Loading...

STM32L412K8T6TR

STMicroelectronics

STM32L412K8T6TR by STMicroelectronics

STM32L412K8T6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 48 MHz clock frequency, and 10-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features 40960 bytes of RAM, 65536 ROM words, and connectivity options like I2C, SPI, and USB.

Median Price

$2.810

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$2.810

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$2.810

-

-

-

ComSIT Distribution GmbH

Germany . 16,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,800

-

-

-

-

ComSIT USA

USA . 16,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,800

-

-

-

-

Vyrian

USA . 10,902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,902

-

-

-

-

Anansix

USA . 2,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,723

-

-

-

-

Digiode

USA . 1,443 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,443

-

-

-

-

Sensible Micro Corp

USA . 624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

624

-

-

-

-

Cyclops Electronics Ltd

UK . 156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

156

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,649 parts In-Stock

1+ parts

$2.810

100+ parts

-

1k+ parts

-

10k+ parts

$2.754

5,649

$2.810

-

-

$2.754

Argo Parts USA

USA . 3,466 parts In-Stock

1+ parts

$2.810

100+ parts

-

1k+ parts

-

10k+ parts

-

3,466

$2.810

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$2.810

100+ parts

-

1k+ parts

$2.669

10k+ parts

$2.613

500

$2.810

-

$2.669

$2.613

AZTECH Wire

Italy . 545 parts In-Stock

1+ parts

$17.346

100+ parts

-

1k+ parts

-

10k+ parts

-

545

$17.346

-

-

-

Aztec Data Supply Inc.

USA . 2,708 parts In-Stock

1+ parts

$20.270

100+ parts

-

1k+ parts

-

10k+ parts

-

2,708

$20.270

-

-

-

Ampacity Inc.

Singapore . 410 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

410

$28.000

-

-

-

Semicontronic

India . 142 parts In-Stock

1+ parts

$34.000

100+ parts

$33.150

1k+ parts

$32.980

10k+ parts

-

142

$34.000

$33.150

$32.980

-

IDEA Electronic Components Group

UK . 1,651 parts In-Stock

1+ parts

$36.437

100+ parts

-

1k+ parts

$32.793

10k+ parts

-

1,651

$36.437

-

$32.793

-

Advanced Electronics

New Zealand . 17 parts In-Stock

1+ parts

$67.365

100+ parts

$63.997

1k+ parts

$63.997

10k+ parts

-

17

$67.365

$63.997

$63.997

-

MKK Technologies

India . 1,920 parts In-Stock

1+ parts

$68.517

100+ parts

-

1k+ parts

-

10k+ parts

-

1,920

$68.517

-

-

-

DigiPath Technology Company

USA . 1,920 parts In-Stock

1+ parts

$68.517

100+ parts

-

1k+ parts

-

10k+ parts

-

1,920

$68.517

-

-

-

Corohmni

South Africa . 51 parts In-Stock

1+ parts

$85.928

100+ parts

-

1k+ parts

-

10k+ parts

-

51

$85.928

-

-

-

Futuretech Components

Singapore . 12,810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,810

-

-

-

-

Parana Technologies

USA . 1,439 parts In-Stock

1+ parts

-

100+ parts

$43.566

1k+ parts

-

10k+ parts

-

1,439

-

$43.566

-

-

Lixinc

USA . 1,244 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,244

-

-

-

-

Corphita

USA . 963 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

963

-

-

-

-

Overview

Unlock the power of innovation with the STM32L412K8T6TR by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers top-quality microcontrollers that are ideal for a wide range of applications. This product offers unparalleled value with its integrated cache, low power mode, and high-speed connectivity options. Whether you're designing IoT devices, wearable technology, or industrial automation systems, this microcontroller provides the performance and reliability you need to bring your ideas to life. Experience the advantages of STMicroelectronics and take your projects to the next level with the STM32L412K8T6TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the microcontroller

Integrated Cache: YES

Integrated cache helps in improving the processing speed and efficiency of the microcontroller

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages for flexibility in different applications

On Chip Data RAM Width: 8

8-bit data RAM width allows for efficient data processing and storage

Package Shape: SQUARE

Square package shape for easy mounting and space-saving in designs

Bit Size: 32

32-bit architecture provides high performance and processing capabilities

No. of Terminals: 32

Ample number of terminals for easy connectivity and integration in circuits

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile flatpack package style for compact designs and space-saving

Minimum Supply Voltage: 1.71 V

Support for low supply voltage ensures energy efficiency in operation

Maximum Operating Temperature: 85 °C

Wide temperature range for industrial applications and robust performance

CPU Family: CORTEX-M4

High-performance Cortex-M4 CPU family for efficient processing and operation

No. of External Interrupts: 16

Multiple external interrupts for real-time event handling and responsiveness

Minimum Operating Temperature: -40 °C

Operational at low temperatures for diverse application environments

Terminal Finish: TIN

Tin terminal finish for reliable connections and durability

ADC Channels: YES

Built-in Analog to Digital Converters for sensing and data acquisition

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and processing

Terminal Position: QUAD

Quad terminal position for easy soldering and secure connections

ROM Words: 65536

Large ROM memory for program storage and execution

Maximum Seated Height: 1.6 mm

Low seated height for compact designs and space-saving

Width: 7 mm

Narrow width for compact PCB layouts and space efficiency

Boundary Scan: YES

Boundary scan feature for debugging and testing during development

Peripherals: BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2)

Multiple peripherals for versatile functionality and integration in various applications

Maximum Clock Frequency: 48 MHz

High clock frequency for fast processing and performance

Peak Reflow Temperature °C: 260

Support for high-temperature reflow soldering process for assembly

Length: 7 mm

Compact length for space efficiency in system designs

Temperature Grade: INDUSTRIAL

Industrial temperature grade for reliable operation in harsh environments

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture microcontroller for efficient processing and low power consumption

No. of Timers: 8

Multiple timers for time-sensitive operations and event handling

RAM Bytes: 40960

Large RAM memory for data storage and processing

Technology: CMOS

CMOS technology for low power consumption and high-speed operation

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and connections

Analog To Digital Convertors: 10-Ch 12-Bit

10-channel 12-bit ADCs for accurate analog signal conversion

Maximum Supply Current: 100 mA

Support for up to 100mA supply current for various components and peripherals

Nominal Supply Voltage: 3 V

Stable 3V nominal supply voltage for consistent operation

No. of DMA Channels: 14

14 DMA channels for efficient data transfer and processing

No. of Serial I/Os: 3

Multiple serial I/O ports for communication and connectivity

PWM Channels: YES

Pulse Width Modulation channels for precise control and signal generation

Connectivity: I2C(2), LPUART, SPI, USART(2), USB

Multiple connectivity options for interfacing with other devices and systems

ROM Programmability: FLASH

Flash ROM programmability for easy and quick firmware updates

Terminal Pitch: 0.8 mm

Fine terminal pitch for compact and dense PCB designs

Format: FIXED POINT

Fixed-point format for efficient numerical calculations and processing

Moisture Sensitivity Level (MSL): 3

MSL 3 rating for moisture resistance during storage and operation

Speed: 80 rpm

80 RPM speed for applications requiring precise timing and control

Low Power Mode: YES

Low power mode for energy-efficient operation and extended battery life

On Chip Program ROM Width: 8

8-bit width for on-chip program ROM for efficient program storage

No. of I/O Lines: 26

Ample I/O lines for versatile connectivity and interfacing with external devices

Technical Specifications

Microcontrollers STM32L412K8T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

26

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

40960

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(2), LPUART, SPI, USART(2), USB

Peripherals:

BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L412K8T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20