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STM32L072RBH6TR

STMicroelectronics

STM32L072RBH6TR by STMicroelectronics

STM32L072RBH6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 64 terminals. With integrated ADC/DAC channels and multiple connectivity options, it's ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,134 parts In-Stock

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3,134

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Vyrian

USA . 2,338 parts In-Stock

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2,338

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Anansix

USA . 1,052 parts In-Stock

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1,052

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Velocity Electronics

USA . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

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Vigor

Singapore . 1,764 parts In-Stock

1+ parts

$2.870

100+ parts

-

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1,764

$2.870

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AZTECH Wire

Italy . 878 parts In-Stock

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$14.120

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878

$14.120

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Microchip USA

USA . 5,241 parts In-Stock

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$22.318

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$22.318

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Component Stockers USA

USA . 2,276 parts In-Stock

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$47.230

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2,276

$47.230

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IDEA Electronic Components Group

UK . 882 parts In-Stock

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$74.561

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$67.105

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882

$74.561

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$67.105

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MKK Technologies

India . 1,651 parts In-Stock

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$140.208

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1,651

$140.208

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DigiPath Technology Company

USA . 1,651 parts In-Stock

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$140.208

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1,651

$140.208

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Corphita

USA . 4,239 parts In-Stock

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4,239

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 71 parts In-Stock

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$89.150

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71

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$89.150

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Overview

Unlock the power of innovation with the STM32L072RBH6TR microcontroller from STMicroelectronics! Renowned for their commitment to quality, STMicroelectronics delivers a versatile solution perfect for IoT applications, wearable devices, and industrial automation. With its ultra-low power consumption and rich set of integrated features, this microcontroller empowers developers to create efficient, high-performance products that stand out in today’s competitive market. Embrace reliability and excellence for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight package material ensures reliable performance in various applications.

Surface Mount: YES

Allows for space-saving design and facilitates high-density PCB manufacturing.

Maximum Supply Voltage: 3.6 V

Compatible with low-power applications, extending battery life in portable devices.

Package Shape: SQUARE

Uniform shape simplifies PCB design and assembly.

Bit Size: 32

Capable of processing large data sets and performing complex calculations efficiently.

DAC Channels: YES

Enables analog signal generation for audio and control applications.

No. of Terminals: 64

Provides ample connections for interface and peripheral support.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Facilitates a compact design with high-speed performance characteristics.

Minimum Supply Voltage: 1.8 V

Effective for low-voltage applications, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with higher thermal tolerance.

CPU Family: CORTEX-M0

High-performance architecture optimized for low-power and cost-sensitive applications.

Minimum Operating Temperature: -40 °C

Ideal for use in extreme environments, such as automotive or industrial settings.

ADC Channels: YES

Allows for precise analog signal measurements, beneficial for sensor applications.

DMA Channels: YES

Improves data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: BOTTOM

Facilitates easier soldering and assembly processes in flat applications.

ROM Words: 131072

Sufficient memory capacity for storing complex firmware and application code.

Maximum Seated Height: 1.2 mm

Thin profile design supports compact PCB layout and design.

Digital To Analog Converters: 2-Ch 12-Bit

Offers high-resolution analog output for superior performance in various signal generation tasks.

Width: 5 mm

Compact size allows for integration in space-constrained applications.

Data EEPROM Size: 6K

Sufficient memory for non-volatile data storage, ensuring information retention after power loss.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Rich set of peripherals enhances versatility for various application scenarios.

Maximum Clock Frequency: 32 MHz

Provides a good balance between power consumption and processing power for demanding applications.

Length: 5 mm

Compact dimensions cater to tight spaces in electronic designs.

Temperature Grade: INDUSTRIAL

Engineered for robust performance in harsh environments, ensuring reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient instruction set leads to higher performance per watt.

No. of Timers: 8

Multiple timers allow for precise time management in various applications.

RAM Bytes: 20480

Ample RAM supports complex applications and real-time data processing.

Technology: CMOS

Low power consumption technology extends battery life and overall efficiency.

Terminal Form: BALL

Ball grid array enhances electrical performance and thermal dissipation.

Analog To Digital Converters: 15-Ch 12-Bit

High channel count and resolution for intricate analog signal processing requirements.

Nominal Supply Voltage: 3 V

Standard voltage level for compatibility with common power sources.

No. of DMA Channels: 7

Multiple DMA channels enhance data throughput efficiency for complex operations.

PWM Channels: YES

Versatile PWM capabilities are useful in motor control and signal modulation.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Diverse connectivity options enable easy integration with various peripherals and communication protocols.

ROM Programmability: FLASH

Reprogrammable flash memory simplifies firmware updates and allows for iterative development.

Terminal Pitch: 0.5 mm

Fine pitch design facilitates high-density component placement on PCBs.

Speed: 32 rpm

Provides efficient performance suitable for high-speed applications.

On Chip Program ROM Width: 8

Optimized data width for performance-critical applications enabling efficient data manipulation.

No. of I/O Lines: 50

Generous I/O capacity supports diverse functionalities and external component interfacing.

Technical Specifications

Microcontrollers STM32L072RBH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of DMA Channels:

7

No. of I/O Lines:

50

No. of Terminals:

64

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

15-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L072RBH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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