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STM32L071CBU6

STMicroelectronics

STM32L071CBU6 by STMicroelectronics

STM32L071CBU6 by STMicroelectronics is a 32-bit microcontroller ideal for low-power applications. It operates b/w 1.65V and 3.6V, features 40 I/O lines, and supports ADC and PWM channels. Its compact design (7mm x 7mm) makes it perfect for space-constrained projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 15,055 parts In-Stock

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15,055

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ComSIT USA

USA . 15,055 parts In-Stock

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15,055

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Vyrian

USA . 11,592 parts In-Stock

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11,592

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Anansix

USA . 823 parts In-Stock

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823

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Digiode

USA . 458 parts In-Stock

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458

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 852 parts In-Stock

1+ parts

$9.940

100+ parts

-

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852

$9.940

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Microchip USA

USA . 3,347 parts In-Stock

1+ parts

$19.378

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3,347

$19.378

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Vigor

Singapore . 150 parts In-Stock

1+ parts

$24.250

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150

$24.250

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IDEA Electronic Components Group

UK . 521 parts In-Stock

1+ parts

$47.838

100+ parts

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$43.054

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521

$47.838

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$43.054

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MKK Technologies

India . 2,014 parts In-Stock

1+ parts

$89.957

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2,014

$89.957

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DigiPath Technology Company

USA . 2,014 parts In-Stock

1+ parts

$89.957

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2,014

$89.957

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Corphita

USA . 3,254 parts In-Stock

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3,254

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GreenTree Electronics

Israel . 1,560 parts In-Stock

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1,560

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Parana Technologies

USA . 265 parts In-Stock

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$57.198

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265

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$57.198

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Overview

Unlock innovation with the STM32L071CBU6 microcontroller from STMicroelectronics, a powerhouse of versatility and efficiency. Designed for low-power applications, this compact marvel ensures exceptional performance without compromising battery life, making it ideal for IoT devices, wearable tech, and smart sensors. Trust in ST’s renowned quality to elevate your projects, delivering seamless integration and reliability that empowers your next breakthrough.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for efficient use of PCB space, making it ideal for compact applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with low-voltage systems, enhancing safety and energy efficiency.

Package Shape: SQUARE

The square package shape allows for better thermal performance and improved flow of electrical signals, leading to enhanced reliability.

Bit Size: 32

A 32-bit architecture allows for more complex calculations and better performance in data processing compared to 8 or 16-bit microcontrollers.

No. of Terminals: 48

With 48 terminals, this microcontroller provides ample connectivity for various peripherals and interfaces, making it versatile for different applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and integrated heat sink feature facilitate efficient thermal management, crucial for performance in demanding environments.

Minimum Supply Voltage: 1.65 V

Operating at a minimum supply voltage of just 1.65 V promotes energy efficiency in battery-powered applications.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog signals, enhancing the microcontroller's capability for a wide range of applications.

DMA Channels: YES

The presence of DMA channels enables efficient data transfer without CPU intervention, improving performance for high-throughput applications.

Terminal Position: QUAD

The quad terminal position facilitates easier soldering and improves electrical performance, reducing the risk of connection failures.

Width: 7 mm

A compact width of 7 mm allows for integration into smaller devices without sacrificing functionality.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz enables fast processing speeds, suitable for real-time applications.

Length: 7 mm

The 7 mm length contributes to the overall compactness of the design, ideal for space-constrained environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures simplified instruction sets and enhanced performance, reducing design complexity.

Terminal Form: NO LEAD

The no-lead terminal form helps to minimize the footprint on the PCB while improving solder reliability.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is optimal for standard electronics, balancing performance with power consumption.

PWM Channels: YES

Integrated PWM channels facilitate efficient control of motors and other devices, important for various control applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for higher density layouts on PCBs, efficient for modern applications.

Speed: 32 rpm

The specification of 32 rpm indicates suitable use in control systems needing precise and slow motion applications.

No. of I/O Lines: 40

With 40 I/O lines, this microcontroller offers versatile input/output capabilities for a wide range of interfacing needs.

Technical Specifications

Microcontrollers STM32L071CBU6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

40

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L071CBU6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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