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STM32L072V8T6

STMicroelectronics

STM32L072V8T6 by STMicroelectronics

STM32L072V8T6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 100 terminals. With integrated ADC/DAC channels and multiple connectivity options, it's ideal for low-power industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 960 parts In-Stock

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960

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Vyrian

USA . 6,445 parts In-Stock

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6,445

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Anansix

USA . 1,016 parts In-Stock

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1,016

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ComSIT Distribution GmbH

Germany . 720 parts In-Stock

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720

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Digiode

USA . 649 parts In-Stock

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649

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Vigor

Singapore . 4,570 parts In-Stock

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$3.390

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4,570

$3.390

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AZTECH Wire

Italy . 43 parts In-Stock

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$17.860

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43

$17.860

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Microchip USA

USA . 1,459 parts In-Stock

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$28.216

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1,459

$28.216

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IDEA Electronic Components Group

UK . 2,310 parts In-Stock

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$77.096

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$69.386

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2,310

$77.096

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$69.386

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MKK Technologies

India . 2,147 parts In-Stock

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$144.974

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2,147

$144.974

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DigiPath Technology Company

USA . 2,147 parts In-Stock

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$144.974

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2,147

$144.974

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QUARKTWIN TECHNOLOGY LTD

USA . 22,862 parts In-Stock

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Corphita

USA . 2,439 parts In-Stock

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Perfect Parts

USA . 1,008 parts In-Stock

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Glotronic Ltd.

UK . 769 parts In-Stock

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769

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Parana Technologies

USA . 427 parts In-Stock

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$92.180

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427

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$92.180

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Overview

Unlock innovation with the STM32L072V8T6 microcontroller from STMicroelectronics, a trusted leader in semiconductor solutions. This powerhouse combines efficiency and versatility, ideal for IoT devices, wearable technology, and industrial automation. Enjoy lower energy consumption without sacrificing performance, enabling longer battery life and seamless connectivity. Choose STM32L072V8T6 for superior quality and advanced features that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material provides reliability and protection against environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for easy integration into compact designs, reducing PCB space usage and enabling automated assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different projects and applications.

Package Shape: SQUARE

Square package shape optimizes space on the PCB, allowing for denser component placement.

Bit Size: 32

The 32-bit architecture enhances processing power, enabling the handling of complex tasks and improving performance in applications.

DAC Channels: YES

On-board DAC channels facilitate analog output, making it suitable for applications that require precise voltage outputs.

No. of Terminals: 100

A higher number of terminals provide extensive connectivity options, enabling a larger number of peripherals and functions.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

A flatpack style enables easy mounting on PCBs, while the low-profile and fine pitch design enhances compatibility with high-density layouts.

Minimum Supply Voltage: 1.8 V

With the ability to operate at a low supply voltage, this microcontroller is energy-efficient and suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

A high operating temperature range ensures durability and reliability in challenging industrial environments.

CPU Family: CORTEX-M0

The ARM Cortex-M0 provides efficient performance with low power consumption, making it ideal for embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold temperatures makes this microcontroller perfect for outdoor and harsh environment applications.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, simplifying the design and reducing the need for external components.

DMA Channels: YES

Presence of direct memory access (DMA) channels enhances data transfer efficiency, reducing CPU load and improving overall system performance.

Terminal Position: QUAD

Quad terminal position ensures stable mounting and reliable connections, which is essential for maintaining signal integrity.

ROM Words: 65536

A large amount of ROM allows for extensive program storage, enabling the microcontroller to handle sophisticated software applications.

Maximum Seated Height: 1.6 mm

Low seated height facilitates better thermal management and reduces the overall profile of the device, ideal for compact designs.

Digital To Analog Convertors: 2-Ch 12-Bit

The presence of dual 12-bit DACs enables high-resolution analog signal generation, useful in audio and control applications.

Width: 14 mm

Compact width is beneficial for space-constrained designs, allowing for more efficient layout on PCBs.

Data EEPROM Size: 3K

Adequate EEPROM size for data storage ensures flexible non-volatile data management, useful in applications requiring configurable parameters.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Rich set of peripherals enhances functionality and allows designers to implement complex features with fewer external components.

Maximum Clock Frequency: 32 MHz

A robust clock frequency allows for faster processing and execution of tasks, thus improving the microcontroller's performance.

Length: 14 mm

Short length contributes to more compact PCB designs, facilitating integration into smaller electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies reliability in harsh conditions, making it suitable for manufacturing and outdoor applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient instruction execution, leading to better performance in processing tasks.

No. of Timers: 8

Multiple timers provide various timing and event management capabilities, essential for controlling processes in real-time applications.

RAM Bytes: 20480

Adequate RAM size supports complex data structures and algorithms, enhancing the versatility of the applications you can develop.

Technology: CMOS

CMOS technology contributes to lower power consumption and higher integration, making it ideal for portable and energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering properties, enhancing manufacturing reliability and facilitating easy assembly.

Analog To Digital Convertors: 16-Ch 12-Bit

High-channel ADCs reduce the need for multiple devices, allowing for complex sensing capabilities with minimal footprint.

Nominal Supply Voltage: 3 V

Operating on a nominal supply voltage of 3 V indicates compatibility with commonly used power sources in many applications.

No. of DMA Channels: 7

Multiple DMA channels allow for handling data efficiently while minimizing CPU interruption, significantly enhancing system performance.

PWM Channels: YES

Integrated PWM channels enable precise control in motor drivers, LED dimming, and other applications requiring modulation of power.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Extensive connectivity options provide flexibility in interfacing with various devices, simplifying integration into a wide range of applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming, making it adaptable for evolving project needs.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables greater density on the PCB, allowing for compact designs while maintaining connection reliability.

Speed: 32 rpm

A maximum speed of 32 rpm may indicate suitability for specific applications, such as monitoring and control tasks in slower processes.

On Chip Program ROM Width: 8

An 8-bit ROM width ensures compatibility with existing data structures and coding practices, enhancing ease of software development.

No. of I/O Lines: 84

A high count of I/O lines supports a wide range of input and output operations, facilitating complex interactions with various peripherals.

Technical Specifications

Microcontrollers STM32L072V8T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of DMA Channels:

7

No. of I/O Lines:

84

No. of Terminals:

100

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

3K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L072V8T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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