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STM32L443CCT6TR

STMicroelectronics

STM32L443CCT6TR by STMicroelectronics

STM32L443CCT6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU family, offering 262144 ROM words and 16384 RAM words. It features 48 MHz max clock frequency, 16 external interrupts, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$3.773

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,748 parts In-Stock

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7,748

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IBS Electronics

USA . 4,000 parts In-Stock

1+ parts

-

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$3.773

1k+ parts

-

10k+ parts

$3.590

4,000

-

$3.773

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$3.590

Anansix

USA . 1,266 parts In-Stock

1+ parts

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1,266

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Digiode

USA . 1,023 parts In-Stock

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1,023

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Distributors (Availability)

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AZTECH Wire

Italy . 574 parts In-Stock

1+ parts

$11.560

100+ parts

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574

$11.560

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Ampacity Inc.

Singapore . 1,222 parts In-Stock

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$13.000

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1,222

$13.000

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Semicontronic

India . 1,176 parts In-Stock

1+ parts

$28.000

100+ parts

$27.300

1k+ parts

$27.160

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-

1,176

$28.000

$27.300

$27.160

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Microchip USA

USA . 7,150 parts In-Stock

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$28.514

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7,150

$28.514

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Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$41.129

100+ parts

$39.072

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$39.072

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650

$41.129

$39.072

$39.072

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Corohmni

South Africa . 339 parts In-Stock

1+ parts

$55.673

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339

$55.673

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IDEA Electronic Components Group

UK . 1,246 parts In-Stock

1+ parts

$74.142

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$66.728

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$74.142

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$66.728

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Aztec Data Supply Inc.

USA . 2,917 parts In-Stock

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$79.480

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2,917

$79.480

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MKK Technologies

India . 2,334 parts In-Stock

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$139.419

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2,334

$139.419

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DigiPath Technology Company

USA . 2,334 parts In-Stock

1+ parts

$139.419

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2,334

$139.419

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Continental Prestige Electronics

USA . 5,069 parts In-Stock

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5,069

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Corphita

USA . 2,906 parts In-Stock

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Argo Parts USA

USA . 1,886 parts In-Stock

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1,886

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Parana Technologies

USA . 2 parts In-Stock

1+ parts

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100+ parts

$88.648

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2

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$88.648

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Overview

Discover the STM32L443CCT6TR by STMicroelectronics, a top-tier microcontroller that offers exceptional performance and reliability. Crafted by a renowned manufacturer, this microcontroller is perfect for a wide range of applications in various industries. With integrated cache, low power mode, and advanced technology, this product provides unmatched value and benefits to customers. Experience seamless operation, high efficiency, and innovative features with the STM32L443CCT6TR, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC

Plastic package body makes the microcontroller lightweight and durable, suitable for various applications.

Integrated Cache: YES

Integrated cache improves the performance and efficiency of the microcontroller by reducing the access time to frequently used data.

Surface Mount: YES

Surface mount packaging allows for easy and compact integration of the microcontroller into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V provides flexibility in power supply options and compatibility with a wide range of systems.

On Chip Data RAM Width: 8

8-bit wide on-chip data RAM allows for efficient handling of data operations, contributing to the performance of the microcontroller.

Package Shape: SQUARE

Square package shape ensures uniformity in footprint and facilitates easy placement on circuit boards for streamlined design layout.

Bit Size: 32

32-bit architecture enables the microcontroller to process data and perform operations with higher precision and efficiency compared to lower bit sizes.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog components and sensors, expanding its capabilities for diverse applications.

No. of Terminals: 48

48 terminals provide ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package style offers a compact and space-saving design suitable for compact electronic devices.

Minimum Supply Voltage: 1.71 V

Support for a minimum supply voltage of 1.71 V allows for energy-efficient operation and compatibility with low-power systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in harsh environmental conditions and industrial settings.

CPU Family: CORTEX-M4

Inclusion of the Cortex-M4 CPU family offers high performance, energy efficiency, and advanced features for processing tasks efficiently.

No. of External Interrupts: 16

16 external interrupts enable the microcontroller to respond to external events promptly, improving real-time responsiveness and interrupt handling capabilities.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable operation in extreme cold environments, expanding the applicability of the microcontroller.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to convert analog signals into digital data, facilitating sensor interfacing and signal processing.

DMA Channels: YES

Direct memory access channels enhance data transfer speeds and efficiency by allowing peripherals to transfer data to and from memory without CPU intervention.

Terminal Position: QUAD

Quad terminal positioning simplifies the integration and connection of the microcontroller on the circuit board, ensuring efficient signal routing and ease of assembly.

ROM Words: 262144

Large ROM capacity of 262144 words provides ample space for storing program code and firmware, accommodating complex applications and algorithms.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6 mm enables a slim profile design for the microcontroller, suitable for compact electronic devices with space constraints.

RAM Words: 16384

Generous RAM capacity of 16384 words allows for efficient data storage and manipulation during program execution, enhancing overall performance and multitasking capabilities.

Width: 7 mm

Compact width of 7 mm facilitates space-efficient placement of the microcontroller on the circuit board, enabling compact and streamlined electronic designs.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of the microcontroller during manufacturing and development, ensuring product quality and reliability.

Maximum Clock Frequency: 48 MHz

High maximum clock frequency of 48 MHz provides fast processing speeds and responsiveness for time-critical applications, enhancing overall system performance.

Length: 7 mm

Compact length of 7 mm contributes to the small form factor of the microcontroller, allowing for space-efficient integration in electronic devices with size constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation and durability in harsh industrial environments with extreme temperature fluctuations and environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC (Reduced Instruction Set Computing) architecture, it offers high performance, energy efficiency, and streamlined instruction execution for optimized operation.

No. of Timers: 11

11 timers provide versatile timing and scheduling capabilities for managing various tasks and operations, enhancing the microcontroller's efficiency and functionality.

RAM Bytes: 65536

Large RAM capacity of 65536 bytes enables efficient data storage and manipulation during program execution, supporting multitasking and complex processing requirements.

Technology: CMOS

CMOS (Complementary Metal-Oxide-Semiconductor) technology offers low power consumption, high noise immunity, and reliable operation for energy-efficient and stable performance.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and connection of the microcontroller to the circuit board, ensuring secure electrical contact and robust mechanical support.

Maximum Supply Current: 9.8 mA

Low maximum supply current of 9.8 mA contributes to energy efficiency and helps reduce power consumption during operation, making it suitable for battery-powered devices.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3 V ensures consistent and reliable operation of the microcontroller, supporting optimal performance and compatibility with standard power sources.

No. of DMA Channels: 14

Availability of 14 DMA channels enhances data transfer efficiency and offloads data handling tasks from the CPU, improving overall system performance and responsiveness.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog outputs and motor speed, making the microcontroller suitable for applications requiring accurate voltage and current regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and versatile updating of firmware and software, enabling flexible customization and maintenance of the microcontroller's functionality.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm facilitates high-density mounting and connection of the microcontroller on the circuit board, supporting compact and miniaturized electronic designs.

Format: FLOATING POINT

Floating-point format support enables accurate and efficient numerical computations and processing, enhancing the microcontroller's versatility for applications requiring complex mathematical operations.

Speed: 80 rpm

Speed rating of 80 rpm denotes the maximum processing speed of the microcontroller, indicating rapid data processing capabilities for time-sensitive tasks and applications.

Low Power Mode: YES

Low-power mode capability allows the microcontroller to operate efficiently at reduced power consumption levels, extending battery life and enabling energy-efficient operation.

On Chip Program ROM Width: 8

8-bit wide on-chip program ROM allows for efficient storage and retrieval of program instructions, contributing to smooth and reliable operation of the microcontroller.

No. of I/O Lines: 38

38 I/O lines provide extensive input and output connectivity for interfacing with external devices and peripherals, enabling versatile communication and control capabilities.

Technical Specifications

Microcontrollers STM32L443CCT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

65536

RAM Words:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

9.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L443CCT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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