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STM32L031K6T3

STMicroelectronics

STM32L031K6T3 by STMicroelectronics

STM32L031K6T3 by STMicroelectronics is a 32-bit microcontroller with 32KB ROM, 8KB RAM, and 10-Ch 12-Bit ADC. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and low profile flatpack package style. Offers multiple peripherals like PWM(2), UART, SPI(2), and I2C for versatile connectivity options.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,088 parts In-Stock

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8,088

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Digiode

USA . 691 parts In-Stock

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691

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Anansix

USA . 521 parts In-Stock

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521

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

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Vigor

Singapore . 5,000 parts In-Stock

1+ parts

$1.950

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5,000

$1.950

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Semicontronic

India . 1,375 parts In-Stock

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$2.000

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$1.950

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$1.940

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1,375

$2.000

$1.950

$1.940

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AZTECH Wire

Italy . 405 parts In-Stock

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$14.087

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405

$14.087

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Microchip USA

USA . 2,481 parts In-Stock

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$16.533

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$16.533

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Ampacity Inc.

Singapore . 143 parts In-Stock

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$29.000

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143

$29.000

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IDEA Electronic Components Group

UK . 242 parts In-Stock

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$34.770

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$31.293

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242

$34.770

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$31.293

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MKK Technologies

India . 1,168 parts In-Stock

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$65.384

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$65.384

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DigiPath Technology Company

USA . 1,168 parts In-Stock

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$65.384

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Corohmni

South Africa . 1,164 parts In-Stock

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$74.074

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Aztec Data Supply Inc.

USA . 1,404 parts In-Stock

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$82.910

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Corphita

USA . 4,464 parts In-Stock

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Parana Technologies

USA . 2,004 parts In-Stock

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$41.573

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Continental Prestige Electronics

USA . 1,639 parts In-Stock

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Argo Parts USA

USA . 574 parts In-Stock

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574

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unleash the power of innovation with the STM32L031K6T3 microcontroller by STMicroelectronics. Known for their top-notch quality and reliability, STMicroelectronics delivers cutting-edge technology that exceeds expectations. The STM32L031K6T3 is perfect for a wide range of applications in the automotive industry, IoT devices, and consumer electronics. With its advanced features and high performance, this microcontroller offers unmatched value and benefits to customers looking to take their projects to the next level. Experience seamless connectivity, superior functionality, and endless possibilities with the STM32L031K6T3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material ensures easy handling and protection for the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of operating conditions and compatibility with various power sources.

CPU Family: CORTEX-M0

The Cortex-M0 architecture provides high performance and efficiency for embedded applications.

ROM Words: 32768

Ample memory capacity for storing program instructions and data.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast processing and response times.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and streamlined operation of the microcontroller.

RAM Bytes: 8192

Sufficient random access memory for temporary data storage and processing.

Analog To Digital Convertors: 10-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog signal conversion.

Connectivity: I2C, IRDA, SPI(2), UART, USART

Versatile connectivity options for interfacing with other devices and systems.

Technical Specifications

Microcontrollers STM32L031K6T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of DMA Channels:

7

No. of I/O Lines:

25

No. of Terminals:

32

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, SPI(2), UART, USART

Peripherals:

BOR, COMPARATOR(2), DMA(7), PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(5), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L031K6T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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