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STM32L152VEY6TR

STMicroelectronics

STM32L152VEY6TR by STMicroelectronics

STM32L152VEY6TR by STMicroelectronics is a 32-bit microcontroller with 104 terminals, operating at 24 MHz. It features DAC and ADC channels, along with DMA support. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,068 parts In-Stock

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6,068

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Anansix

USA . 1,385 parts In-Stock

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1,385

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Digiode

USA . 1,080 parts In-Stock

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1,080

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,500 parts In-Stock

1+ parts

$5.600

100+ parts

-

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3,500

$5.600

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AZTECH Wire

Italy . 546 parts In-Stock

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$12.830

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546

$12.830

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Microchip USA

USA . 4,944 parts In-Stock

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$18.826

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4,944

$18.826

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IDEA Electronic Components Group

UK . 1,583 parts In-Stock

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$41.287

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$37.158

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1,583

$41.287

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$37.158

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MKK Technologies

India . 1,939 parts In-Stock

1+ parts

$77.637

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1,939

$77.637

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DigiPath Technology Company

USA . 1,939 parts In-Stock

1+ parts

$77.637

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1,939

$77.637

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Corphita

USA . 2,331 parts In-Stock

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2,331

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Parana Technologies

USA . 2,147 parts In-Stock

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$49.365

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2,147

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$49.365

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Overview

Unlock endless possibilities with the STM32L152VEY6TR by STMicroelectronics. This high-quality microcontroller offers unparalleled performance and reliability, making it the go-to choice for a wide range of applications. From IoT devices to consumer electronics, this product provides unmatched value, benefits, and advantages to customers. Trust in STMicroelectronics' expertise and innovation to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage offers flexibility in power requirements and can support a wider range of applications.

Package Shape: RECTANGULAR

Rectangular shape provides ease of handling and integration into various electronic devices.

Bit Size: 32

32-bit architecture allows for high-performance computing and better processing capabilities.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog components and sensors.

No. of Terminals: 104

High number of terminals provide versatility in connecting external devices and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with a thin profile and fine pitch enhances the overall compactness and efficiency of the microcontroller.

Minimum Supply Voltage: 1.8 V

Lower minimum supply voltage allows for energy-efficient operation and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures makes the microcontroller suitable for use in diverse climates and settings.

ADC Channels: YES

Analog-to-digital converter channels facilitate the conversion of analog signals into digital data for processing and analysis.

DMA Channels: YES

Direct Memory Access (DMA) channels streamline data transfers and enhance the microcontroller's efficiency in handling large volumes of data.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, optimizing space utilization within the device.

ROM Words: 524288

Large ROM capacity allows for storing a significant amount of program data and instructions for efficient operation.

Maximum Seated Height: 0.585 mm

Low seated height facilitates compact design integration and minimizes overall product dimensions.

Width: 4.095 mm

Narrow width enables space-saving placement on circuit boards, especially in applications with limited physical space.

Maximum Clock Frequency: 24 MHz

High clock frequency supports fast processing speeds and responsiveness, enhancing the microcontroller's performance capabilities.

Length: 5.094 mm

Compact length makes the microcontroller suitable for small form factor devices and applications with space constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with fluctuating temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers efficient instruction execution and improved performance for a wide range of applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology provides low power consumption and high noise immunity, enhancing overall efficiency.

Terminal Form: BALL

Ball terminal form enhances soldering reliability and electrical connections for stable performance.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage ensures compatibility with a variety of power sources and simplifies system integration.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog signals, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and fast reprogramming of firmware and software, enhancing flexibility and scalability.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables high-density mounting on PCBs, optimizing space usage and enhancing design flexibility.

Speed: 32 rpm

Operating speed of 32 revolutions per minute indicates the microcontroller's ability to process data quickly and efficiently.

No. of I/O Lines: 83

High number of input/output lines facilitate connectivity with external devices, sensors, and peripherals, enhancing the microcontroller's functionality and versatility.

Technical Specifications

Microcontrollers STM32L152VEY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B104

Length:

5.094 mm

No. of I/O Lines:

83

No. of Terminals:

104

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.095 mm

Peripheral IC Type:

Trade Compliance

STM32L152VEY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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