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STM32L152V8H6A

STMicroelectronics

STM32L152V8H6A by STMicroelectronics

STM32L152V8H6A by STMicroelectronics is a 32-bit microcontroller with 83 I/O lines, DAC and ADC channels, PWM support, and 32 MHz clock frequency. Ideal for industrial applications with operating temperatures from -40 to 85 °C, it features a compact square package with a thin profile and fine pitch grid array design.

Median Price

$1.070

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 416 parts In-Stock

1+ parts

$1.070

100+ parts

-

1k+ parts

-

10k+ parts

-

416

$1.070

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,639 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,639

-

-

-

-

Digiode

USA . 3,508 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,508

-

-

-

-

Anansix

USA . 167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

167

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,676 parts In-Stock

1+ parts

$3.710

100+ parts

-

1k+ parts

-

10k+ parts

-

2,676

$3.710

-

-

-

Ampacity Inc.

Singapore . 1,236 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,236

$10.000

-

-

-

AZTECH Wire

Italy . 923 parts In-Stock

1+ parts

$12.280

100+ parts

-

1k+ parts

-

10k+ parts

-

923

$12.280

-

-

-

IDEA Electronic Components Group

UK . 1,979 parts In-Stock

1+ parts

$16.699

100+ parts

-

1k+ parts

$15.029

10k+ parts

-

1,979

$16.699

-

$15.029

-

Microchip USA

USA . 3,531 parts In-Stock

1+ parts

$28.928

100+ parts

-

1k+ parts

-

10k+ parts

-

3,531

$28.928

-

-

-

MKK Technologies

India . 635 parts In-Stock

1+ parts

$31.401

100+ parts

-

1k+ parts

-

10k+ parts

-

635

$31.401

-

-

-

DigiPath Technology Company

USA . 635 parts In-Stock

1+ parts

$31.401

100+ parts

-

1k+ parts

-

10k+ parts

-

635

$31.401

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,670

-

-

-

-

Corphita

USA . 2,448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,448

-

-

-

-

Parana Technologies

USA . 370 parts In-Stock

1+ parts

-

100+ parts

$19.966

1k+ parts

-

10k+ parts

-

370

-

$19.966

-

-

Overview

Elevate your projects with the STM32L152V8H6A microcontroller by STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics brings you a versatile solution for a wide range of applications. With its advanced features and capabilities, this microcontroller offers exceptional value and benefits to customers looking for high-performance components. Whether you're working on IoT devices, consumer electronics, or industrial automation, the STM32L152V8H6A is the perfect choice to bring your ideas to life. Choose STMicroelectronics for innovation, quality, and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making this microcontroller suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto printed circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power options, allowing for compatibility with a wide range of systems and applications.

Package Shape: SQUARE

The square package shape helps in efficient use of space on the PCB, maximizing component density and minimizing overall footprint.

Bit Size: 32

The 32-bit architecture offers higher processing performance and efficiency, making this microcontroller suitable for handling complex tasks and calculations.

DAC Channels: YES

The presence of DAC channels allows for high-quality analog signal output, enabling accurate voltage control and signal generation capabilities.

No. of Terminals: 100

With a high number of terminals, this microcontroller offers ample connectivity options for interfacing with external devices and peripherals, enhancing versatility in design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch design ensures good thermal management and signal integrity, making it suitable for high-performance applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for power-efficient operation and extends battery life in portable or energy-conscious devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions, providing durability and stability in extreme temperature settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables operation in cold environments without compromising functionality, making it suitable for a variety of outdoor or industrial applications.

ADC Channels: YES

The presence of ADC channels allows for accurate analog-to-digital conversion, facilitating precise measurement and data acquisition capabilities in the microcontroller.

DMA Channels: YES

The availability of DMA channels enhances data transfer efficiency and offloads the CPU for other critical tasks, improving overall system performance and responsiveness.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, making it easier to design compact and efficient circuitry while ensuring proper signal integrity and thermal management.

Maximum Seated Height: 0.6 mm

The low maximum seated height allows for a slim and sleek profile, ideal for space-constrained applications or designs where component height is a critical factor.

Width: 7 mm

The compact width dimensions contribute to space-saving layout designs, enabling efficient use of board real estate and facilitating easy integration into various electronic systems.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency enables fast processing speeds and responsive system performance, making this microcontroller suitable for real-time applications and demanding computational tasks.

Length: 7 mm

The short length dimensions contribute to a compact form factor, allowing for flexible placement and installation in tight spaces or small devices without sacrificing functionality.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in demanding environments with extended temperature ranges, making it suitable for rugged industrial applications and outdoor use.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripheral capabilities, this product offers efficient processing power, low power consumption, and versatile connectivity options, making it a versatile choice for a wide range of applications.

Technology: CMOS

The CMOS technology used in this microcontroller provides low power consumption, high noise immunity, and compatibility with a wide range of digital and analog systems, ensuring efficient and reliable operation.

Terminal Form: BALL

The ball terminal form facilitates reliable solder connections, ensuring secure electrical and mechanical connections, and making it suitable for applications requiring robust and durable interconnects.

Nominal Supply Voltage: 3 V

The nominal supply voltage provides a stable power source for consistent operation and performance, ensuring reliable functionality across various operating conditions and load requirements.

PWM Channels: YES

The presence of PWM channels allows for precise control of pulse-width modulation signals, enabling efficient motor control, analog signal generation, and power management applications in the microcontroller.

ROM Programmability: FLASH

The flash ROM programmability feature offers flexibility in firmware updates and customization, facilitating easy development and maintenance of software applications for the microcontroller.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting, promoting compact and space-efficient PCB design while enabling reliable connectivity and signal transmission in the microcontroller.

Speed: 32 rpm

The high speed of 32 revolutions per minute indicates fast processing capabilities and responsiveness, making this microcontroller suitable for time-critical applications and tasks requiring rapid data processing and feedback.

No. of I/O Lines: 83

With a high number of I/O lines, this microcontroller offers extensive input/output options for interfacing with sensors, actuators, displays, and other external devices, enabling versatile connectivity and functionality in diverse applications.

Technical Specifications

Microcontrollers STM32L152V8H6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of I/O Lines:

83

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L152V8H6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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