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STM32L063R8T7

STMicroelectronics

STM32L063R8T7 by STMicroelectronics

STM32L063R8T7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 125 °C, and supports up to 64 terminals. With integrated ADC/DAC channels and multiple connectivity options, it's ideal for low-power applications. Its compact design ensures efficient performance in various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,523 parts In-Stock

1+ parts

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4,523

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Anansix

USA . 1,664 parts In-Stock

1+ parts

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1,664

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Digiode

USA . 1,369 parts In-Stock

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1,369

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 5,488 parts In-Stock

1+ parts

$3.280

100+ parts

-

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5,488

$3.280

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AZTECH Wire

Italy . 539 parts In-Stock

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$12.540

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539

$12.540

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Microchip USA

USA . 3,520 parts In-Stock

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$24.495

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3,520

$24.495

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Component Stockers USA

USA . 2,126 parts In-Stock

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$39.260

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2,126

$39.260

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IDEA Electronic Components Group

UK . 1,437 parts In-Stock

1+ parts

$77.635

100+ parts

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$69.872

10k+ parts

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1,437

$77.635

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$69.872

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MKK Technologies

India . 1,837 parts In-Stock

1+ parts

$145.988

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1,837

$145.988

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DigiPath Technology Company

USA . 1,837 parts In-Stock

1+ parts

$145.988

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1,837

$145.988

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Corphita

USA . 123 parts In-Stock

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123

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Parana Technologies

USA . 8 parts In-Stock

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$92.825

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8

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$92.825

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Overview

Unlock the potential of your next innovation with the STM32L063R8T7 microcontroller from STMicroelectronics. Renowned for its quality and reliability, this powerhouse offers exceptional performance in low-power applications while ensuring seamless connectivity and versatility. Perfect for IoT devices, wearables, and industrial automation, it combines advanced features with energy efficiency, allowing you to create cutting-edge solutions that stand out in today's market. Elevate your projects with the proven excellence of STMicroelectronics!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration into various electronic circuits, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Compatible with a wide range of power systems while ensuring low power consumption, which is crucial for portable battery-operated devices.

Package Shape: SQUARE

The square package shape provides a uniform layout that is easier to handle and integrate in PCB designs.

Bit Size: 32

The 32-bit architecture enables high performance and efficiency, allowing for complex computations and improved processing capabilities.

DAC Channels: YES

Inclusion of Digital-to-Analog Converters allows for versatile signal processing, essential for audio and control applications.

No. of Terminals: 64

A higher terminal count offers flexibility for connecting multiple peripherals and interfaces, suitable for advanced applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style allows for a thinner profile, making it ideal for applications where height is a constraint, enhancing design flexibility.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage is advantageous for battery-operated devices, extending battery life and reducing power consumption.

Maximum Operating Temperature: 125 °C

Designed to perform well in high-temperature environments, this microcontroller is suitable for industrial applications.

CPU Family: CORTEX-M0

The ARM Cortex-M0 core offers efficient processing with low power consumption, making it ideal for embedded systems.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows operation in harsh environments, making it suitable for automotive and outdoor applications.

ADC Channels: YES

Integrated Analog-to-Digital Converters enhance measurement capabilities, crucial for sensor applications.

DMA Channels: YES

Direct Memory Access capabilities improve data transfer efficiency, reducing CPU load and enhancing performance.

Terminal Position: QUAD

Quad terminal positioning allows for easier soldering and improved electrical performance in high-frequency applications.

ROM Words: 65536

A significant ROM capacity allows for the storage of complex programs and algorithms, accommodating sophisticated applications.

Digital To Analog Converters: 1-Ch 12-Bit

With a 12-bit resolution, the DAC provides precise voltage outputs necessary for fine control in various applications.

Width: 10 mm

The compact width facilitates integration into small devices while optimizing the PCB layout.

Data EEPROM Size: 2K

The on-chip EEPROM allows for non-volatile storage of critical configuration data or parameters, enhancing reliability.

Peripherals: COMPARATOR(2), RTC, TIMER(6), WDT(2)

A robust set of integrated peripherals enables extensive functionality in a single package, simplifying design complexity.

Maximum Clock Frequency: 32 MHz

The 32 MHz clock speed supports high-speed processing, enabling responsiveness in time-sensitive applications.

Length: 10 mm

The length complements the width for a compact package size, further enhancing design flexibility.

Peripheral IC Type: MICROCONTROLLER, RISC

Using RISC architecture ensures efficient instruction execution, leading to improved performance and lower power usage.

RAM Bytes: 8192

The ample RAM size facilitates efficient data manipulation and storage during program execution, improving application performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, essential for modern microcontroller applications.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering and easy mounting, enhancing connectivity and manufacturability.

Analog To Digital Convertors: 16-Ch 12-Bit

The presence of multiple ADC channels with high resolution enables simultaneous and precise data acquisition from multiple sources.

Nominal Supply Voltage: 3 V

The nominal supply voltage aligns well with many modern power systems, ensuring compatibility and stability in operation.

PWM Channels: YES

Pulse Width Modulation channels allow for effective control of motors and lights, enhancing the scope of applications.

Connectivity: I2C(2), I2S, LPUART, SPI(4), USART(2), USB

Multiple connectivity options enable easy integration into various systems and peripheral devices, promoting versatility.

ROM Programmability: FLASH

Flash memory programmability allows for easy updates and flexibility in developing and deploying applications.

Terminal Pitch: 0.5 mm

The smaller terminal pitch allows for denser layouts on PCBs, which can be especially useful in compact designs.

Speed: 32 rpm

The specified speed can be related to operations in responsive applications, ensuring timely processing and output.

On Chip Program ROM Width: 8

An 8-bit width for the program ROM enhances compatibility with a variety of applications while maintaining efficient data storage.

No. of I/O Lines: 51

A generous number of I/O lines provides ample flexibility for interfacing with a diverse range of sensors and devices.

Technical Specifications

Microcontrollers STM32L063R8T7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C(2), I2S, LPUART, SPI(4), USART(2), USB

Peripherals:

COMPARATOR(2), RTC, TIMER(6), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32L063R8T7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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