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STM32L071KBU6TR

STMicroelectronics

STM32L071KBU6TR by STMicroelectronics

STM32L071KBU6TR by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, operating at a max frequency of 32 MHz. It features 23 I/O lines, 8 timers, and connectivity options like I2C, SPI, and USART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$1.930

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,188 parts In-Stock

1+ parts

-

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-

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-

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$1.930

1,188

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-

$1.930

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$3.740

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$3.740

-

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-

Chip Stock

USA . 30,063 parts In-Stock

1+ parts

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30,063

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Vyrian

USA . 7,893 parts In-Stock

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7,893

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Anansix

USA . 2,884 parts In-Stock

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2,884

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Digiode

USA . 2,300 parts In-Stock

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2,300

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ComSIT Distribution GmbH

Germany . 292 parts In-Stock

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292

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Distributors (Availability)

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Semicontronic

India . 1,175 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,175

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 1,697 parts In-Stock

1+ parts

$2.210

100+ parts

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1,697

$2.210

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Vigor

Singapore . 8,190 parts In-Stock

1+ parts

$2.230

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8,190

$2.230

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Continental Prestige Electronics

USA . 6,769 parts In-Stock

1+ parts

$3.740

100+ parts

-

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$3.665

6,769

$3.740

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-

$3.665

Argo Parts USA

USA . 3,325 parts In-Stock

1+ parts

$3.740

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-

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3,325

$3.740

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Netroflash

USA . 50 parts In-Stock

1+ parts

$3.740

100+ parts

-

1k+ parts

$3.553

10k+ parts

$3.478

50

$3.740

-

$3.553

$3.478

AZTECH Wire

Italy . 782 parts In-Stock

1+ parts

$14.280

100+ parts

-

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782

$14.280

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Microchip USA

USA . 4,711 parts In-Stock

1+ parts

$18.302

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4,711

$18.302

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Corohmni

South Africa . 266 parts In-Stock

1+ parts

$20.168

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266

$20.168

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Aztec Data Supply Inc.

USA . 491 parts In-Stock

1+ parts

$57.820

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491

$57.820

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IDEA Electronic Components Group

UK . 1,897 parts In-Stock

1+ parts

$60.813

100+ parts

-

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$54.732

10k+ parts

-

1,897

$60.813

-

$54.732

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$87.412

100+ parts

$83.041

1k+ parts

$83.041

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-

2,500

$87.412

$83.041

$83.041

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MKK Technologies

India . 2,114 parts In-Stock

1+ parts

$114.355

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2,114

$114.355

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DigiPath Technology Company

USA . 2,114 parts In-Stock

1+ parts

$114.355

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-

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2,114

$114.355

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QUARKTWIN TECHNOLOGY LTD

USA . 28,547 parts In-Stock

1+ parts

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28,547

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Lixinc

USA . 5,294 parts In-Stock

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5,294

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Corphita

USA . 4,086 parts In-Stock

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4,086

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Parana Technologies

USA . 2,120 parts In-Stock

1+ parts

-

100+ parts

$72.711

1k+ parts

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2,120

-

$72.711

-

-

Overview

Experience cutting-edge technology with the STM32L071KBU6TR microcontroller from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality products that exceed expectations. This microcontroller offers a wide range of applications, providing customers with versatile solutions for their projects. With its high performance and advanced features, the STM32L071KBU6TR ensures reliable operation and increased efficiency. Trust STMicroelectronics to deliver innovation and value with every product, making your projects stand out from the rest. Elevate your designs with the STM32L071KBU6TR and experience unparalleled quality and performance.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient integration of the microcontroller into circuit boards, making it a convenient choice for manufacturing.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V offers versatility in power supply options for the device, increasing its compatibility with various systems.

Package Shape: SQUARE

The square package shape helps in optimizing the use of space on the circuit board, making it a compact and efficient choice for designs with space constraints.

Bit Size: 32

The 32-bit architecture provides high computational power and efficiency, making it suitable for handling complex tasks and applications.

No. of Terminals: 32

A higher number of terminals enable more connectivity options and interfaces, allowing for greater flexibility in design and functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offered cater to different application needs, providing options for thermal management and space-saving requirements.

Minimum Supply Voltage: 1.8 V

Support for a low minimum supply voltage allows for efficient power consumption and operation in energy-efficient designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability and performance in various environmental conditions, making it suitable for industrial applications.

CPU Family: CORTEX-M0

Belonging to the Cortex-M0 family signifies a high level of energy efficiency and performance optimization, suitable for battery-powered and cost-sensitive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures stable and reliable operation even in harsh cold environments, increasing the device's versatility.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to interface with analog sensors and signals, broadening its application range.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency and offload the CPU, enhancing overall system performance and responsiveness.

Terminal Position: QUAD

Quad terminal positioning facilitates easier PCB layout and soldering, streamlining the assembly process and improving reliability.

ROM Words: 131072

With a large ROM capacity of 131072 words, the microcontroller can store extensive program code and data, supporting complex applications.

Maximum Seated Height: 0.6 mm

The low seated height allows for a slim and compact design, suitable for space-constrained applications in consumer electronics and IoT devices.

Width: 5 mm

The compact width dimension enables space-efficient placement on the PCB, contributing to overall miniaturization and integration capabilities of the design.

Peripherals: BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

A rich set of peripherals including Brown-Out Reset (BOR), Comparator, DMA, Power-On Reset (POR), Real-Time Clock (RTC), Timers, and Watchdog Timer (WDT) enhance the microcontroller's functionality and versatility for diverse applications.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency of 32 MHz provides fast processing speeds and high-performance capabilities, suitable for real-time processing and responsiveness.

Length: 5 mm

The compact length dimension makes the microcontroller suitable for small form factor designs, contributing to space-saving and integration in tight spaces.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making the microcontroller suitable for rugged applications with demanding temperature requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and optimized instruction execution, improving performance and power efficiency in embedded applications.

No. of Timers: 8

The availability of 8 timers provides precise timing control for various functions and tasks, enhancing the microcontroller's capabilities in applications requiring time-sensitive operations.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the PCB assembly process and reduces soldering defects, increasing manufacturing yield and reliability.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage standardizes power requirements and compatibility with other components, simplifying design considerations and integration.

No. of DMA Channels: 7

The availability of 7 DMA channels enables efficient data transfer and management, reducing CPU overhead and enhancing system performance.

PWM Channels: YES

Pulse Width Modulation (PWM) channels support precise control of analog signals, making the microcontroller suitable for applications requiring accurate voltage or power modulation.

Connectivity: I2C(3), I2S, LPUART, SPI(6), USART(4)

A wide range of connectivity options such as I2C, I2S, LPUART, SPI, and USART facilitate communication with external devices and peripherals, enhancing the microcontroller's versatility and interoperability.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates, simplifying maintenance and software upgrades for the microcontroller-based system.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting on the PCB, supporting compact designs with multiple components in a limited space.

Speed: 32 rpm

The high processing speed of 32 revolutions per minute (rpm) ensures efficient and responsive operation, meeting the performance requirements of dynamic applications.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM allows for efficient and optimized program storage, enhancing the execution speed and performance of the microcontroller's firmware.

No. of I/O Lines: 23

The presence of 23 Input/Output (I/O) lines provides ample connectivity options for interfacing with external devices and peripherals, expanding the microcontroller's application capabilities.

Technical Specifications

Microcontrollers STM32L071KBU6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of DMA Channels:

7

No. of I/O Lines:

23

No. of Terminals:

32

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Connectivity:

I2C(3), I2S, LPUART, SPI(6), USART(4)

Peripherals:

BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

Trade Compliance

STM32L071KBU6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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