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STM32L162ZCT6

STMicroelectronics

STM32L162ZCT6 by STMicroelectronics

STM32L162ZCT6 by STMicroelectronics is a 32-bit microcontroller with 144 terminals, operating at up to 32 MHz. It features 32768 bytes of RAM, 262144 ROM words, and supports ADC and DMA channels. Ideal for industrial applications requiring a max supply voltage of 3.6 V and an operating temperature range from -40 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,309 parts In-Stock

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10,309

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Digiode

USA . 899 parts In-Stock

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899

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Anansix

USA . 784 parts In-Stock

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784

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Distributors (Availability)

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Vigor

Singapore . 1,098 parts In-Stock

1+ parts

$7.380

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1,098

$7.380

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AZTECH Wire

Italy . 1,214 parts In-Stock

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$15.240

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1,214

$15.240

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Microchip USA

USA . 2,299 parts In-Stock

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$24.194

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2,299

$24.194

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IDEA Electronic Components Group

UK . 69 parts In-Stock

1+ parts

$29.405

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$26.465

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69

$29.405

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$26.465

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MKK Technologies

India . 1,579 parts In-Stock

1+ parts

$55.294

100+ parts

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1,579

$55.294

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DigiPath Technology Company

USA . 1,579 parts In-Stock

1+ parts

$55.294

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1,579

$55.294

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Corphita

USA . 4,050 parts In-Stock

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4,050

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Parana Technologies

USA . 1,210 parts In-Stock

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$35.158

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1,210

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$35.158

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Overview

Discover the ultimate in microcontroller technology with the STM32L162ZCT6 from STMicroelectronics. This powerful device offers unmatched quality and reliability, perfect for a wide range of applications. With its advanced features and impressive performance, this microcontroller provides exceptional value and benefits to customers seeking top-notch solutions. Experience the advantages of STMicroelectronics' expertise in creating cutting-edge technology with the STM32L162ZCT6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight, durable, and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage enables versatile compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it suitable for compact electronic devices.

Bit Size: 32

The 32-bit architecture offers higher processing power and performance compared to lower bit sizes, making it suitable for complex applications.

Power Supplies (V): 2/3.3

The availability of multiple power supply options gives flexibility in design and allows for compatibility with various power sources.

No. of Terminals: 144

The large number of terminals provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers better thermal performance and easier heat dissipation, contributing to the overall reliability of the microcontroller.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for operation in low-power applications and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the microcontroller suitable for industrial environments where temperature fluctuations are common.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family is known for its high performance and energy efficiency, making it an ideal choice for embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold environments, expanding the range of possible applications for the microcontroller.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and signals, making it suitable for a wide range of measurement and control applications.

DMA Channels: YES

DMA channels help improve data transfer efficiency and reduce CPU overhead, enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position offers convenient soldering and PCB layout options, simplifying the manufacturing process.

ROM Words: 262144

The large ROM capacity allows for storing a significant amount of program code and data, enabling complex applications to be implemented.

Width: 20 mm

The compact width of the microcontroller saves space on the PCB, making it suitable for designing compact electronic devices.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency enables fast and efficient data processing, making the microcontroller suitable for applications requiring real-time operation.

Length: 20 mm

The compact length of the microcontroller complements its square package shape, allowing for efficient use of space on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making it suitable for industrial automation and control systems.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers high performance and energy efficiency, making it suitable for a wide range of embedded applications.

RAM Bytes: 32768

The generous RAM capacity allows for efficient data storage and processing, enabling multitasking and memory-intensive applications.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption and high noise immunity, contributing to overall energy efficiency and reliability.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable electrical connections, enhancing the overall durability and performance of the microcontroller.

Maximum Supply Current: 12.3 mA

The low maximum supply current consumption helps optimize power usage and extends battery life in portable electronic devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures stable and reliable operation of the microcontroller, providing consistency in performance across different operating conditions.

PWM Channels: YES

The presence of PWM channels enables precise control of analog devices such as motors and LEDs, making the microcontroller suitable for applications requiring modulation of pulse-width signals.

ROM Programmability: FLASH

The use of FLASH ROM allows for easy and efficient reprogramming of the microcontroller, enabling quick updates and modifications to the firmware.

Terminal Pitch: 0.5 mm

The fine terminal pitch offers high-density packaging options, allowing for compact PCB designs and efficient use of space in electronic devices.

Speed: 32 rpm

The speed of 32 rpm indicates the maximum clock frequency of the microcontroller, highlighting its processing capabilities and performance for real-time applications.

No. of I/O Lines: 115

The high number of I/O lines provides extensive connectivity options for interfacing with external peripherals and devices, making the microcontroller versatile and suitable for a variety of applications.

Technical Specifications

Microcontrollers STM32L162ZCT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

115

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

STM32L162ZCT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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