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STM32L100RBT6

STMicroelectronics

STM32L100RBT6 by STMicroelectronics

STM32L100RBT6 by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features 2 DAC and 20 ADC channels, along with various peripherals like BOR, CRC, DMA, LCD, and RTC. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 800 parts In-Stock

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800

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Verical

USA . 10 parts In-Stock

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10

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Digiode

USA . 2,071 parts In-Stock

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2,071

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Vyrian

USA . 1,946 parts In-Stock

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Anansix

USA . 1,635 parts In-Stock

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1,635

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Distributors (Availability)

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Vigor

Singapore . 2,000 parts In-Stock

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$6.310

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2,000

$6.310

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AZTECH Wire

Italy . 209 parts In-Stock

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$21.280

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209

$21.280

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Microchip USA

USA . 3,438 parts In-Stock

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$29.464

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3,438

$29.464

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IDEA Electronic Components Group

UK . 1,858 parts In-Stock

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$70.917

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$63.826

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1,858

$70.917

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$63.826

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Component Stockers USA

USA . 699 parts In-Stock

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$99.990

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699

$99.990

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MKK Technologies

India . 1,949 parts In-Stock

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$133.355

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$133.355

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DigiPath Technology Company

USA . 1,949 parts In-Stock

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$133.355

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$133.355

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Perfect Parts

USA . 7,816 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,134 parts In-Stock

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Kepictronics

USA . 5,500 parts In-Stock

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Corphita

USA . 2,576 parts In-Stock

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Parana Technologies

USA . 2,283 parts In-Stock

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$84.792

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Assy Fe

Spain . 1,000 parts In-Stock

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GreenTree Electronics

Israel . 960 parts In-Stock

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Eastek

USA . 958 parts In-Stock

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$5.830

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$5.830

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iodParts Technologies Inc.

India . 704 parts In-Stock

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the STM32L100RBT6 microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics brings you cutting-edge technology packaged in a sleek, low-profile design. This versatile microcontroller is ideal for a wide range of applications, from industrial automation to consumer electronics. With features like DAC channels, ADC channels, and DMA channels, this product offers unmatched functionality and efficiency. Trust STMicroelectronics to deliver excellence in every aspect, making the STM32L100RBT6 the ultimate choice for your next project. Elevate your designs with the best - choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Support for a high maximum supply voltage allows for flexibility in power supply options for different applications.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities and performance for complex tasks and calculations.

ADC Channels: YES

Integrated Analog to Digital Converters enable the microcontroller to interface with analog sensors and signals, expanding its range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions, enhancing the overall performance of the microcontroller.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for faster processing speeds and response times, making the microcontroller suitable for real-time applications.

Technical Specifications

Microcontrollers STM32L100RBT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), CRC, DMA(7), LCD, POR, PWM(4), RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit (2)

Trade Compliance

STM32L100RBT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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