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STM32L151VET7

STMicroelectronics

STM32L151VET7 by STMicroelectronics

STM32L151VET7 microcontroller from STMicroelectronics features a 32-bit Cortex-M3 CPU, operates b/w -40 °C to 105 °C, and supports up to 24 MHz clock speed. With 100 terminals and integrated DAC/ADC channels, it's ideal for industrial applications. Its low power consumption makes it perfect for battery-operated devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 270 parts In-Stock

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270

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Distributors (In-Stock)

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Vyrian

USA . 7,189 parts In-Stock

1+ parts

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100+ parts

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7,189

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Digiode

USA . 242 parts In-Stock

1+ parts

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242

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Anansix

USA . 135 parts In-Stock

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135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,544 parts In-Stock

1+ parts

$6.440

100+ parts

-

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10k+ parts

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2,544

$6.440

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AZTECH Wire

Italy . 408 parts In-Stock

1+ parts

$10.360

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408

$10.360

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Microchip USA

USA . 1,732 parts In-Stock

1+ parts

$23.830

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1,732

$23.830

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IDEA Electronic Components Group

UK . 752 parts In-Stock

1+ parts

$33.181

100+ parts

-

1k+ parts

$29.863

10k+ parts

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752

$33.181

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$29.863

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MKK Technologies

India . 1,984 parts In-Stock

1+ parts

$62.394

100+ parts

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1,984

$62.394

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DigiPath Technology Company

USA . 1,984 parts In-Stock

1+ parts

$62.394

100+ parts

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1,984

$62.394

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QUARKTWIN TECHNOLOGY LTD

USA . 20,674 parts In-Stock

1+ parts

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20,674

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Corphita

USA . 2,427 parts In-Stock

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2,427

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Parana Technologies

USA . 1,044 parts In-Stock

1+ parts

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$39.673

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1,044

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$39.673

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Eastek

USA . 270 parts In-Stock

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270

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Overview

Unlock the potential of your next project with the STM32L151VET7 microcontroller from STMicroelectronics. Renowned for their cutting-edge technology and commitment to quality, STMicroelectronics delivers a versatile 32-bit solution perfect for low-power applications in industrial and consumer sectors. Enjoy seamless integration, enhanced performance, and robust reliability, empowering you to innovate while reducing time-to-market and energy consumption.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly, making the microcontroller ideal for modern applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, the microcontroller is compatible with low-voltage systems, improving energy efficiency.

Package Shape: SQUARE

A square package shape optimizes PCB space utilization, making it easier to integrate into various designs.

Bit Size: 32

The 32-bit architecture allows for efficient processing and handling of complex computations, making it suitable for advanced applications.

DAC Channels: YES

Integrated DAC channels enable direct digital-to-analog conversion, enhancing capabilities for signal processing tasks.

No. of Terminals: 100

With 100 terminals, the microcontroller provides ample connectivity options to support a variety of peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack style reduces the component height, making it ideal for compact designs.

Minimum Supply Voltage: 1.8 V

The minimum supply voltage of 1.8 V enables operation in low-power environments, which is critical for battery-powered applications.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature ensures reliability in demanding industrial environments.

CPU Family: CORTEX-M3

The CORTEX-M3 family ensures a robust performance with efficient processing power tailored for microcontrollers.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this microcontroller suitable for extreme environmental conditions.

ADC Channels: YES

Integrated ADC channels enable efficient analog signal processing, enhancing its utility in various applications.

DMA Channels: YES

DMA channels provide efficient data transfers, freeing CPU resources for other tasks and improving overall performance.

Terminal Position: QUAD

Quad terminal positioning facilitates easier connections and better layout options on PCB.

ROM Words: 524288

A large ROM capacity allows for extensive program storage, accommodating large projects and complex applications.

Maximum Seated Height: 1.6 mm

The low seated height contributes to space efficiency on the PCB, critical for compact designs.

Width: 14 mm

With a width of 14 mm, this chip is versatile and can fit into various enclosure sizes.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz provides sufficient processing speed for many applications.

Length: 14 mm

A 14 mm length allows for compatibility with a wide range of circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller can withstand harsh conditions and prolonged use.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enables efficient instruction execution, which translates to better performance.

RAM Bytes: 81920

With 81920 bytes of RAM, it provides sufficient memory for complex applications requiring fast data access.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, beneficial in portable applications.

Terminal Form: GULL WING

Gull wing terminals provide stable and reliable connections to the PCB, enhancing durability.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V aligns with modern digital systems, ensuring compatibility.

PWM Channels: YES

Integrated PWM channels support motor control and other applications that require precise signal modulation.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, increasing flexibility.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density designs, accommodating more functionalities in less space.

Speed: 32 rpm

Operating at 32 rpm refers to its capability to handle processes in a timely manner, facilitating better performance.

On Chip Program ROM Width: 8

An 8-bit program ROM width is ideal for aligning with common data processing standards.

No. of I/O Lines: 83

A total of 83 I/O lines allows for extensive connectivity options, enabling interaction with multiple peripherals.

Technical Specifications

Microcontrollers STM32L151VET7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

83

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

81920

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32L151VET7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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