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STM32L151R8H6TR

STMicroelectronics

STM32L151R8H6TR by STMicroelectronics

STM32L151R8H6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 20-Ch 12-Bit ADCs and 2-Ch 12-Bit DACs, suitable for industrial applications requiring high-speed data processing and connectivity via I2C, SPI, USART, and USB interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,346 parts In-Stock

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10,346

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Digiode

USA . 3,722 parts In-Stock

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3,722

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Anansix

USA . 2,302 parts In-Stock

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2,302

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 6,000 parts In-Stock

1+ parts

$3.210

100+ parts

-

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6,000

$3.210

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AZTECH Wire

Italy . 1,082 parts In-Stock

1+ parts

$21.620

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1,082

$21.620

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IDEA Electronic Components Group

UK . 2,252 parts In-Stock

1+ parts

$46.051

100+ parts

-

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$41.446

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-

2,252

$46.051

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$41.446

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MKK Technologies

India . 1,000 parts In-Stock

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$86.595

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1,000

$86.595

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DigiPath Technology Company

USA . 1,000 parts In-Stock

1+ parts

$86.595

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1,000

$86.595

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QUARKTWIN TECHNOLOGY LTD

USA . 10,171 parts In-Stock

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Microchip USA

USA . 4,055 parts In-Stock

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4,055

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Parana Technologies

USA . 2,304 parts In-Stock

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$55.060

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2,304

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$55.060

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Corphita

USA . 1,420 parts In-Stock

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1,420

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Overview

Unleash the power of innovation with the STM32L151R8H6TR microcontroller by STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics delivers cutting-edge technology that exceeds expectations. Ideal for a wide range of applications, this microcontroller offers unparalleled value and benefits to customers. Whether you're looking to enhance your IoT devices, automotive systems, or industrial controls, the STM32L151R8H6TR provides the performance and efficiency you need to stay ahead in today's competitive market. Elevate your projects with the STM32L151R8H6TR and experience the difference that top-tier technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and secure installation of the microcontroller onto circuit boards.

Maximum Supply Voltage: 3.6 V

Can accommodate higher supply voltages, providing flexibility in power requirements.

Package Shape: SQUARE

Square package shape offers efficient use of space on the circuit board.

Bit Size: 32

32-bit architecture allows for faster and more efficient processing of data and instructions.

DAC Channels: YES

Integrated DAC channels enable the microcontroller to produce analog output signals, expanding its functionality.

Power Supplies (V): 2/3.3

Supports multiple power supply options, providing compatibility with various power sources.

No. of Terminals: 64

With 64 terminals, the microcontroller can interface with a wide range of external components and devices.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch enables high-density mounting on PCBs, saving space.

Minimum Supply Voltage: 1.8 V

Can operate at low supply voltages, improving energy efficiency and extending battery life.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial applications where heat may be a factor.

CPU Family: CORTEX-M3

Utilizes ARM Cortex-M3 architecture for efficient and reliable processing performance.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold conditions, suitable for a wide range of environments.

ADC Channels: YES

Integrated ADC channels allow the microcontroller to convert analog signals into digital data for processing.

DMA Channels: YES

Supports Direct Memory Access (DMA) for efficient data transfer and processing, enhancing overall system performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connection to the circuit board.

ROM Words: 65536

With 65536 ROM words, the microcontroller offers ample storage for program instructions and data.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact design and integration into space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Integrated 2-channel 12-bit DACs enable precise control and generation of analog signals.

Width: 5 mm

Compact 5mm width facilitates space-saving design and layout on the PCB.

Data EEPROM Size: 4K

4K data EEPROM size provides non-volatile memory for storing critical system data and parameters.

Peripherals: BOD, COMPARATOR(2), DMA(7), POR, RTC, TIMER(10)

Wide range of built-in peripherals including Brown-Out Detector, Comparators, DMA, Power-On Reset, Real-Time Clock, and Timers enhance system functionality and performance.

Maximum Clock Frequency: 32 MHz

High clock frequency of 32 MHz enables fast processing and execution of instructions.

Length: 5 mm

Compact 5mm length contributes to a small form factor and efficient use of space on the PCB.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliable performance in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers high efficiency and processing power for embedded applications.

RAM Bytes: 10240

10K RAM bytes provide ample memory for temporary data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making it ideal for battery-powered devices.

Terminal Form: BALL

Ball terminal form factor facilitates easy soldering and connection to the circuit board.

Analog To Digital Convertors: 20-Ch 12-Bit

Integrated 20-channel 12-bit ADCs enable high-precision analog signal conversion for accurate data acquisition.

Nominal Supply Voltage: 3 V

3V nominal supply voltage ensures compatibility with standard power sources and voltage levels.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) channels for precise control of analog output signals.

Connectivity: I2C(2), SPI(2), USART(3), USB

Multiple connectivity options including I2C, SPI, USART, and USB allow for flexible communication with external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability enables easy and convenient updating of firmware and program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and efficient use of space on the PCB.

Speed: 32 rpm

Operates at a speed of 32 rpm, suitable for a wide range of real-time control and processing applications.

On Chip Program ROM Width: 8

8-bit width for on-chip program ROM enables efficient storage and retrieval of program instructions.

No. of I/O Lines: 51

With 51 I/O lines, the microcontroller offers ample connectivity for interfacing with external components and peripherals.

Technical Specifications

Microcontrollers STM32L151R8H6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C(2), SPI(2), USART(3), USB

Peripherals:

BOD, COMPARATOR(2), DMA(7), POR, RTC, TIMER(10)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L151R8H6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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