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STM32L431RBI3

STMicroelectronics

STM32L431RBI3 by STMicroelectronics

STM32L431RBI3 microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.8V and 3.6V, and supports up to 48 MHz clock speed. With 64 terminals and integrated ADC/DMA channels, it's ideal for low-power applications like IoT devices. Its compact design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,184 parts In-Stock

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8,184

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Anansix

USA . 380 parts In-Stock

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380

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Digiode

USA . 250 parts In-Stock

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250

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Distributors (Availability)

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Vigor

Singapore . 4,000 parts In-Stock

1+ parts

$3.510

100+ parts

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4,000

$3.510

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AZTECH Wire

Italy . 608 parts In-Stock

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$21.380

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608

$21.380

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Microchip USA

USA . 6,269 parts In-Stock

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$26.113

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6,269

$26.113

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IDEA Electronic Components Group

UK . 1,546 parts In-Stock

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$48.186

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$43.367

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1,546

$48.186

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$43.367

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MKK Technologies

India . 118 parts In-Stock

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$90.610

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118

$90.610

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DigiPath Technology Company

USA . 118 parts In-Stock

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$90.610

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118

$90.610

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Corphita

USA . 3,439 parts In-Stock

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3,439

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Alle Elektronik GmbH

Germany . 1,485 parts In-Stock

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1,485

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Parana Technologies

USA . 1,138 parts In-Stock

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$57.614

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1,138

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$57.614

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Overview

Elevate your projects with the STM32L431RBI3, a powerful microcontroller from STMicroelectronics that combines exceptional performance with energy efficiency. Designed for versatile applications, it excels in IoT devices, wearables, and smart home solutions. With ST's renowned reliability and innovation, this compact powerhouse offers seamless integration, extensive connectivity, and advanced features to bring your ideas to life while ensuring long-lasting durability and superior value.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for compact designs and integration into smaller devices.

Maximum Supply Voltage: 3.6 V

The 3.6 V maximum supply voltage is sufficient for powering various peripherals while maintaining low power consumption.

Package Shape: SQUARE

A square package shape allows for efficient board layout and space utilization.

Bit Size: 32

A 32-bit architecture enhances processing capabilities and enables complex applications.

No. of Terminals: 64

64 terminals provide a wide array of connections for both inputs and outputs, ideal for versatile applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style supports efficient space-saving designs and higher-density circuit boards.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8 V offers flexibility for low-power applications, making it suitable for battery-operated devices.

ADC Channels: YES

Inclusion of ADC channels allows for analog signal processing, making it ideal for sensor-based applications.

DMA Channels: YES

DMA channels enable efficient data transfer, allowing for faster operation and reduced CPU load.

Terminal Position: BOTTOM

Bottom terminal positioning aids in easier mounting and soldering processes, enhancing manufacturing efficiency.

Width: 5 mm

A compact width of 5 mm makes it suitable for miniaturized applications and space-constrained designs.

Maximum Clock Frequency: 48 MHz

The 48 MHz maximum clock frequency allows for faster processing speeds, enabling responsive and efficient applications.

Length: 5 mm

The 5 mm length contributes to the small footprint, beneficial for portable electronics.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction processing, resulting in lower power consumption and enhanced performance.

Terminal Form: BALL

Ball terminal form provides better electrical connections and thermal management compared to traditional pin forms.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V balances performance and energy efficiency, suitable for various applications.

PWM Channels: YES

PWM channels are useful for controlling motors and LEDs, making this microcontroller versatile for various applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for densely packed circuits, maximizing the use of limited board space.

Speed: 80 rpm

Operating at 80 rpm indicates robust performance in real-time applications, especially in control systems.

No. of I/O Lines: 52

With 52 I/O lines, the microcontroller supports a wide range of interfacing options, enhancing its versatility.

Technical Specifications

Microcontrollers STM32L431RBI3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

5 mm

No. of I/O Lines:

52

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM32L431RBI3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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