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STM32L151RBH6D

STMicroelectronics

STM32L151RBH6D by STMicroelectronics

STM32L151RBH6D by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, 16384 RAM bytes, and 20-Ch 12-Bit ADC. Ideal for industrial applications, it offers a max clock frequency of 32 MHz and connectivity options like I2C, SPI, USART, and USB.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,818 parts In-Stock

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Anansix

USA . 2,617 parts In-Stock

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Digiode

USA . 1,743 parts In-Stock

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1,743

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Distributors (Availability)

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AZTECH Wire

Italy . 729 parts In-Stock

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$8.530

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729

$8.530

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Microchip USA

USA . 5,801 parts In-Stock

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$14.191

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5,801

$14.191

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IDEA Electronic Components Group

UK . 2 parts In-Stock

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$47.503

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$42.753

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2

$47.503

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$42.753

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Component Stockers USA

USA . 923 parts In-Stock

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$56.660

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923

$56.660

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MKK Technologies

India . 1,554 parts In-Stock

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$89.327

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1,554

$89.327

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DigiPath Technology Company

USA . 1,554 parts In-Stock

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$89.327

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$89.327

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Vigor

Singapore . 6,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,123 parts In-Stock

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$56.797

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1,123

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$56.797

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Corphita

USA . 567 parts In-Stock

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567

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Overview

Unlock a world of possibilities with the STM32L151RBH6D by STMicroelectronics, a high-quality microcontroller that offers unparalleled value and benefits. With its advanced technology and industrial-grade components, this Cortex-M3 CPU family device is perfect for a wide range of applications, from IoT devices to consumer electronics. Experience the reliability and performance of STMicroelectronics products and take your projects to the next level with the STM32L151RBH6D.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding unnecessary weight.

Bit Size: 32

Having a 32-bit architecture allows for more complex calculations and faster processing speeds, making the microcontroller efficient for handling intricate tasks.

Maximum Clock Frequency: 32 MHz

A higher clock frequency allows for faster data processing and better performance, making this microcontroller ideal for applications that require quick response times.

ADC Channels: YES

Analog-to-Digital Converter channels allow the microcontroller to convert external analog signals into digital data, enabling it to interface with a wide range of sensors and devices.

No. of I/O Lines: 51

Having a high number of I/O lines provides versatility in connecting to external devices and sensors, making the microcontroller suitable for diverse applications.

ROM Words: 131072

With a large ROM capacity, the microcontroller can store a significant amount of program code and data, enabling it to execute complex algorithms and functions.

RAM Bytes: 16384

Having a sizable RAM allows the microcontroller to efficiently store and access data during program execution, enhancing its overall performance and multitasking capabilities.

Technical Specifications

Microcontrollers STM32L151RBH6D attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C(2), IRDA, SPI(2), USART(3), USB

Peripherals:

BOD, COMPARATOR(2), DMA(7), POR, RTC, TIMER(10)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L151RBH6D Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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