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STM32L412TBY6PTR

STMicroelectronics

STM32L412TBY6PTR by STMicroelectronics

STM32L412TBY6PTR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 85 °C, and supports up to 48 MHz clock speed. With integrated ADC and DMA channels, it's ideal for low-power applications in industrial settings. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,281 parts In-Stock

1+ parts

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13,281

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Digiode

USA . 1,401 parts In-Stock

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1,401

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Anansix

USA . 200 parts In-Stock

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,671 parts In-Stock

1+ parts

$2.350

100+ parts

-

1k+ parts

-

10k+ parts

-

1,671

$2.350

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AZTECH Wire

Italy . 145 parts In-Stock

1+ parts

$9.540

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145

$9.540

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Microchip USA

USA . 8,712 parts In-Stock

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$17.448

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8,712

$17.448

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IDEA Electronic Components Group

UK . 671 parts In-Stock

1+ parts

$20.510

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$18.459

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671

$20.510

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$18.459

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MKK Technologies

India . 2,349 parts In-Stock

1+ parts

$38.569

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2,349

$38.569

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DigiPath Technology Company

USA . 2,349 parts In-Stock

1+ parts

$38.569

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2,349

$38.569

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Component Stockers USA

USA . 1,418 parts In-Stock

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$38.710

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1,418

$38.710

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Corphita

USA . 2,614 parts In-Stock

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2,614

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Parana Technologies

USA . 1,836 parts In-Stock

1+ parts

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100+ parts

$24.523

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1,836

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$24.523

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Overview

Unlock unparalleled performance with the STM32L412TBY6PTR microcontroller from STMicroelectronics! Renowned for its quality and innovation, STMicroelectronics empowers your projects with cutting-edge technology. This versatile chip excels in low-power applications, making it ideal for wearables, IoT devices, and industrial automation. Experience enhanced efficiency, seamless connectivity, and robust reliability, transforming your ideas into reality while optimizing energy consumption.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliable performance and protection against environmental factors.

Integrated Cache: YES

Having an integrated cache enhances the processing speed and efficiency of applications.

Surface Mount: YES

Surface mount technology allows for a compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power supplies.

On Chip Data RAM Width: 8

An 8-bit wide data RAM allows for efficient data handling in embedded applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space in various designs.

Bit Size: 32

The 32-bit architecture enables handling of larger data types and more complex operations.

No. of Terminals: 36

Having 36 terminals expands connectivity options for various peripherals and components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch grid array design facilitates high-density interconnections for advanced applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage supports power-sensitive applications and battery-operated devices.

Maximum Operating Temperature: 85 °C

Designed for high-temperature environments, making it suitable for industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 architecture provides efficient processing power for embedded control applications.

No. of External Interrupts: 16

With 16 external interrupts, this microcontroller can efficiently handle multiple concurrent events.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in extreme conditions.

ADC Channels: YES

The inclusion of ADC channels makes it suitable for applications requiring analog input processing.

DMA Channels: YES

DMA support enhances data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: BOTTOM

Bottom terminal positioning minimizes space usage and facilitates easier PCB layout.

ROM Words: 131072

A substantial ROM capacity supports complex software and firmware applications.

Maximum Seated Height: 0.59 mm

The low seated height contributes to space-efficient product designs.

Width: 2.58 mm

Narrow width permits high-density designs, essential for miniaturization in electronic applications.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes in manufacturing.

Peripherals: BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2)

A comprehensive set of peripherals enhances functionality and versatility for various applications.

Maximum Clock Frequency: 48 MHz

The high clock frequency allows for rapid processing, improving system responsiveness.

Length: 3.07 mm

A compact length supports miniaturized PCB designs necessary for portable devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature ratings ensure reliability in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture promotes efficiency and performance in executing instructions.

No. of Timers: 8

Multiple timers allow for precise timing control in real-time applications.

RAM Bytes: 40960

Sufficient RAM capacity supports complex calculations and multi-tasking in embedded systems.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form factors optimize soldering and provide a reliable connection to the PCB.

Analog To Digital Convertors: 10-Ch 12-Bit

The presence of a 10-channel 12-bit ADC enables high-resolution data conversion, vital for precision applications.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA supports moderate power applications while maintaining efficiency.

Nominal Supply Voltage: 3 V

An optimal nominal supply voltage allows for consistent performance in various operating conditions.

No. of DMA Channels: 14

Having 14 DMA channels maximizes data handling efficiency, making it suitable for high-throughput applications.

No. of Serial I/Os: 3

Three serial I/O options provide flexibility in communication protocols for peripheral integration.

PWM Channels: YES

PWM support allows for precise control of motors and other devices in embedded systems.

Connectivity: I2C(2), LPUART, SPI, USART(2), USB

Multiple connectivity options enable integration with a wide range of external devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware.

Terminal Pitch: 0.4 mm

The 0.4 mm terminal pitch supports modern PCB designs and improves signal integrity.

Format: FIXED POINT

Fixed-point format facilitates efficient numerical computations, particularly in control applications.

Speed: 80 rpm

An operational speed of 80 rpm makes it competent for applications that require moderate processing power.

Low Power Mode: YES

Low power mode capabilities extend battery life in portable applications, making it ideal for low-power designs.

On Chip Program ROM Width: 8

An 8-bit ROM width enhances data handling capabilities appropriate for specific embedded applications.

No. of I/O Lines: 30

With 30 I/O lines, this microcontroller offers extensive interfacing possibilities for various peripherals.

Technical Specifications

Microcontrollers STM32L412TBY6PTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B36

Length:

3.07 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

36

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA36,6X6,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

40960

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.59 mm

Speed:

80 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.58 mm

Peripheral IC Type:

Connectivity:

I2C(2), LPUART, SPI, USART(2), USB

Peripherals:

BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L412TBY6PTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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