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STM32L071CZT7

STMicroelectronics

STM32L071CZT7 by STMicroelectronics

STM32L071CZT7 from STMicroelectronics is a 32-bit microcontroller featuring a max supply voltage of 3.6V, an operating temp range of -40 °C to 105 °C, and 48 terminals. Ideal for industrial applications, it supports various connectivity options like I2C and SPI. With integrated ADC and DMA channels, it's perfect for low-power embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,624 parts In-Stock

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11,624

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Digiode

USA . 3,446 parts In-Stock

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3,446

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Anansix

USA . 982 parts In-Stock

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982

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Distributors (Availability)

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Vigor

Singapore . 5,314 parts In-Stock

1+ parts

$3.150

100+ parts

-

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5,314

$3.150

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AZTECH Wire

Italy . 302 parts In-Stock

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$12.350

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302

$12.350

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Microchip USA

USA . 2,514 parts In-Stock

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$24.202

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2,514

$24.202

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IDEA Electronic Components Group

UK . 1,468 parts In-Stock

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$29.846

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$26.861

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1,468

$29.846

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$26.861

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MKK Technologies

India . 2,080 parts In-Stock

1+ parts

$56.123

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2,080

$56.123

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DigiPath Technology Company

USA . 2,080 parts In-Stock

1+ parts

$56.123

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2,080

$56.123

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Perfect Parts

USA . 736,131 parts In-Stock

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736,131

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Eastek

USA . 21,500 parts In-Stock

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21,500

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QUARKTWIN TECHNOLOGY LTD

USA . 11,913 parts In-Stock

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11,913

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Futuretech Components

Singapore . 5,600 parts In-Stock

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5,600

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Parana Technologies

USA . 2,037 parts In-Stock

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$35.685

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2,037

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$35.685

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Corphita

USA . 136 parts In-Stock

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136

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Overview

Unlock the power of innovation with the STM32L071CZT7 microcontroller from STMicroelectronics, a leader in cutting-edge technology. Renowned for its unmatched quality and reliability, this versatile chip excels in low-power applications, making it ideal for wearables, IoT devices, and industrial automation. Experience seamless connectivity and rich functionalities that empower your designs while ensuring enhanced performance, reduced energy consumption, and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material offers good protection against environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easier integration into compact designs, enabling smaller and more efficient electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V is ideal for low-power applications, ensuring long battery life while providing sufficient performance.

Package Shape: SQUARE

The square package shape optimizes PCB layout and space efficiency, making it easier to design compact electronic circuits.

Bit Size: 32

A 32-bit architecture enhances performance and allows for more complex computations, making it suitable for demanding applications.

No. of Terminals: 48

A higher number of terminals facilitates more I/O options, enabling the connection of various peripherals and increasing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack and low-profile designs reduce the device's footprint, which is essential for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for greater flexibility in power supply options, contributing to energy efficiency.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature rating ensures reliability in harsh environments, making it suitable for industrial applications.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family provides excellent performance per watt, making this microcontroller ideal for battery-operated devices.

Minimum Operating Temperature: -40 °C

A wide temperature range guarantees functionality in extreme conditions, providing assurance for industrial and automotive uses.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to process analog signals, extending its applicability to sensor-based applications.

DMA Channels: YES

DMA capabilities enhance data transfer efficiency, reducing CPU load and improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning allows for robust connections, improving mechanical stability and reliability in circuit designs.

ROM Words: 196608

Sufficient ROM size allows for complex program storage, providing flexibility in application development.

Maximum Seated Height: 1.6 mm

A low seated height facilitates integration into thin devices, aligning with modern design trends toward miniaturization.

Width: 7 mm

A compact width aids in space-saving designs, critical for compact electronic devices.

Peripherals: BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

An extensive array of integrated peripherals enhances functionality and reduces the need for additional components, simplifying designs.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz ensures adequate processing speed for various applications, balancing power and performance.

Length: 7 mm

Similar to the width, this length allows for efficient PCB layout, making it suitable for small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature ratings ensure reliability and performance in demanding environments, enhancing longevity.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient instruction execution, reducing power consumption while maintaining performance.

No. of Timers: 8

Having multiple timers provides enhanced timing functions for multitasking and real-time applications, increasing versatility.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making it ideal for microcontroller applications.

Terminal Form: GULL WING

Gull-wing terminals enable easier soldering and better thermal properties, enhancing the reliability of connections.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V aligns with many battery-operated devices, ensuring compatibility for a wide range of applications.

No. of DMA Channels: 7

Multiple DMA channels facilitate efficient data handling, allowing for smoother operation in complex systems.

PWM Channels: YES

PWM capabilities are essential for control applications such as motor control and dimming, increasing flexibility in various environments.

Connectivity: I2C(3), I2S, LPUART, SPI(6), USART(4)

Diverse connectivity options allow for flexible integration with various devices, enhancing the microcontroller’s usability in different projects.

ROM Programmability: FLASH

Flash programmability allows for easy updating and modification of software, improving the adaptability of the microcontroller.

Terminal Pitch: 0.5 mm

0.5 mm terminal pitch allows for high-density connections, making it suitable for compact designs without compromising performance.

Speed: 32 rpm

The speed rating indicates efficiency in applications requiring precise timing and control, essential for automation tasks.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides a good balance for processing capabilities while accommodating various applications.

No. of I/O Lines: 37

A higher I/O line count allows for greater interfacing options, making it versatile for multiple application scenarios.

Technical Specifications

Microcontrollers STM32L071CZT7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of DMA Channels:

7

No. of I/O Lines:

37

No. of Terminals:

48

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(3), I2S, LPUART, SPI(6), USART(4)

Peripherals:

BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

Trade Compliance

STM32L071CZT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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