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STM32L072CBU6

STMicroelectronics

STM32L072CBU6 by STMicroelectronics

STM32L072CBU6 by STMicroelectronics is a 32-bit microcontroller with 37 I/O lines, 25 MHz clock frequency, and ADC/DMA channels. It operates b/w 1.8V to 3.6V, making it suitable for low-power applications like IoT devices and wearables due to its compact square package shape of 7mm x 7mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 1,560 parts In-Stock

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1,560

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EBV Elektronik

Germany . 780 parts In-Stock

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780

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Vyrian

USA . 3,594 parts In-Stock

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3,594

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Digiode

USA . 1,370 parts In-Stock

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1,370

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Anansix

USA . 712 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Vigor

Singapore . 1,121 parts In-Stock

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$2.680

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$2.680

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AZTECH Wire

Italy . 1,218 parts In-Stock

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$14.140

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$14.140

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Ampacity Inc.

Singapore . 1,356 parts In-Stock

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$18.000

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$18.000

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Microchip USA

USA . 2,999 parts In-Stock

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$21.440

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$21.440

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IDEA Electronic Components Group

UK . 982 parts In-Stock

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$31.593

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$28.434

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982

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Aztec Data Supply Inc.

USA . 2,369 parts In-Stock

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$38.220

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2,369

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Corohmni

South Africa . 28 parts In-Stock

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$55.761

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MKK Technologies

India . 1,516 parts In-Stock

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$59.408

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DigiPath Technology Company

USA . 1,516 parts In-Stock

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$59.408

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Continental Prestige Electronics

USA . 4,267 parts In-Stock

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Corphita

USA . 3,476 parts In-Stock

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Argo Parts USA

USA . 2,357 parts In-Stock

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Parana Technologies

USA . 2,165 parts In-Stock

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$37.774

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$37.774

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unlock endless possibilities with the STM32L072CBU6 microcontroller from STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics delivers cutting-edge technology that is perfect for a wide range of applications. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, this microcontroller offers unmatched value with its advanced features like ADC and DMA channels, PWM capabilities, and high clock frequency. Embrace innovation and streamline your projects with the STM32L072CBU6 today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making the product suitable for mass production.

Maximum Supply Voltage: 3.6 V

Can operate at a relatively high voltage, providing flexibility in power supply options.

Package Shape: SQUARE

Square packages are compact and space-saving, ideal for applications where size is a constraint.

Bit Size: 32

32-bit processing capability offers high performance and efficiency in handling complex tasks.

No. of Terminals: 48

Ample terminals provide connectivity options for various external components and peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package style options allow for effective heat dissipation and compact design.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage enables power-efficient operation and extends battery life.

ADC Channels: YES

Integrated ADC channels simplify analog signal processing tasks in the product.

DMA Channels: YES

Support for DMA channels enhances data transfer speed and efficiency in the microcontroller.

Terminal Position: QUAD

Quad terminal positioning facilitates easier and organized PCB layout and routing.

Width: 7 mm

Compact width dimension allows for space-efficient placement on the PCB.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast processing and responsiveness in real-time applications.

Length: 7 mm

Short length dimension contributes to a small footprint and tight PCB integration.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient and streamlined execution of instructions, enhancing performance.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures product safety.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage supports consistent and reliable operation of the microcontroller.

PWM Channels: YES

Integrated PWM channels enable precise control over connected devices and peripherals.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and interconnection in space-constrained designs.

Speed: 32 rpm

Operational speed of 32 rpm indicates fast processing capability for rapid task execution.

No. of I/O Lines: 37

Abundance of I/O lines offers versatile connectivity options for external communication and control.

Technical Specifications

Microcontrollers STM32L072CBU6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

37

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L072CBU6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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