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STM32L412C8U6TR

STMicroelectronics

STM32L412C8U6TR by STMicroelectronics

STM32L412C8U6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and includes 14 DMA channels. Ideal for low-power applications, it supports various connectivity options like I2C and USB. With industrial-grade temperature tolerance (-40 °C to 85 °C), it's perfect for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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J2 Sourcing AB

Sweden . 70,000 parts In-Stock

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Vyrian

USA . 7,300 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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3,000

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Anansix

USA . 2,645 parts In-Stock

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2,645

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Digiode

USA . 644 parts In-Stock

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644

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AZTECH Wire

Italy . 103 parts In-Stock

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$18.140

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103

$18.140

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IDEA Electronic Components Group

UK . 770 parts In-Stock

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$23.818

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$21.436

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770

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$21.436

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MKK Technologies

India . 876 parts In-Stock

1+ parts

$44.788

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876

$44.788

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DigiPath Technology Company

USA . 876 parts In-Stock

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$44.788

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876

$44.788

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Infinite Electronics LLP (Excess)

. 35,578 parts In-Stock

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Corphita

USA . 4,882 parts In-Stock

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4,882

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Parana Technologies

USA . 2,122 parts In-Stock

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$28.478

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$28.478

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Overview

Unlock the potential of your next project with the STM32L412C8U6TR microcontroller from STMicroelectronics. Renowned for its exceptional quality and innovative design, this low-power MCU is perfect for industrial applications and IoT devices. Experience unmatched efficiency, robust performance, and versatile connectivity options, empowering you to create smarter, more reliable solutions while maximizing battery life—ideal for any forward-thinking developer.

Feature Benefit Bullets

Integrated Cache: YES

The presence of an integrated cache enhances processing speed and efficiency, making this microcontroller suitable for high-performance applications.

Surface Mount: YES

The surface mount design allows for a compact layout, enabling integration into smaller devices and improving reliability.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is ideal for low-power applications, ensuring efficient energy consumption.

On Chip Data RAM Width: 8

An 8-bit RAM width provides flexibility in data processing while maintaining compatibility with various data formats.

Package Shape: SQUARE

The square package shape provides equal dimensional length and width, optimizing space utilization on the circuit board.

Bit Size: 32

A 32-bit architecture enables the handling of a wide range of applications, from basic tasks to complex computational needs.

No. of Terminals: 48

With 48 terminals, this microcontroller can connect to multiple peripherals, providing greater versatility for various applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style facilitates efficient heat dissipation while maintaining a compact profile, crucial for high-performance applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage allows this microcontroller to operate effectively in battery-powered devices, extending overall battery life.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for industrial applications that may experience heightened thermal conditions.

CPU Family: CORTEX-M4

Built on the ARM Cortex-M4 architecture, this microcontroller offers robust performance and a wide range of features for demanding applications.

No. of External Interrupts: 16

Having 16 external interrupts allows for more responsive and complex systems that can handle multiple inputs simultaneously.

Minimum Operating Temperature: -40 °C

Suitable for extreme environmental conditions, this microcontroller operates from -40 °C, making it ideal for outdoor and harsh applications.

ADC Channels: YES

Onboard ADC channels support analog signal processing, crucial for applications that require data acquisition from sensors.

DMA Channels: YES

The inclusion of DMA channels ensures efficient data transfer without CPU intervention, enhancing overall system performance.

Terminal Position: QUAD

A quad terminal position allows for easy mounting and more connections in a compact space, beneficial for complex designs.

ROM Words: 65536

A substantial ROM capacity supports more sophisticated firmware applications and features, allowing for complex programming scenarios.

Maximum Seated Height: 0.6 mm

A low seated height enables integration into compact designs, maximizing usable space in electronic devices.

Width: 7 mm

A compact width of 7 mm makes it easy to fit into diverse applications, from wearables to embedded systems.

Boundary Scan: YES

Support for boundary scan-testing enhances debugging and troubleshooting processes, ensuring reliability in production.

Peripherals: BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2)

A rich set of peripherals enhances the controller’s functionality, allowing developers to create more complex and feature-rich systems.

Maximum Clock Frequency: 48 MHz

A clock speed of 48 MHz enables timely processing of tasks, making it suitable for real-time applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this microcontroller withstands rigorous operating conditions, ensuring durability.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers better efficiency and performance, making it a smart choice for various embedded systems.

No. of Timers: 8

Having 8 timers supports complex timing operations necessary for multitasking and control applications.

RAM Bytes: 40960

Ample RAM allows for sufficient data handling, enhancing application capabilities and responsiveness.

Technology: CMOS

CMOS technology provides excellent power efficiency and high integration, essential for modern electronic applications.

Terminal Form: GULL WING

The gull-wing terminal form offers strong mechanical attachment and ease of soldering, which is crucial for reliability.

Analog To Digital Convertors: 10-Ch 12-Bit

The 10-channel 12-bit ADC provides accurate data conversion for multiple analog signals, enhancing measurement capabilities.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA indicates moderate power needs, making it suitable for battery-operated devices.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V ensures compatibility with a wide range of power sources commonly used in embedded systems.

No. of DMA Channels: 14

The presence of 14 DMA channels allows for high-speed data transfer, improving system performance by offloading tasks from the CPU.

No. of Serial I/Os: 3

Three serial I/O ports allow for versatile communication options, facilitating connection with various external devices.

PWM Channels: YES

Availability of PWM channels makes it suitable for applications requiring precise control over motor speeds and light intensities.

Connectivity: I2C(3), LPUART, SPI(2), USART(3), USB

Diverse connectivity options enhance interoperability with various peripherals, making it a flexible choice for complex systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and upgrades to the firmware, ensuring long-term utility of the device.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch maximizes space efficiency on PCB designs, accommodating a greater number of connections.

Format: FIXED POINT

Fixed point format is suitable for applications requiring precise numeric calculations without floating-point overhead, enhancing efficiency.

Speed: 80 rpm

With a speed capability of 80 rpm, it is suitable for applications involving mechanical systems where speed control is needed.

Low Power Mode: YES

The inclusion of a low power mode enhances energy efficiency, which is critical for battery-operated and energy-sensitive devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for effective instruction set execution, facilitating efficient program debugging and operation.

No. of I/O Lines: 38

With 38 I/O lines, this microcontroller provides extensive connectivity options for sensors, actuators, and other peripherals.

Technical Specifications

Microcontrollers STM32L412C8U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

38

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

40960

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(3), LPUART, SPI(2), USART(3), USB

Peripherals:

BOR, COMPARATOR, DMA(14), POR, TIMER(8), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L412C8U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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