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STM32L152RDY6TR

STMicroelectronics

STM32L152RDY6TR by STMicroelectronics

STM32L152RDY6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features DAC and ADC channels, DMA support, and 51 I/O lines. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,872 parts In-Stock

1+ parts

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7,872

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Digiode

USA . 4,435 parts In-Stock

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4,435

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Chip Stock

USA . 3,720 parts In-Stock

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3,720

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Anansix

USA . 130 parts In-Stock

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130

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,100 parts In-Stock

1+ parts

$4.370

100+ parts

-

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1,100

$4.370

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Microchip USA

USA . 5,092 parts In-Stock

1+ parts

$15.120

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5,092

$15.120

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AZTECH Wire

Italy . 890 parts In-Stock

1+ parts

$21.870

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890

$21.870

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IDEA Electronic Components Group

UK . 588 parts In-Stock

1+ parts

$32.733

100+ parts

-

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$29.459

10k+ parts

-

588

$32.733

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$29.459

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MKK Technologies

India . 994 parts In-Stock

1+ parts

$61.552

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994

$61.552

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DigiPath Technology Company

USA . 994 parts In-Stock

1+ parts

$61.552

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994

$61.552

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Component Stockers USA

USA . 1,020 parts In-Stock

1+ parts

$80.570

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1,020

$80.570

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,341 parts In-Stock

1+ parts

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$39.137

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1,341

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$39.137

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Corphita

USA . 633 parts In-Stock

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633

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Overview

Discover the STM32L152RDY6TR by STMicroelectronics, a top-of-the-line microcontroller designed to bring innovation and efficiency to your projects. With a reputation for quality and reliability, STMicroelectronics delivers cutting-edge technology that exceeds expectations. This versatile microcontroller is perfect for a wide range of applications, from IoT devices to industrial automation. Experience the value and benefits of this product, offering high performance, low power consumption, and advanced features to help you achieve your goals with ease. Elevate your designs with the STM32L152RDY6TR and unleash endless possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and reliable, making the product robust and long-lasting.

Surface Mount: YES

Surface mount packaging allows for easy installation on circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in power requirements.

Bit Size: 32

32-bit processing capability allows for complex calculations and operations, enhancing performance and efficiency.

DAC Channels: YES

DAC (Digital-to-Analog Converter) channels enable the microcontroller to generate analog signals, expanding its functionality.

Power Supplies (V): 2/3.3

Supports different power supply options, allowing for compatibility with various systems and devices.

No. of Terminals: 64

Ample number of terminals facilitate connectivity with external components and peripherals, enhancing versatility.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage helps in reducing power consumption and enhancing energy efficiency.

CPU Family: CORTEX-M3

CORTEX-M3 architecture provides high performance and efficiency, suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range enables the microcontroller to function reliably in various environmental conditions.

Technical Specifications

Microcontrollers STM32L152RDY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e1

Length:

4.911 mm

No. of I/O Lines:

51

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.539 mm

Peripheral IC Type:

Trade Compliance

STM32L152RDY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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