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STM32L083RZT3TR

STMicroelectronics

STM32L083RZT3TR by STMicroelectronics

STM32L083RZT3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 125 °C, and supports up to 64 terminals. With dual 12-bit DACs and extensive connectivity options, it's ideal for automotive applications. Its low power consumption (1.8V-3.6V) ensures efficiency in embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,177 parts In-Stock

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4,177

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Anansix

USA . 1,486 parts In-Stock

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1,486

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Digiode

USA . 616 parts In-Stock

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616

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Distributors (Availability)

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AZTECH Wire

Italy . 1,013 parts In-Stock

1+ parts

$14.870

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1,013

$14.870

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IDEA Electronic Components Group

UK . 149 parts In-Stock

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$25.343

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$22.809

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149

$25.343

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$22.809

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Microchip USA

USA . 2,376 parts In-Stock

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$31.937

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2,376

$31.937

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MKK Technologies

India . 2,265 parts In-Stock

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$47.656

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2,265

$47.656

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DigiPath Technology Company

USA . 2,265 parts In-Stock

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$47.656

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2,265

$47.656

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Corphita

USA . 4,765 parts In-Stock

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4,765

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Parana Technologies

USA . 1,652 parts In-Stock

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$30.302

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1,652

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$30.302

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Overview

Elevate your projects with the STM32L083RZT3TR microcontroller from STMicroelectronics, a trusted leader in innovation. Boasting a unique blend of efficiency and performance, this device is perfect for low-power applications in IoT, healthcare, and automotive sectors. With its advanced features, including multiple ADC/DAC channels and robust connectivity options, it empowers developers to create reliable solutions that thrive under diverse conditions, ensuring long-lasting results and enhanced user experiences.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy materials ensures durability and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and automated assembly.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with low-power systems.

Package Shape: SQUARE

Square package shapes facilitate easier layout design and placement on PCBs.

Bit Size: 32

A 32-bit architecture allows for more powerful processing and handling of complex tasks.

DAC Channels: YES

Having Digital-to-Analog Converter (DAC) channels enables precise control of analog outputs.

No. of Terminals: 64

With 64 terminals, the microcontroller provides ample connectivity options for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style provides a low-profile solution ideal for compact designs.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8V allows for operation in low-power environments.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance makes it suitable for automotive and industrial applications.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family is designed for low power and efficiency, making it ideal for microcontroller applications.

Minimum Operating Temperature: -40 °C

Wide temperature range (-40 °C) ensures reliability in extreme environmental conditions.

ADC Channels: YES

Having Analog-to-Digital Converter (ADC) channels allows for easy interface with sensors.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfers without CPU intervention.

Terminal Position: QUAD

Quad terminal position enhances the connection stability and makes for easier soldering.

ROM Words: 196608

With a substantial ROM capacity, this microcontroller can store more complex programs.

Maximum Seated Height: 1.6 mm

A low seated height allows for more compact PCB designs while maintaining performance.

Digital To Analog Converters: 2-Ch 12-Bit

With 2-channel 12-bit DACs, it offers high-resolution analog output capabilities.

Width: 10 mm

Compact width makes it a suitable choice for space-constrained applications.

Data EEPROM Size: 6K

6K of data EEPROM allows for non-volatile storage of important configuration data.

Peripherals: BOR, COMPARATOR(2), DMA(7), LCD, POR, PWM(5), RTC, TIMER(8), WDT(2)

Extensive peripheral support enhances functionality and versatility in applications.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz ensures efficient processing speed for applications.

Length: 10 mm

The small length of the package makes it easy to integrate into compact electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade components are built to withstand harsh conditions, ensuring long-term reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC architecture microcontroller, it is optimized for high-performance applications with low power consumption.

No. of Timers: 8

Eight timers offer flexible timing solutions, useful for a variety of control applications.

RAM Bytes: 20480

With 20KB of RAM, it allows for substantial data manipulation and storage during operation.

Technology: CMOS

CMOS technology contributes to low power consumption and high efficiency.

Terminal Form: GULL WING

Gull wing terminals enhance soldering process ergonomics and connection reliability.

Analog To Digital Convertors: 16-Ch 12-Bit

16-channel 12-bit ADCs provide versatile analog input options for various applications.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V supports many battery-operated devices, enhancing design flexibility.

No. of DMA Channels: 7

Seven DMA channels improve the efficiency of data transfers in multitasking applications.

PWM Channels: YES

PWM channel support allows for precise control of motors and other devices needing variable power.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Rich connectivity options provide flexibility in interfacing with various devices and protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming of firmware.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for modern dense PCBs, making it compatible with advanced assembly techniques.

Speed: 32 rpm

Speed rating indicates suitability for applications requiring specific output and control performance.

On Chip Program ROM Width: 8

An 8-bit ROM width allows efficient program operation, especially for smaller instruction sets.

No. of I/O Lines: 51

51 I/O lines enable extensive interfacing capabilities with various peripherals and sensors.

Technical Specifications

Microcontrollers STM32L083RZT3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of DMA Channels:

7

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), LCD, POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L083RZT3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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