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STM32H7A3IIK6

STMicroelectronics

STM32H7A3IIK6 by STMicroelectronics

STM32H7A3IIK6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 64.3 MHz clock frequency and 1413120 bytes of RAM. It features 20-Ch 16-Bit ADCs, 3-Ch 12-Bit DACs, and extensive connectivity options like CAN, I2C, SPI, USB for industrial applications requiring high-performance processing and low power consumption.

Median Price

$7.970

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,514 parts In-Stock

1+ parts

$7.326

100+ parts

-

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2,514

$7.326

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Chip1Stop

Japan . 2,541 parts In-Stock

1+ parts

$11.508

100+ parts

-

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$9.310

2,541

$11.508

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-

$9.310

Verical

USA . 2,514 parts In-Stock

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2,514

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Future Electronics

Canada . 2,016 parts In-Stock

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$7.970

2,016

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$7.970

Distributors (In-Stock)

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Digiode

USA . 3,277 parts In-Stock

1+ parts

$9.841

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-

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3,277

$9.841

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Nova Conductors

Japan . 1,000 parts In-Stock

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$14.930

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1,000

$14.930

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Vyrian

USA . 2,387 parts In-Stock

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2,387

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Anansix

USA . 77 parts In-Stock

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77

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,427 parts In-Stock

1+ parts

$7.720

100+ parts

$7.527

1k+ parts

$7.488

10k+ parts

-

2,427

$7.720

$7.527

$7.488

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Ampacity Inc.

Singapore . 2,241 parts In-Stock

1+ parts

$7.720

100+ parts

-

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2,241

$7.720

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Corphita

USA . 3,048 parts In-Stock

1+ parts

$9.323

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3,048

$9.323

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Continental Prestige Electronics

USA . 3,771 parts In-Stock

1+ parts

$13.690

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-

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$13.416

3,771

$13.690

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-

$13.416

AZTECH Wire

Italy . 282 parts In-Stock

1+ parts

$14.210

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282

$14.210

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Netroflash

USA . 500 parts In-Stock

1+ parts

$14.930

100+ parts

$14.631

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500

$14.930

$14.631

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Aztec Data Supply Inc.

USA . 107 parts In-Stock

1+ parts

$15.690

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107

$15.690

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Modulus Dynamics

Lithuania . 450 parts In-Stock

1+ parts

$16.572

100+ parts

$16.407

1k+ parts

$15.909

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-

450

$16.572

$16.407

$15.909

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Corohmni

South Africa . 420 parts In-Stock

1+ parts

$35.471

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420

$35.471

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Microchip USA

USA . 3,131 parts In-Stock

1+ parts

$36.041

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3,131

$36.041

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IDEA Electronic Components Group

UK . 1,193 parts In-Stock

1+ parts

$54.660

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$49.194

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1,193

$54.660

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$49.194

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$69.756

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$66.268

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$66.268

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50

$69.756

$66.268

$66.268

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MKK Technologies

India . 103 parts In-Stock

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$102.784

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103

$102.784

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DigiPath Technology Company

USA . 103 parts In-Stock

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$102.784

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103

$102.784

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QUARKTWIN TECHNOLOGY LTD

USA . 6,732 parts In-Stock

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Robosynatics

Brazil . 5,000 parts In-Stock

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Lucentia Tech

USA . 5,000 parts In-Stock

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$4.589

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$4.589

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$4.589

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$4.589

$4.589

$4.589

Vigor

Singapore . 2,795 parts In-Stock

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2,795

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Parana Technologies

USA . 946 parts In-Stock

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$65.354

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946

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$65.354

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Argo Parts USA

USA . 278 parts In-Stock

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278

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Overview

Experience top-notch performance and reliability with the STM32H7A3IIK6 microcontroller from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers cutting-edge technology that caters to a wide range of applications. The STM32H7A3IIK6 offers unparalleled value with its integrated cache, advanced peripherals, and low power mode, making it the ideal choice for your next project. Unlock endless possibilities and achieve exceptional results with this high-quality microcontroller.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

PLASTIC/EPOXY package body material is durable and cost-effective, making the product reliable for long-term use.

Integrated Cache - YES

Integrated cache helps in improving performance by storing frequently accessed data, reducing latency in data retrieval.

Maximum Supply Voltage - 3.6 V

Operating at a maximum supply voltage of 3.6 V allows for flexibility and compatibility with a wide range of power sources.

Address Bus Width - 26

A wider address bus width of 26 bits enables access to a larger memory space, facilitating more efficient data processing.

Bit Size - 32

A 32-bit architecture allows for higher precision and performance compared to lower bit sizes.

ADC Channels - YES

Having Analog to Digital Converter channels enables the microcontroller to interface with analog sensors and signals, expanding its potential applications.

Peripheral IC Type - MICROCONTROLLER, RISC

Utilizing RISC architecture in a microcontroller provides efficient and high-speed processing capabilities, making it suitable for demanding tasks.

Peripheral IC Type - MICROCONTROLLER, RISC

Utilizing RISC architecture in a microcontroller provides efficient and high-speed processing capabilities, making it suitable for demanding tasks.

No. of Timers - 18

Having a high number of timers allows for precise timing control in various applications, enhancing functionality and performance.

Technology - CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Analog To Digital Convertors - 20-Ch 16-Bit

With 20 channels of 16-bit Analog to Digital Converters, the microcontroller can accurately and efficiently convert analog signals into digital data for processing.

Technical Specifications

Microcontrollers STM32H7A3IIK6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

64.3 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B201

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

138

No. of Terminals:

201

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA201,15X15,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

1413120

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

280 rpm

Maximum Supply Current:

173 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(6), UART(5), USART(5), USB

Peripherals:

BOR, COMPARATOR(2), DMA(5), POR, RTC, TIMER(18), WDT(2)

Analog To Digital Convertors:

20-Ch 16-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

STM32H7A3IIK6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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