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STM32L072RBH6

STMicroelectronics

STM32L072RBH6 by STMicroelectronics

STM32L072RBH6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 64 terminals. With integrated ADC/DAC channels and multiple connectivity options, it's ideal for low-power industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$1.774

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 3,840 parts In-Stock

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$1.774

3,840

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$1.774

Distributors (In-Stock)

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Vyrian

USA . 2,421 parts In-Stock

1+ parts

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2,421

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Anansix

USA . 2,405 parts In-Stock

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2,405

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Digiode

USA . 147 parts In-Stock

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147

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Distributors (Availability)

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Vigor

Singapore . 1,762 parts In-Stock

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$2.870

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1,762

$2.870

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AZTECH Wire

Italy . 693 parts In-Stock

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$13.760

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693

$13.760

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Microchip USA

USA . 5,269 parts In-Stock

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$22.318

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5,269

$22.318

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IDEA Electronic Components Group

UK . 107 parts In-Stock

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$60.591

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$54.532

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107

$60.591

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$54.532

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MKK Technologies

India . 749 parts In-Stock

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$113.938

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749

$113.938

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DigiPath Technology Company

USA . 749 parts In-Stock

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$113.938

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749

$113.938

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 1,394 parts In-Stock

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1,394

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Parana Technologies

USA . 637 parts In-Stock

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$72.446

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637

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$72.446

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Overview

Unlock innovation with the STM32L072RBH6 microcontroller from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. Designed for ultra-low power applications, this versatile chip excels in embedded systems, IoT devices, and industrial automation. With its robust performance and rich feature set, it empowers developers to create efficient and reliable products, driving your projects forward while maximizing energy savings and operational efficiency. Experience seamless integration and peace of mind with ST’s commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures longevity and reliability in various operating environments.

Surface Mount: YES

Facilitates easy integration into compact designs and modern PCBs.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with numerous low-power applications, enhancing energy efficiency.

Package Shape: SQUARE

Optimized shape for space-saving designs and efficient thermal performance.

Bit Size: 32

Offers a balance of performance and power for complex applications.

DAC Channels: YES

Provides the ability to generate analog signals, making it versatile for various applications.

No. of Terminals: 64

A higher terminal count allows for more I/O options, supporting more complex functionalities.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Ensures efficient use of space on PCBs while maintaining high performance.

Minimum Supply Voltage: 1.8 V

Broad supply voltage range enhances compatibility with various power systems and eco-friendly designs.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperatures are prevalent, ensuring reliability.

CPU Family: CORTEX-M0

Strong core architecture with low power consumption, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Operates efficiently in extreme conditions, suitable for high-demand environments.

ADC Channels: YES

Enables digital conversion of analog signals, essential for data acquisition in real-time applications.

DMA Channels: YES

Improves data handling efficiency by allowing peripherals to transfer data without CPU intervention.

Terminal Position: BOTTOM

Allows for enhanced connectivity options in surface-mount technology layouts.

ROM Words: 131072

Ample ROM contributes to complex firmware implementations, enhancing functionalities.

Maximum Seated Height: 1.2 mm

Low profile design ensures compatibility with compact designs and multi-layer PCBs.

Digital To Analog Convertors: 2-Ch 12-Bit

Supports precise analog output, making it suitable for audio and control applications.

Width: 5 mm

Compact size allows for integration into space-constrained applications.

Data EEPROM Size: 6K

Facilitates data retention for configurations or parameters, making it user-friendly.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Integrated peripherals provide extensive functionality, reducing the need for additional components.

Maximum Clock Frequency: 32 MHz

Allows for fast processing speeds, enhancing application performance.

Length: 5 mm

Compact size makes it versatile for PCB layout designs.

Temperature Grade: INDUSTRIAL

Perfect for demanding industrial applications requiring toughness and reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture promotes efficient instruction processing, contributing to overall performance.

No. of Timers: 8

Supports complex timing applications, ideal for control systems and automation.

RAM Bytes: 20480

Generous RAM size supports complex data processing and multiple applications running concurrently.

Technology: CMOS

Low power consumption characteristic makes it ideal for battery-operated devices.

Terminal Form: BALL

Provides a reliable connection for high-density applications and easier soldering.

Analog To Digital Convertors: 15-Ch 12-Bit

High channel count for A/D conversion facilitates extensive data sampling for various sensors.

Nominal Supply Voltage: 3 V

Compatible with standard voltage levels, simplifying the power supply design.

No. of DMA Channels: 7

Facilitates efficient data transfers between peripherals, enhancing system performance.

PWM Channels: YES

Ideal for motor control and other applications requiring pulse width modulation.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Diverse connectivity options provide flexibility for integration into various communication protocols.

ROM Programmability: FLASH

Reprogrammable ROM allows for updates and flexibility in application development.

Terminal Pitch: 0.5 mm

Fine pitch allows for the design of compact and high-density circuit boards.

Speed: 32 rpm

Suitable for real-time applications where speed is a critical factor.

On Chip Program ROM Width: 8

Enables efficient memory usage, assisting in minimizing the footprint of applications.

No. of I/O Lines: 50

High number of I/O lines supports complex input/output configurations, increasing versatility.

Technical Specifications

Microcontrollers STM32L072RBH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of DMA Channels:

7

No. of I/O Lines:

50

No. of Terminals:

64

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

15-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L072RBH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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