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STM32L031K4U6TR

STMicroelectronics

STM32L031K4U6TR by STMicroelectronics

STM32L031K4U6TR from STMicroelectronics is a 32-bit microcontroller ideal for low-power applications, operating b/w -40 °C to 85 °C. It features a max supply voltage of 3.6V, 8KB RAM, and supports I2C/SPI/UART connectivity. Perfect for industrial IoT devices with integrated ADC and PWM capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,216 parts In-Stock

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5,216

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Digiode

USA . 3,429 parts In-Stock

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3,429

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Anansix

USA . 1,659 parts In-Stock

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1,659

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,466 parts In-Stock

1+ parts

$1.500

100+ parts

-

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-

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1,466

$1.500

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AZTECH Wire

Italy . 35 parts In-Stock

1+ parts

$8.670

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-

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35

$8.670

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Microchip USA

USA . 4,888 parts In-Stock

1+ parts

$12.280

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4,888

$12.280

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IDEA Electronic Components Group

UK . 117 parts In-Stock

1+ parts

$15.140

100+ parts

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$13.626

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117

$15.140

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$13.626

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Component Stockers USA

USA . 2,119 parts In-Stock

1+ parts

$26.960

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2,119

$26.960

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MKK Technologies

India . 524 parts In-Stock

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$28.469

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524

$28.469

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DigiPath Technology Company

USA . 524 parts In-Stock

1+ parts

$28.469

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524

$28.469

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Corphita

USA . 3,204 parts In-Stock

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3,204

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Parana Technologies

USA . 829 parts In-Stock

1+ parts

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$18.102

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829

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$18.102

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Overview

Unlock the potential of your next project with the STM32L031K4U6TR microcontroller from STMicroelectronics, a leader in innovation and quality. This compact gem combines impressive performance with ultra-low power consumption, making it perfect for IoT applications, wearables, and smart devices. Experience seamless integration, enhanced connectivity, and reliable operation across varying temperatures while enjoying the peace of mind that comes with ST's trusted manufacturing excellence. Elevate your designs today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for compact designs and efficient PCB space utilization, making it ideal for modern electronic products.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options, ensuring compatibility with various battery and power configurations.

Package Shape: SQUARE

Square packages offer simplified layout and routing on PCBs, optimizing space and performance.

Bit Size: 32

A 32-bit architecture allows for higher performance and more complex computational tasks, making it suitable for advanced applications.

No. of Terminals: 32

With 32 terminals, it provides ample connectivity options for peripherals and other components, enhancing its versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style allows for efficient heat dissipation and minimal space requirements, crucial for high-density applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enables operation in a wide range of low-power applications, extending battery life.

Maximum Operating Temperature: 85 °C

High temperature tolerance makes this microcontroller suitable for industrial applications where environmental conditions can be extreme.

CPU Family: CORTEX-M0

The Cortex-M0 architecture is known for energy efficiency and high performance, ideal for battery-powered applications.

Minimum Operating Temperature: -40 °C

Ability to operate in extremely low temperatures increases reliability in diverse environmental conditions.

ADC Channels: YES

Inclusion of ADC channels allows for analog data processing, making it versatile for sensor interfacing and signal processing.

DMA Channels: YES

Direct Memory Access enables efficient data transfer without CPU intervention, enhancing performance for data-heavy applications.

Terminal Position: QUAD

Quad terminal positioning improves signal integrity and reduces noise, crucial for high-speed applications.

ROM Words: 16384

Adequate ROM space allows for complex firmware development, providing flexibility in application design.

Maximum Seated Height: 0.6 mm

Low profile design is ideal for applications where space is a constraint, contributing to slimmer devices.

Width: 5 mm

Compact width allows the microcontroller to fit into space-limited applications effectively.

Data EEPROM Size: 1K

Having 1K of EEPROM provides the ability to store parameters and settings without relying on external memory.

Peripherals: BOR, COMPARATOR(2), DMA(7), PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(5), WDT(2)

A rich peripheral set makes this microcontroller exceptionally versatile for various applications, from automotive to automation.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz supports rapid processing, making it suitable for performance-critical applications.

Length: 5 mm

This small length is ideal for constrained designs, ensuring that it can fit in compact electronic devices.

Temperature Grade: INDUSTRIAL

Industrial grade rating guarantees reliable performance in rigorous environments, essential for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances speed and efficiency, making it perfect for performance-oriented tasks.

No. of Timers: 5

Multiple timers allow for multitasking and effective timing operations, crucial for real-time applications.

RAM Bytes: 8192

A generous amount of RAM supports complex algorithms and data handling, making it suitable for sophisticated applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, perfect for battery-operated devices.

Terminal Form: NO LEAD

No lead terminal design enhances the reliability and reduces the size of the component in modern compact assemblies.

Analog To Digital Converters: 10-Ch 12-Bit

10-channel 12-bit ADCs provide high-resolution data acquisition, vital for applications requiring precise analog measurements.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V balances performance and power consumption, making it efficient for various applications.

No. of DMA Channels: 7

Multiple DMA channels allow simultaneous data transfers, optimizing performance in multitasking scenarios.

PWM Channels: YES

PWM capability enables effective control over motors and other devices, essential for embedded control systems.

Connectivity: I2C, IRDA, SPI(2), UART, USART

Robust connectivity options facilitate easy integration into a variety of systems, enhancing usability across applications.

ROM Programmability: FLASH

FLASH programming allows for in-field updates and modifications, increasing flexibility in application deployment.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for higher density layouts, suitable for compact circuit designs.

Speed: 32 rpm

Speed specification indicates capabilities for motion control applications, beneficial for robotics and automation.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows efficient storage and execution of instructions, improving overall processing efficiency.

No. of I/O Lines: 27

27 I/O lines provide extensive interfacing options, making it highly adaptable for various input/output needs.

Technical Specifications

Microcontrollers STM32L031K4U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of DMA Channels:

7

No. of I/O Lines:

27

No. of Terminals:

32

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, SPI(2), UART, USART

Peripherals:

BOR, COMPARATOR(2), DMA(7), PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(5), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L031K4U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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