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STM32L151CBU6TR

STMicroelectronics

STM32L151CBU6TR by STMicroelectronics

STM32L151CBU6TR by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 131072 ROM words, and 16384 RAM bytes. It features 14-Ch 12-Bit ADCs, 2-Ch 12-Bit DACs, and peripherals like BOD, RTC, and USB connectivity. Ideal for industrial applications requiring a max clock frequency of 32MHz in a compact chip carrier package style.

Median Price

$2.990

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 2,500 parts In-Stock

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$2.990

2,500

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$2.990

Distributors (In-Stock)

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Chip Stock

USA . 11,082 parts In-Stock

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11,082

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Vyrian

USA . 5,825 parts In-Stock

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Digiode

USA . 2,642 parts In-Stock

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2,642

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Anansix

USA . 403 parts In-Stock

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403

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,211 parts In-Stock

1+ parts

$2.540

100+ parts

-

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-

2,211

$2.540

-

-

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AZTECH Wire

Italy . 273 parts In-Stock

1+ parts

$18.750

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-

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273

$18.750

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IDEA Electronic Components Group

UK . 156 parts In-Stock

1+ parts

$26.666

100+ parts

-

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$24.000

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156

$26.666

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$24.000

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Microchip USA

USA . 3,470 parts In-Stock

1+ parts

$28.622

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3,470

$28.622

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MKK Technologies

India . 1,487 parts In-Stock

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$50.144

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1,487

$50.144

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DigiPath Technology Company

USA . 1,487 parts In-Stock

1+ parts

$50.144

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1,487

$50.144

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Corohmni

South Africa . 83 parts In-Stock

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$58.269

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83

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Component Stockers USA

USA . 1,098 parts In-Stock

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$59.130

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$59.130

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GreenTree Electronics

Israel . 37,500 parts In-Stock

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37,500

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,822 parts In-Stock

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Corphita

USA . 1,427 parts In-Stock

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Argo Parts USA

USA . 1,355 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 141 parts In-Stock

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$31.884

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141

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$31.884

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Overview

Unlock the potential of your next project with the STM32L151CBU6TR microcontroller by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers innovative solutions for a wide range of applications. This microcontroller boasts a 32-bit CPU family, advanced connectivity options, and impressive peripherals like DMA and ADC channels. With a compact design and low power consumption, this device offers exceptional value and performance for industrial-grade projects. Upgrade your designs with the STM32L151CBU6TR and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards.

Maximum Supply Voltage: 3.6 V

Provides a wide range of operating voltages for flexibility in various applications.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities and performance.

DAC Channels: YES

Built-in DAC channels for analog signal processing.

Power Supplies (V): 2/3.3

Supports multiple power supply options for compatibility with different systems.

No. of Terminals: 48

Offers a sufficient number of terminals for connectivity and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Diverse package styles for various mounting and cooling options.

Minimum Supply Voltage: 1.8 V

Supports low voltage operation for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures for reliable performance in harsh environments.

CPU Family: CORTEX-M3

Utilizes the efficient and powerful Cortex-M3 CPU design for optimal performance.

Minimum Operating Temperature: -40 °C

Suitable for operation in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

ADC Channels: YES

Integrated ADC channels for analog signal conversion.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer.

Terminal Position: QUAD

Quad terminal position for secure and stable connections.

ROM Words: 131072

Large ROM capacity for storing program data and code.

Maximum Seated Height: 0.6 mm

Low profile design for compact and space-saving applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Two 12-bit DACs for accurate analog output.

Width: 7 mm

Compact width for fitting into tight spaces.

Data EEPROM Size: 4K

4K EEPROM size for data storage and retrieval.

Peripherals: BOD, COMPARATOR(2), DMA(7), POR, RTC, TIMER(10)

Wide range of peripherals for enhanced functionality and features.

Maximum Clock Frequency: 32 MHz

High clock frequency for fast processing and response times.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for soldering without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for manufacturing processes.

Length: 7 mm

Length suitable for various PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller design for efficient processing.

RAM Bytes: 16384

Large RAM capacity for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness.

Analog To Digital Convertors: 14-Ch 12-Bit

Fourteen 12-bit ADCs for accurate analog signal conversion.

Nominal Supply Voltage: 3 V

Nominal voltage level for stable and reliable operation.

PWM Channels: YES

Pulse Width Modulation channels for precise control of output signals.

Connectivity: I2C(2), SPI(2), USART(3), USB

Multiple connectivity options for versatile interfacing with other devices.

ROM Programmability: FLASH

Flash ROM for easy and flexible program updates.

Terminal Pitch: 0.5 mm

Small terminal pitch for high-density mounting.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating for enhanced moisture resistance during storage and handling.

Speed: 32 rpm

Operating speed of 32 rpm for efficient processing.

On Chip Program ROM Width: 8

8-bit ROM width for optimized program storage.

No. of I/O Lines: 37

Sufficient number of I/O lines for connectivity and interfacing with external devices.

Technical Specifications

Microcontrollers STM32L151CBU6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

4K

Connectivity:

I2C(2), SPI(2), USART(3), USB

Peripherals:

BOD, COMPARATOR(2), DMA(7), POR, RTC, TIMER(10)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L151CBU6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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