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STM32L152R6H6

STMicroelectronics

STM32L152R6H6 by STMicroelectronics

STM32L152R6H6 by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 20 ADC channels, 2 DAC channels, and 10 timers, suitable for industrial applications requiring high-speed data processing and connectivity via I2C, SPI, USART, and USB interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,469 parts In-Stock

1+ parts

-

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12,469

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Digiode

USA . 4,669 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,669

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Anansix

USA . 1,712 parts In-Stock

1+ parts

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1,712

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,680 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

-

10k+ parts

-

4,680

$3.050

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-

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AZTECH Wire

Italy . 848 parts In-Stock

1+ parts

$13.190

100+ parts

-

1k+ parts

-

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-

848

$13.190

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-

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Microchip USA

USA . 5,131 parts In-Stock

1+ parts

$26.377

100+ parts

-

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5,131

$26.377

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$39.087

100+ parts

$38.696

1k+ parts

$37.133

10k+ parts

-

100

$39.087

$38.696

$37.133

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Component Stockers USA

USA . 1,925 parts In-Stock

1+ parts

$47.400

100+ parts

-

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1,925

$47.400

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IDEA Electronic Components Group

UK . 278 parts In-Stock

1+ parts

$76.889

100+ parts

-

1k+ parts

$69.200

10k+ parts

-

278

$76.889

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$69.200

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MKK Technologies

India . 1,285 parts In-Stock

1+ parts

$144.585

100+ parts

-

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1,285

$144.585

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DigiPath Technology Company

USA . 1,285 parts In-Stock

1+ parts

$144.585

100+ parts

-

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1,285

$144.585

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Corphita

USA . 2,600 parts In-Stock

1+ parts

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2,600

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Parana Technologies

USA . 1,507 parts In-Stock

1+ parts

-

100+ parts

$91.932

1k+ parts

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10k+ parts

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1,507

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$91.932

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Overview

Discover the STM32L152R6H6 microcontroller by STMicroelectronics, a top-tier manufacturer known for reliability and innovation. This versatile device offers a wide range of applications in various industries, providing customers with exceptional value and benefits. With its advanced features and high-quality design, this microcontroller ensures optimal performance and efficiency. Experience seamless connectivity, precise control, and enhanced functionality with the STM32L152R6H6, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material that provides good protection for the microcontroller.

Surface Mount: YES

Easily mountable on PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of voltage inputs, increasing flexibility in power supply options.

Package Shape: SQUARE

Compact shape that helps in efficient use of board space.

Bit Size: 32

High bit size for enhanced processing capabilities and performance.

DAC Channels: YES

Ability to convert digital signals into analog signals, useful for various applications like audio processing.

Power Supplies (V): 2/3.3

Supports multiple power supply options allowing for compatibility with different systems.

No. of Terminals: 64

Sufficient terminals for connecting various components and modules, enabling versatile usage.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Advanced package style for improved electrical performance and reliability.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage for power-efficient operation.

Maximum Operating Temperature: 85 °C

Wide temperature range for operation in various environmental conditions.

CPU Family: CORTEX-M3

High-performance and power-efficient processor architecture for optimal computing power.

Minimum Operating Temperature: -40 °C

Operational even in extreme cold conditions.

ADC Channels: YES

Ability to convert analog signals into digital data, important for reading sensor inputs.

DMA Channels: YES

Direct Memory Access for efficient data transfer without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal position for convenient PCB mounting and routing.

ROM Words: 32768

Sufficient ROM for storing program instructions and data.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Multiple DAC channels with high resolution for accurate analog signal generation.

Width: 5 mm

Compact width for easy integration into various electronic devices.

Data EEPROM Size: 4K

Adequate EEPROM size for storing user data and settings.

Peripherals: BOD, COMPARATOR(2), DMA(7), LCD, POR, RTC, TIMER(10)

Wide range of peripherals for enhanced functionality and connectivity options.

Maximum Clock Frequency: 32 MHz

High clock frequency for fast processing speed.

Length: 5 mm

Compact length for space-efficient designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture microcontroller for efficient operation.

RAM Bytes: 10240

Sufficient RAM for temporary data storage during program execution.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable and secure connections.

Analog To Digital Convertors: 20-Ch 12-Bit

Many ADC channels with high resolution for accurate analog signal readings.

Maximum Supply Current: 11 mA

Low supply current requirement for power-efficient operation.

Nominal Supply Voltage: 3 V

Standard supply voltage for compatibility with common power sources.

PWM Channels: YES

Pulse Width Modulation channels for precise control of analog outputs.

Connectivity: I2C(2), SPI(2), USART(3), USB

Multiple connectivity options for interfacing with other devices.

ROM Programmability: FLASH

Flash ROM for easy and quick program updates and modifications.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting on PCBs.

Speed: 32 rpm

High processing speed for rapid data handling.

On Chip Program ROM Width: 8

Sufficient width for storing program instructions on the chip itself.

No. of I/O Lines: 51

Sufficient number of I/O lines for interfacing with external components.

Technical Specifications

Microcontrollers STM32L152R6H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C(2), SPI(2), USART(3), USB

Peripherals:

BOD, COMPARATOR(2), DMA(7), LCD, POR, RTC, TIMER(10)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L152R6H6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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