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STM32L433VCI6TR

STMicroelectronics

STM32L433VCI6TR by STMicroelectronics

STM32L433VCI6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w 1.71V and 3.6V, and includes 16 ADC channels for versatile applications. With integrated DMA and low power modes, it's ideal for industrial IoT devices. Its compact design supports various connectivity options like CAN and USB.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,584 parts In-Stock

1+ parts

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6,584

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Anansix

USA . 915 parts In-Stock

1+ parts

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1k+ parts

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915

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Digiode

USA . 763 parts In-Stock

1+ parts

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763

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,145 parts In-Stock

1+ parts

$20.085

100+ parts

-

1k+ parts

$18.077

10k+ parts

-

1,145

$20.085

-

$18.077

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AZTECH Wire

Italy . 733 parts In-Stock

1+ parts

$20.880

100+ parts

-

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733

$20.880

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MKK Technologies

India . 1,380 parts In-Stock

1+ parts

$37.769

100+ parts

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1,380

$37.769

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DigiPath Technology Company

USA . 1,380 parts In-Stock

1+ parts

$37.769

100+ parts

-

1k+ parts

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10k+ parts

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1,380

$37.769

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Component Stockers USA

USA . 2,275 parts In-Stock

1+ parts

$55.240

100+ parts

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2,275

$55.240

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Corphita

USA . 3,618 parts In-Stock

1+ parts

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3,618

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Parana Technologies

USA . 1,454 parts In-Stock

1+ parts

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100+ parts

$24.015

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1,454

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$24.015

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Overview

Unlock the power of innovation with the STM32L433VCI6TR microcontroller from STMicroelectronics. Renowned for excellence, STMicroelectronics delivers unmatched reliability and performance in a compact design, perfect for battery-operated devices, industrial automation, and IoT applications. Enjoy low power consumption without compromising on processing speed, empowering your projects with seamless connectivity and superior functionality. Elevate your designs with this versatile MCU—where quality meets exceptional value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robust performance in various conditions, making the microcontroller suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache enhances the speed and efficiency of the microcontroller, leading to faster data access and improved overall performance.

Surface Mount: YES

The surface mount configuration allows for compact design and easy integration into modern electronics, which is critical for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V keeps power consumption low, making it ideal for battery-operated devices.

On Chip Data RAM Width: 8

The 8-bit RAM width supports efficient data handling for various applications, streamlining operations.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCBs, allowing for efficient circuit designs.

Bit Size: 32

A 32-bit architecture supports advanced computing tasks, enabling complex calculations and better performance for applications.

DAC Channels: YES

Built-in DAC channels facilitate audio applications and signal processing, enhancing versatility in various projects.

No. of Terminals: 100

With 100 terminals available, this microcontroller provides ample connectivity options, enabling complex integration into varied systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch grid array allows for high-density connections, making it suitable for advanced applications where space is at a premium.

Minimum Supply Voltage: 1.71 V

A lower minimum supply voltage ensures compatibility with a wider range of power supplies, enhancing its utility in low-power designs.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in harsh environments, suitable for industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family is known for its high efficiency and performance, making it ideal for high-demand processing tasks.

No. of External Interrupts: 16

With 16 external interrupts, this microcontroller can effectively handle multiple signal sources, improving responsiveness in real-time applications.

Minimum Operating Temperature: -40 °C

A wide temperature range makes it suitable for outdoor and industrial applications where environmental conditions can be extreme.

ADC Channels: YES

The availability of ADC channels allows for integration with various sensors, making it versatile for mixed-signal applications.

DMA Channels: YES

Presence of DMA channels facilitates efficient data transfers, reducing CPU overhead and improving system performance.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient use of board real estate, simplifying PCB designs.

ROM Words: 262144

A large ROM capacity allows for rich application development, supporting complex software and firmware.

Maximum Seated Height: 0.6 mm

The very low seated height enables easy integration into compact devices, essential for modern applications.

Digital To Analog Converters: 2-Ch 12-Bit

The presence of dual 12-bit DACs allows for high-resolution signal generation, ideal for precision applications.

RAM Words: 65536

Generous RAM capacity enhances performance for complex algorithms and multitasking applications.

Width: 7 mm

A compact width allows for flexible designs in space-constricted environments, enhancing usability in varied applications.

Boundary Scan: YES

Boundary scan functionality aids in easier debugging and testing, reducing development time and effort.

Peripherals: BOR, COMPARATOR(2), DMA(14), LCD, PWM, RTC, TIMER(9), WDT(2)

Rich peripheral support enables a wide range of innovative applications, adding convenience and functionality.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides ample processing power for a broad spectrum of applications.

Length: 7 mm

The compact length ensures it fits well into miniaturized designs without sacrificing performance.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this microcontroller is robust against environmental stresses, ideal for tough applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Leveraging RISC architecture contributes to efficient processing and lower power requirements, crucial for embedded systems.

No. of Timers: 11

With 11 timers available, this microcontroller supports precise timing applications, essential for control systems.

RAM Bytes: 65536

A high amount of RAM supports complex processes, enabling better multitasking and data-heavy applications.

Technology: CMOS

CMOS technology provides a good balance of speed and power efficiency, making it suitable for portable hardware.

Terminal Form: BALL

The ball terminal form factor allows for effective heat dissipation and improved thermal performance in compact designs.

Analog To Digital Converters: 16-Ch 12-Bit

The 16-channel 12-bit ADC supports diverse sensing applications, adding versatility to various projects.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is common, ensuring compatibility with a wide range of power sources and designs.

No. of DMA Channels: 14

A high number of DMA channels enables efficient data transfers, freeing CPU resources for other processing tasks.

PWM Channels: YES

Support for PWM channels is crucial for motor control and signal modulation, increasing its applicability.

Connectivity: CAN, I2C(3), LPUART, QSPI, SAI, SPI(3), SDMMC, SWPMI, USART(3), USB

Extensive connectivity options facilitate easy integration with various peripherals and devices, enhancing customization potential.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, making development more flexible.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for high-density boards, optimizing space without compromising connectivity.

Format: FLOATING POINT

Floating point format support allows for advanced mathematical operations, essential in complex applications.

Speed: 80 rpm

Support for 80 rpm speeds is critical for applications requiring precise control and real-time performance.

Low Power Mode: YES

Low power mode capabilities extend battery life, making it ideal for portable and energy-sensitive applications.

On Chip Program ROM Width: 8

Having an 8-bit ROM width supports efficient code execution and storage for applications, improving performance.

No. of I/O Lines: 83

A high number of I/O lines maximizes the microcontroller's versatility across a variety of applications and interfaces.

Technical Specifications

Microcontrollers STM32L433VCI6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

83

No. of Terminals:

100

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), LPUART, QSPI, SAI, SPI(3), SDMMC, SWPMI, USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), LCD, PWM, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L433VCI6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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