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STM32L431KBU3TR

STMicroelectronics

STM32L431KBU3TR by STMicroelectronics

STM32L431KBU3TR by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, 65536 RAM bytes, and max clock frequency of 48 MHz. Ideal for automotive applications, it features 10-Ch 12-Bit ADCs, CAN connectivity, and operates in temperatures ranging from -40 to 125 °C.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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EBV Elektronik

Germany . 3,000 parts In-Stock

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Vyrian

USA . 6,093 parts In-Stock

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Digiode

USA . 967 parts In-Stock

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Anansix

USA . 938 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 739 parts In-Stock

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$4.000

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739

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AZTECH Wire

Italy . 685 parts In-Stock

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$14.422

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Semicontronic

India . 237 parts In-Stock

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$20.000

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$19.500

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$19.400

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$19.400

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Aztec Data Supply Inc.

USA . 3,536 parts In-Stock

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$44.150

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IDEA Electronic Components Group

UK . 244 parts In-Stock

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$62.193

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$55.974

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Corohmni

South Africa . 464 parts In-Stock

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MKK Technologies

India . 221 parts In-Stock

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DigiPath Technology Company

USA . 221 parts In-Stock

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Argo Parts USA

USA . 4,958 parts In-Stock

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Continental Prestige Electronics

USA . 1,349 parts In-Stock

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Parana Technologies

USA . 697 parts In-Stock

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Corphita

USA . 485 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Advanced Electronics

New Zealand . 27 parts In-Stock

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Overview

Unlock the power of innovation with the STM32L431KBU3TR by STMicroelectronics, a cutting-edge microcontroller that boasts unmatched quality and reliability. Manufactured by industry leaders, this product is designed to exceed expectations in a variety of applications. From automotive to industrial settings, this microcontroller offers customers unparalleled value with its advanced features and high-performance capabilities. Experience seamless connectivity, precision control, and efficient operation with the STM32L431KBU3TR, your ultimate solution for all your microcontroller needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy soldering and integration onto circuit boards, making it suitable for compact designs and mass production.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs for flexibility in power supply options.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board.

Bit Size: 32

32-bit architecture ensures high performance and capability for processing complex tasks.

DAC Channels: YES

Integrated DAC channels enable accurate analog output signals for various applications.

No. of Terminals: 32

Sufficient number of terminals for connecting external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer versatility in mounting and thermal management options.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage allows for operation in power-constrained environments.

Maximum Operating Temperature: 125 °C

High operating temperature range suitable for automotive and industrial applications.

CPU Family: CORTEX-M4

Features the advanced ARM Cortex-M4 architecture for efficient processing and performance.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme environmental conditions.

ADC Channels: YES

Integrated ADC channels enable accurate analog input readings for sensor interfacing.

DMA Channels: YES

DMA channels allow for efficient data transfer and processing, improving overall system performance.

Terminal Position: QUAD

Quad terminal position enhances connectivity and ease of circuit board layout.

ROM Words: 131072

Large ROM capacity provides ample storage for program and data memory.

Maximum Seated Height: 0.6 mm

Low profile design enhances space-saving and compatibility with compact device designs.

Digital To Analog Convertors: 2-Ch 12-Bit

2-channel 12-bit DACs offer high-resolution analog output capabilities for precision applications.

Width: 5 mm

Compact width dimensions facilitate integration into space-constrained designs.

Peripherals: COMPARATOR(2), CRC, DMA(14), RTC, TEMPERATURE SENSOR, TIMER(9), WDT(2)

Wide range of integrated peripherals enhance functionality and versatility for various applications.

Maximum Clock Frequency: 48 MHz

High clock frequency enables fast processing and response times for real-time applications.

Length: 5 mm

Compact length dimensions facilitate efficient use of space on the circuit board.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range ensures reliable operation in harsh automotive environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency in processing complex algorithms and tasks.

No. of Timers: 9

Multiple timers provide precise timing control and scheduling for various applications.

RAM Bytes: 65536

Generous RAM capacity for storing data and variables during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and standards.

Analog To Digital Convertors: 10-Ch 12-Bit

10-channel 12-bit ADCs provide high-resolution analog input capabilities for sensor interfacing.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

No. of DMA Channels: 14

Multiple DMA channels facilitate efficient data transfer and processing, improving system performance.

PWM Channels: YES

Integrated PWM channels enable precise control of digital output signals for motor and LED applications.

Connectivity: CAN, IRDA, IRTIM, I2C(2), LIN, UART, SAI, SMBUS, SPI(2), USART(2)

Versatile connectivity options for interfacing with various communication protocols and peripherals.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density packaging and compact design integration.

Speed: 80 rpm

Operating speed of 80 rpm ensures fast data processing and response times for time-critical applications.

On Chip Program ROM Width: 8

8-bit wide on-chip program ROM provides sufficient storage for program instructions and data.

No. of I/O Lines: 26

Adequate I/O lines for interfacing with external devices and peripherals, enhancing system connectivity.

Technical Specifications

Microcontrollers STM32L431KBU3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of DMA Channels:

14

No. of I/O Lines:

26

No. of Terminals:

32

No. of Timers:

9

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

65536

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, IRDA, IRTIM, I2C(2), LIN, UART, SAI, SMBUS, SPI(2), USART(2)

Peripherals:

COMPARATOR(2), CRC, DMA(14), RTC, TEMPERATURE SENSOR, TIMER(9), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L431KBU3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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