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STM32L083RZH3

STMicroelectronics

STM32L083RZH3 by STMicroelectronics

STM32L083RZH3 from STMicroelectronics is a 32-bit microcontroller ideal for automotive applications, featuring a max supply voltage of 3.6V and operating temp range of -40 °C to 125 °C. It includes 16 ADC channels and supports multiple connectivity options like I2C and SPI. With its low power consumption and advanced peripherals, it's perfect for energy-efficient designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,557 parts In-Stock

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7,557

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Anansix

USA . 2,672 parts In-Stock

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2,672

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Digiode

USA . 282 parts In-Stock

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282

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Distributors (Availability)

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AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$10.070

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254

$10.070

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Microchip USA

USA . 4,771 parts In-Stock

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$31.434

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4,771

$31.434

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IDEA Electronic Components Group

UK . 670 parts In-Stock

1+ parts

$41.885

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$37.696

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670

$41.885

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$37.696

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MKK Technologies

India . 2,309 parts In-Stock

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$78.762

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2,309

$78.762

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DigiPath Technology Company

USA . 2,309 parts In-Stock

1+ parts

$78.762

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2,309

$78.762

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Corphita

USA . 4,661 parts In-Stock

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4,661

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Parana Technologies

USA . 1,589 parts In-Stock

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$50.080

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1,589

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$50.080

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Overview

Unlock the potential of your next project with the STM32L083RZH3 microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a versatile powerhouse perfect for automotive applications, wearables, and IoT devices. With low power consumption and robust connectivity options, this compact solution maximizes efficiency while minimizing footprint. Elevate your designs and enhance user experiences with cutting-edge technology that drives results!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material increases the longevity and reliability of the microcontroller in diverse applications.

Surface Mount: YES

Surface mount technology facilitates compact design and efficient use of space on circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for safe operation within common voltage limits, making it versatile for various applications.

Package Shape: SQUARE

Square package shape optimizes space and simplifies layout on printed circuit boards.

Bit Size: 32

32-bit architecture offers higher performance and processing capability for complex applications.

DAC Channels: YES

Built-in Digital-to-Analog Converters enable the microcontroller to handle analog signals, enhancing versatility.

No. of Terminals: 64

A high number of terminals allows for extensive connectivity and integration of multiple peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Thin profile and fine pitch design support high-density applications and allow for easy layout in compact spaces.

Minimum Supply Voltage: 1.8 V

Supports low power operation, which is suitable for battery-powered devices, extending their runtime.

Maximum Operating Temperature: 125 °C

High-temperature tolerance makes it suitable for automotive and industrial applications, ensuring reliability in harsh environments.

CPU Family: CORTEX-M0

Energy-efficient CPU family, ideal for low-power applications while maintaining sufficient processing power.

Minimum Operating Temperature: -40 °C

Wide temperature operating range ensures functionality in extreme environmental conditions.

ADC Channels: YES

Integrated Analog-to-Digital Converters provide essential data conversion capabilities, enhancing sensor integration.

DMA Channels: YES

Direct Memory Access channels facilitate efficient data transfer, improving overall processing speed.

Terminal Position: BOTTOM

Bottom terminal positioning aids in heat dissipation and can improve PCB layout options.

ROM Words: 196608

Ample ROM size for storing firmware and applications ensures flexibility in software design.

Maximum Seated Height: 1.2 mm

Low profile design supports compactness in various electronic applications.

Digital To Analog Converters: 2-Ch 12-Bit

High-resolution DACs enable precise analog output, ideal for audio and sensor applications.

Width: 5 mm

Compact width maximizes space efficiency on circuit boards.

Data EEPROM Size: 6K

Sufficient EEPROM size for storing non-volatile data, enhancing device functionality.

Peripherals: BOR, COMPARATOR(2), DMA(7), LCD, POR, PWM(5), RTC, TIMER(8), WDT(2)

Diverse peripheral set allows for complex functionality and versatile applications, facilitating integration and control.

Maximum Clock Frequency: 32 MHz

High clock frequency enables faster processing speed for demanding applications.

Length: 5 mm

Maintains a compact form factor, suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring high reliability and durability in vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance while minimizing power consumption, suitable for embedded systems.

No. of Timers: 8

Multiple timers offer flexibility in timing operations, enhancing control in various applications.

RAM Bytes: 20480

Sufficient RAM for running applications and handling data efficiently, facilitating multi-tasking.

Technology: CMOS

CMOS technology provides high-speed operation and low power consumption, ideal for modern electronics.

Terminal Form: BALL

Ball terminal form factor offers improved thermal performance and mechanical strength.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple high-resolution ADCs allow for extensive analog input processing, ideal for sensor applications.

Nominal Supply Voltage: 3 V

Standard supply voltage that fits well within common power supply parameters for numerous applications.

No. of DMA Channels: 7

Generous number of DMA channels enhances data handling capabilities and processing efficiency.

PWM Channels: YES

Integrated PWM capability allows for control of motors and other applications requiring analog control.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Rich connectivity options enable seamless communication with various peripherals and devices.

ROM Programmability: FLASH

Flash programmable ROM allows for easy updates and adaptability of firmware, ensuring long-term usability.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for higher density pin layouts on PCBs, enabling more complex designs.

Speed: 32 rpm

Provides consistent performance in applications requiring precise speed control.

On Chip Program ROM Width: 8

8-bit width for program ROM optimizes data handling within the microcontroller.

No. of I/O Lines: 51

Extensive I/O lines enable greater interaction with external components, making it highly configurable for various tasks.

Technical Specifications

Microcontrollers STM32L083RZH3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of DMA Channels:

7

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), LCD, POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L083RZH3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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