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STM32L071KZU6TR

STMicroelectronics

STM32L071KZU6TR by STMicroelectronics

STM32L071KZU6TR by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 32 MHz. It features 23 I/O lines, 8 timers, and connectivity options like I2C, SPI, and USART. Ideal for industrial applications requiring low power consumption and high performance in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,633 parts In-Stock

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6,633

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Digiode

USA . 2,079 parts In-Stock

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2,079

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Anansix

USA . 1,526 parts In-Stock

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1,526

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Nova Conductors

Japan . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 750 parts In-Stock

1+ parts

$4.000

100+ parts

-

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-

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-

750

$4.000

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Semicontronic

India . 1,637 parts In-Stock

1+ parts

$15.000

100+ parts

$14.625

1k+ parts

$14.550

10k+ parts

-

1,637

$15.000

$14.625

$14.550

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AZTECH Wire

Italy . 279 parts In-Stock

1+ parts

$19.599

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279

$19.599

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Microchip USA

USA . 5,790 parts In-Stock

1+ parts

$20.600

100+ parts

$20.470

1k+ parts

$20.410

10k+ parts

$20.340

5,790

$20.600

$20.470

$20.410

$20.340

Aztec Data Supply Inc.

USA . 3,298 parts In-Stock

1+ parts

$51.580

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-

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3,298

$51.580

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IDEA Electronic Components Group

UK . 2,216 parts In-Stock

1+ parts

$69.126

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-

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$62.213

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2,216

$69.126

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$62.213

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Corohmni

South Africa . 163 parts In-Stock

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$69.599

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163

$69.599

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MKK Technologies

India . 2,218 parts In-Stock

1+ parts

$129.987

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2,218

$129.987

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DigiPath Technology Company

USA . 2,218 parts In-Stock

1+ parts

$129.987

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2,218

$129.987

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Continental Prestige Electronics

USA . 6,887 parts In-Stock

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Argo Parts USA

USA . 4,860 parts In-Stock

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4,860

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Corphita

USA . 2,161 parts In-Stock

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2,161

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Parana Technologies

USA . 2,156 parts In-Stock

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$82.651

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2,156

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$82.651

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Advanced Electronics

New Zealand . 58 parts In-Stock

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58

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unlock the power of innovation with the STM32L071KZU6TR microcontroller by STMicroelectronics. This cutting-edge device offers unmatched quality and reliability, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers exceptional performance and efficiency. With its advanced features and versatile connectivity options, the STM32L071KZU6TR provides endless possibilities for your next project. Experience the value and benefits of choosing STMicroelectronics for all your microcontroller needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.6 V

Wide range of supply voltage allows for flexibility in power source options.

Package Shape: SQUARE

Square package shape provides better space utilization on the PCB.

Bit Size: 32

32-bit architecture enables high-performance computing and processing capabilities.

No. of Terminals: 32

Sufficient number of terminals for connecting to various external components and peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer versatility in mounting options for different applications.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage enables power-efficient operation and extends battery life.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the product suitable for industrial environments with wide temperature ranges.

CPU Family: CORTEX-M0

Cortex-M0 architecture provides a good balance between cost and performance for various embedded applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance in harsh environmental conditions.

ADC Channels: YES

Analog-to-digital converter (ADC) channels enable the microcontroller to interface with sensors and analog devices.

DMA Channels: YES

Direct memory access (DMA) channels improve data transfer efficiency and offload the CPU when handling data-intensive tasks.

Terminal Position: QUAD

Quad terminal position offers easy integration and PCB layout for effective signal routing.

ROM Words: 196608

Large ROM capacity allows for storing program code, firmware, and data for complex applications.

Maximum Seated Height: 0.6 mm

Low seated height facilitates compact and slim device designs.

Width: 5 mm

Compact width allows for space-efficient placement on the PCB.

Peripherals: BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

Multiple built-in peripherals offer additional functionality for various application requirements.

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast processing and operation for real-time applications.

Length: 5 mm

Compact length complements the square package shape and aids in PCB layout optimization.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient processing and control capabilities for embedded systems.

No. of Timers: 8

Multiple timers allow for precise timing and scheduling of tasks in the microcontroller.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: NO LEAD

No-lead terminal form improves thermal performance and solder joint reliability.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent performance of the microcontroller.

No. of DMA Channels: 7

Multiple DMA channels facilitate efficient data transfer and processing in the microcontroller.

PWM Channels: YES

Pulse-width modulation (PWM) channels enable precise control of output signals for motor control and other applications.

Connectivity: I2C(3), I2S, LPUART, SPI(6), USART(4)

Various connectivity options allow for easy interfacing with external devices and peripherals.

ROM Programmability: FLASH

Flash programmability enables easy and flexible updating of firmware and software in the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for dense packing and routing of signals on the PCB.

Speed: 32 rpm

High speed capability enables rapid execution of instructions and tasks in the microcontroller.

On Chip Program ROM Width: 8

Wide on-chip program ROM width accommodates large program code and data storage requirements.

No. of I/O Lines: 23

Sufficient number of I/O lines for connecting to external devices and peripherals in embedded applications.

Technical Specifications

Microcontrollers STM32L071KZU6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of DMA Channels:

7

No. of I/O Lines:

23

No. of Terminals:

32

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Connectivity:

I2C(3), I2S, LPUART, SPI(6), USART(4)

Peripherals:

BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

Trade Compliance

STM32L071KZU6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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