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STM32L151UCY7TR

STMicroelectronics

STM32L151UCY7TR by STMicroelectronics

STM32L151UCY7TR by STMicroelectronics is a 32-bit microcontroller with 262144 ROM words, 32768 RAM bytes, and 51 I/O lines. It operates at a max clock frequency of 24 MHz and has PWM channels for various applications in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,511 parts In-Stock

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Digiode

USA . 2,590 parts In-Stock

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Anansix

USA . 308 parts In-Stock

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Vigor

Singapore . 2,835 parts In-Stock

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$3.770

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2,835

$3.770

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AZTECH Wire

Italy . 90 parts In-Stock

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$12.200

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90

$12.200

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IDEA Electronic Components Group

UK . 478 parts In-Stock

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$21.982

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$19.784

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478

$21.982

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$19.784

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Microchip USA

USA . 5,404 parts In-Stock

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$31.873

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$31.873

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MKK Technologies

India . 948 parts In-Stock

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$41.337

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948

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DigiPath Technology Company

USA . 948 parts In-Stock

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$41.337

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QUARKTWIN TECHNOLOGY LTD

USA . 25,394 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Corphita

USA . 3,100 parts In-Stock

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Parana Technologies

USA . 1,767 parts In-Stock

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$26.283

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Overview

Unlock endless possibilities with the STM32L151UCY7TR microcontroller from STMicroelectronics. This high-quality product offers unmatched performance and reliability, making it the perfect choice for a wide range of applications. With its advanced features and cutting-edge technology, customers can expect seamless operation and superior functionality. Trust in STMicroelectronics to deliver top-notch products that exceed expectations and elevate your projects to new heights. Experience the value and benefits of the STM32L151UCY7TR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product durable and lightweight, suitable for various applications.

Surface Mount: YES

Surface mount technology simplifies installation and allows for more compact designs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages for flexibility in power requirements.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into different systems and designs.

Bit Size: 32

32-bit architecture provides high computational power and performance.

Power Supplies (V): 2/3.3

Offers compatibility with different power supplies for versatility in application.

No. of Terminals: 63

Sufficient terminals for connectivity and interfacing with other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch enables dense PCB layouts and space-saving designs.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for efficient power consumption and operation.

Maximum Operating Temperature: 105 °C

Wide temperature range for operation in harsh environmental conditions.

CPU Family: CORTEX-M3

Cortex-M3 architecture offers high-performance computing capabilities.

Minimum Operating Temperature: -40 °C

Support for low operating temperatures for use in extreme cold environments.

ADC Channels: YES

Integrated ADC channels for analog signal processing.

DMA Channels: YES

Support for Direct Memory Access channels for efficient data transfer.

Terminal Position: BOTTOM

Bottom terminal position for easy mounting and connections.

ROM Words: 262144

Large ROM capacity for storing program data and instructions.

Width: 3.288 mm

Compact width for space-constrained designs.

Maximum Clock Frequency: 24 MHz

High clock frequency for fast processing and execution speed.

Length: 4.164 mm

Short length for compact form factor and layout flexibility.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable performance in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and streamlined processing capabilities.

RAM Bytes: 32768

Sufficient RAM capacity for data storage and retrieval.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: BALL

Ball terminal form for reliable connections and soldering.

Maximum Supply Current: 9.6 mA

Low supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Support for Pulse Width Modulation channels for precise control and signal modulation.

ROM Programmability: FLASH

Flash ROM programmability for easy reprogramming and updating of firmware.

Terminal Pitch: 0.4 mm

Fine terminal pitch for high-density packaging and efficient PCB layout.

Speed: 32 rpm

High-speed operation at 32 rpm for fast processing and execution.

No. of I/O Lines: 51

Abundant I/O lines for interfacing with external devices and components.

Technical Specifications

Microcontrollers STM32L151UCY7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B63

Length:

4.164 mm

No. of I/O Lines:

51

No. of Terminals:

63

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA63,7X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

3.288 mm

Peripheral IC Type:

Trade Compliance

STM32L151UCY7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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