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STM32L051R8H7

STMicroelectronics

STM32L051R8H7 by STMicroelectronics

STM32L051R8H7 by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 25 MHz. It features 15-Ch 12-Bit ADC channels and low power mode, suitable for industrial applications requiring high-speed data processing and connectivity via I2C, SPI, UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,017 parts In-Stock

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7,017

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Anansix

USA . 1,730 parts In-Stock

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1,730

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Digiode

USA . 1,218 parts In-Stock

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1,218

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Distributors (Availability)

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Vigor

Singapore . 1,439 parts In-Stock

1+ parts

$2.540

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1,439

$2.540

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Microchip USA

USA . 6,104 parts In-Stock

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$18.968

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6,104

$18.968

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IDEA Electronic Components Group

UK . 2,228 parts In-Stock

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$19.967

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$17.970

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2,228

$19.967

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$17.970

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AZTECH Wire

Italy . 43 parts In-Stock

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$21.210

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43

$21.210

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MKK Technologies

India . 634 parts In-Stock

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$37.546

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634

$37.546

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DigiPath Technology Company

USA . 634 parts In-Stock

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$37.546

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634

$37.546

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Perfect Parts

USA . 4,301 parts In-Stock

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4,301

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QUARKTWIN TECHNOLOGY LTD

USA . 2,159 parts In-Stock

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2,159

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Parana Technologies

USA . 2,093 parts In-Stock

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$23.873

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2,093

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$23.873

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Corphita

USA . 210 parts In-Stock

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210

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Overview

Experience the unmatched quality and reliability of the STM32L051R8H7 microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers cutting-edge technology with a wide range of applications in various industries. Offering low power consumption, high performance, and advanced features like ADC channels, DMA channels, and PWM channels, this microcontroller provides exceptional value and benefits to customers looking for top-notch solutions. Upgrade your projects with the STM32L051R8H7 and experience superior quality and performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options without exceeding the safe operating voltage.

Bit Size: 32

Provides a good balance between performance and power consumption for various tasks.

RAM Bytes: 8192

Offers ample memory for processing data and running multiple applications simultaneously.

Maximum Clock Frequency: 25 MHz

Enables fast data processing and execution of instructions, enhancing overall performance.

Connectivity: I2C(2), I2S, SPI(4), UART, USART(2)

Supports various communication protocols, allowing for easy integration with other devices.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments with extreme temperatures.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for efficient and streamlined processing.

ROM Programmability: FLASH

Offers the ability to reprogram the read-only memory (ROM) for flexibility in application development.

Technical Specifications

Microcontrollers STM32L051R8H7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

7

No. of I/O Lines:

50

No. of Terminals:

64

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Current:

6.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C(2), I2S, SPI(4), UART, USART(2)

Peripherals:

BOR, DMA, POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

15-Ch 12-Bit

Trade Compliance

STM32L051R8H7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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