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STM32L162VDY6XTR

STMicroelectronics

STM32L162VDY6XTR by STMicroelectronics

STM32L162VDY6XTR microcontroller from STMicroelectronics features a 32-bit Cortex-M3 CPU, operates at 1.8-3.6V, and supports up to 12 DMA channels. With 83 I/O lines and low power modes, it's ideal for industrial applications requiring efficiency and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,444 parts In-Stock

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Digiode

USA . 3,381 parts In-Stock

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3,381

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Anansix

USA . 846 parts In-Stock

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846

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Distributors (Availability)

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Vigor

Singapore . 3,907 parts In-Stock

1+ parts

$5.170

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3,907

$5.170

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AZTECH Wire

Italy . 816 parts In-Stock

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$18.710

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816

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IDEA Electronic Components Group

UK . 94 parts In-Stock

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$71.980

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$64.782

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94

$71.980

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$64.782

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MKK Technologies

India . 1,134 parts In-Stock

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$135.353

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$135.353

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DigiPath Technology Company

USA . 1,134 parts In-Stock

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$135.353

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$135.353

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,109 parts In-Stock

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Microchip USA

USA . 4,587 parts In-Stock

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Corphita

USA . 3,839 parts In-Stock

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Parana Technologies

USA . 1,316 parts In-Stock

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$86.063

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$86.063

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Overview

Unlock the potential of your next innovation with the STM32L162VDY6XTR from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers a microcontroller that excels in low-power applications while ensuring robust performance. Ideal for smart devices, IoT solutions, and industrial automation, this versatile chip offers outstanding efficiency and reliability, empowering you to create cutting-edge products that stand out in a competitive market. Elevate your projects with unparalleled value and innovative features!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliable performance and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Supports space-saving designs, allowing for compact PCBs and easier assembly.

Maximum Supply Voltage: 3.6 V

Offers compatibility with a range of power sources, enhancing flexibility in design.

On Chip Data RAM Width: 8

8-bit data width is ideal for applications requiring efficient data handling and storage.

Package Shape: RECTANGULAR

The rectangular shape allows for organized layout and efficient use of PCB space.

Bit Size: 32

A 32-bit architecture enables efficient processing and the ability to handle more complex applications.

DAC Channels: YES

Integrated DAC channels facilitate analog output, making it suitable for applications requiring precise control.

No. of Terminals: 104

A high number of terminals allows for versatile connectivity options, accommodating various peripheral devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Thin profile and fine pitch design enhance the compactness and density of circuit designs.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage is energy-efficient, reducing power consumption in battery-operated devices.

Maximum Operating Temperature: 85 °C

High operational temperature range makes it suitable for industrial applications.

CPU Family: CORTEX-M3

Using the efficient Cortex-M3 architecture ensures high performance and low power consumption.

No. of External Interrupts: 16

The presence of multiple interrupts allows for responsiveness in real-time applications.

Minimum Operating Temperature: -40 °C

Designed for extreme temperature conditions, making it reliable for outdoor and industrial applications.

ADC Channels: YES

Integrated ADC channels are essential for applications requiring precise analog-to-digital conversion.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency, freeing the CPU for other tasks.

Terminal Position: BOTTOM

Bottom terminal positioning improves thermal performance and space utilization on PCBs.

ROM Words: 393216

Ample ROM allows for extensive program storage, supporting complex applications.

Maximum Seated Height: 0.585 mm

A low seated height is crucial for space-constrained designs, allowing for compact assembly.

RAM Words: 40960

Sufficient RAM ensures smooth operation and storage for intermediate data processing.

Width: 4.095 mm

Narrow width facilitates optimization in compact PCB designs.

Boundary Scan: YES

Supports boundary scan for effective testing and debugging of circuit designs.

Maximum Clock Frequency: 24 MHz

A decent clock frequency enables quick processing speed, suitable for various applications.

Length: 5.094 mm

Compact length allows easy integration into space-constrained environments.

Temperature Grade: INDUSTRIAL

Industrial grade certification ensures reliability in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides efficient processing with reduced energy consumption.

RAM Bytes: 81920

Adequate RAM capacity supports multiple tasks and enhances overall system performance.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, ideal for portable devices.

Terminal Form: BALL

Ball terminal form enhances the ease of soldering on PCBs, improving manufacturing efficiency.

Maximum Supply Current: 12.3 mA

Relatively low supply current contributes to energy efficiency, prolonging battery life in portable applications.

Nominal Supply Voltage: 3 V

A nominal voltage of 3V aligns with common battery standards, improving compatibility.

No. of DMA Channels: 12

Multiple DMA channels allow for efficient data handling, particularly in data-heavy applications.

PWM Channels: YES

Integrating PWM channels is ideal for applications involving motor control and signal generation.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware.

Terminal Pitch: 0.4 mm

A small terminal pitch allows for higher density in PCB designs, accommodating more connections in limited space.

Format: FIXED POINT

Fixed-point format is advantageous for applications needing consistent and precise calculations.

Speed: 32 rpm

Moderate speed capabilities make it suitable for a variety of control applications.

Low Power Mode: YES

Low power mode feature is crucial for extending battery life in portable applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width aids in efficient program execution for suitable applications.

No. of I/O Lines: 83

A large number of I/O lines ensure diverse peripheral connectivity, enhancing versatility in designs.

Technical Specifications

Microcontrollers STM32L162VDY6XTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B104

Length:

5.094 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

83

No. of Terminals:

104

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA104,9X12,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

81920

RAM Words:

40960

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

32 rpm

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.095 mm

Peripheral IC Type:

Trade Compliance

STM32L162VDY6XTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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