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STM32L031C6U6TR

STMicroelectronics

STM32L031C6U6TR by STMicroelectronics

STM32L031C6U6TR microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.65V and 3.6V, and supports up to 25 MHz clock frequency. With 38 I/O lines and integrated ADC/DMA channels, it's ideal for low-power applications in IoT devices. Its compact square package ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 15,700 parts In-Stock

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15,700

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Anansix

USA . 2,694 parts In-Stock

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2,694

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Vyrian

USA . 2,111 parts In-Stock

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2,111

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Digiode

USA . 1,349 parts In-Stock

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1,349

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Distributors (Availability)

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Vigor

Singapore . 9,098 parts In-Stock

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$1.760

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9,098

$1.760

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AZTECH Wire

Italy . 634 parts In-Stock

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$9.580

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634

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Component Stockers USA

USA . 2,292 parts In-Stock

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$23.490

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$23.490

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IDEA Electronic Components Group

UK . 1,199 parts In-Stock

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$41.974

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$37.777

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$41.974

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$37.777

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MKK Technologies

India . 859 parts In-Stock

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$78.930

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859

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DigiPath Technology Company

USA . 859 parts In-Stock

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$78.930

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859

$78.930

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QUARKTWIN TECHNOLOGY LTD

USA . 7,505 parts In-Stock

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7,505

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Microchip USA

USA . 6,362 parts In-Stock

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6,362

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Parana Technologies

USA . 1,119 parts In-Stock

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$50.186

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Corphita

USA . 994 parts In-Stock

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994

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Overview

Elevate your next project with the STM32L031C6U6TR microcontroller from STMicroelectronics, a leader in innovation and reliability. Engineered for low power consumption without compromising performance, this compact powerhouse is perfect for IoT applications, wearable tech, and smart devices. Enjoy seamless integration, an extensive range of peripherals, and unparalleled support from a trusted manufacturer, all while maximizing efficiency and extending battery life. Unlock endless possibilities!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for compact design and easy integration into modern PCB layouts.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, the microcontroller is suitable for low-power applications.

Package Shape: SQUARE

The square package shape offers an efficient use of space and can facilitate heat dissipation.

Bit Size: 32

The 32-bit architecture provides enhanced processing capabilities and supports complex applications.

No. of Terminals: 48

Having 48 terminals increases flexibility in I/O configurations, allowing for more peripherals to be connected.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style is optimal for environments needing thermal management and space constraints.

Minimum Supply Voltage: 1.65 V

Operating down to 1.65 V makes it versatile for battery-powered applications, increasing efficiency.

ADC Channels: YES

The presence of ADC channels allows for direct interfacing with analog sensors, broadening application potential.

DMA Channels: YES

DMA channels enable efficient data transfers, relieving CPU load and enhancing performance in data-driven tasks.

Terminal Position: QUAD

Quad terminal positioning improves accessibility for soldering and connections, improving design robustness.

Width: 7 mm

The compact width is ideal for space-constrained applications, making it suitable for a variety of devices.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz ensures sufficient processing speed for real-time applications.

Length: 7 mm

The 7 mm length contributes to its compact design, making it ideal for portable electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Using a RISC architecture promotes power efficiency and faster instruction execution, enhancing performance.

Terminal Form: NO LEAD

No lead terminals facilitate a clean surface mount solution, reducing the risk of mechanical failure.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V ensures stability in operation across diverse applications.

PWM Channels: YES

PWM channels allow for precise control in applications such as motor drives and signal generation.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a higher density of connections in limited space, enhancing design flexibility.

Speed: 32 rpm

A speed rating of 32 rpm provides adequate responsiveness for various control applications.

No. of I/O Lines: 38

With 38 I/O lines, it is capable of handling a diverse range of peripherals and internal functions efficiently.

Technical Specifications

Microcontrollers STM32L031C6U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

38

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L031C6U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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