock

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$36.604

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328

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$36.604

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Overview

Unlock the potential of your next project with the STM32L443RCY6TR microcontroller from STMicroelectronics. Renowned for their excellence, STMicroelectronics delivers a powerful 32-bit ARM Cortex-M4 core designed for energy efficiency and high performance. Perfect for IoT applications, wearables, and industrial controls, this compact marvel enables seamless integration and cutting-edge functionality while minimizing power consumption—empowering you to innovate without limits!

Feature Benefit Bullets

Package Body Material: PLASTIC

Plastic packaging is lightweight and cost-effective, making this microcontroller suitable for a variety of applications, including consumer electronics.

Integrated Cache: YES

Having an integrated cache allows for faster access to frequently used data, optimizing performance in processing tasks.

Surface Mount: YES

Surface mount technology facilitates easier manufacturing and smaller footprints on PCBs, ideal for compact designs.

Maximum Supply Voltage: 3.6 V

The voltage range ensures compatibility with various power supplies, making it a versatile choice for low-power applications.

On Chip Data RAM Width: 8

An 8-bit RAM width provides adequate data handling capabilities for many embedded applications.

Package Shape: RECTANGULAR

Rectangular packaging can optimize PCB space utilization and improve thermal management.

Bit Size: 32

A 32-bit architecture delivers more processing power and allows for more advanced computations and larger memory addressing.

DAC Channels: YES

The inclusion of DAC channels enables the microcontroller to generate analog signals, expanding its functionality in various applications.

No. of Terminals: 64

A higher number of terminals allows for more I/O options, enhancing flexibility in peripheral connections and expansions.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high density and pin count, contributing to a compact and efficient board design.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage allows the microcontroller to operate effectively in battery-powered or energy-constrained applications.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C makes it suitable for industrial applications where heat dissipation can be an issue.

CPU Family: CORTEX-M4

The ARM Cortex-M4 core facilitates high-performance calculations and digital signal processing, making it ideal for advanced applications.

No. of External Interrupts: 16

With 16 external interrupts, the microcontroller can efficiently respond to multiple events, enhancing its real-time capabilities.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliability in extreme environmental conditions, suitable for industrial uses.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with sensors and convert analog signals to digital form for processing.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory without CPU intervention, improving performance.

Terminal Position: BOTTOM

Bottom terminal positions can be beneficial for heat dissipation and simplified PCB design.

ROM Words: 262144

A large ROM capacity allows for substantial program storage, accommodating complex firmware and applications.

Maximum Seated Height: 0.576 mm

A low seated height contributes to profile efficiency in applications requiring slim designs.

RAM Words: 16384

Adequate RAM size allows for efficient data processing and storage during program execution.

Width: 3.127 mm

A compact width enables space-saving in device designs, especially for portable applications.

Boundary Scan: YES

This feature enhances testability and debugging capabilities, leading to quicker development cycles.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz allows for high-speed processing, essential for time-sensitive applications.

Length: 3.141 mm

A short length facilitates denser PCB layout, maximizing available space for other components.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature ratings confirm robustness for use in demanding environments and applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture is known for its efficiency, making it suitable for power-sensitive applications.

No. of Timers: 11

Multiple timers can handle various tasks such as timing, event scheduling, and PWM generation, increasing versatility.

RAM Bytes: 65536

Having 64KB of RAM supports effective multitasking and simultaneous data processing for complex applications.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for portable battery-operated devices.

Terminal Form: BALL

Ball terminal configurations allow for high-density packaging and can improve thermal performance.

Maximum Supply Current: 9.8 mA

With a maximum supply current of 9.8 mA, the microcontroller is suitable for low-power applications without excessive drain on resources.

Nominal Supply Voltage: 3 V

The nominal supply voltage allows for standard power supply design, facilitating ease of integration into existing systems.

No. of DMA Channels: 14

14 DMA channels enhance data handling efficiency, allowing for complex data operations without CPU bottlenecks.

PWM Channels: YES

PWM channels facilitate motor control and other applications requiring variable signal outputs, adding to the device's functionality.

ROM Programmability: FLASH

Flash memory allows for reprogramming and field updates, enhancing flexibility and lifespan of the device.

Terminal Pitch: 0.35 mm

A terminal pitch of 0.35 mm enables denser layouts which save space and are crucial for modern compact devices.

Format: FLOATING POINT

Support for floating-point operations allows for more complex calculations necessary in advanced applications such as signal processing.

Speed: 80 rpm

The operational speed can be beneficial in applications where timing and response are critical.

Low Power Mode: YES

Low power modes allow the microcontroller to conserve energy during inactivity, making it suitable for battery-powered devices.

On Chip Program ROM Width: 8

8-bit program ROM width provides sufficient data pathways for program instructions, optimizing execution speed.

No. of I/O Lines: 52

A total of 52 I/O lines allows for extensive interfacing options, making it easy to connect various peripherals and sensors.

Technical Specifications

Microcontrollers STM32L443RCY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B64

Length:

3.141 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC

Package Code:

Package Equivalence Code:

BGA64,8x8,14

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

65536

RAM Words:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.576 mm

Speed:

80 rpm

Maximum Supply Current:

9.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.127 mm

Peripheral IC Type:

Trade Compliance

STM32L443RCY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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