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STM32H745IIT3

STMicroelectronics

STM32H745IIT3 by STMicroelectronics

STM32H745IIT3 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU family. It features 176 terminals, 22 timers, and 28-Ch 16-Bit ADC channels. Ideal for applications requiring high-speed processing, extensive I/O capabilities, and precise analog-to-digital conversion.

Median Price

$11.221

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,712 parts In-Stock

1+ parts

$11.221

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-

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2,712

$11.221

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Verical

USA . 2,712 parts In-Stock

1+ parts

$11.221

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-

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-

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2,712

$11.221

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Chip1Stop

Japan . 3,175 parts In-Stock

1+ parts

$18.278

100+ parts

$14.890

1k+ parts

$13.162

10k+ parts

-

3,175

$18.278

$14.890

$13.162

-

DigiKey

USA . 72 parts In-Stock

1+ parts

$20.280

100+ parts

$14.020

1k+ parts

$13.256

10k+ parts

-

72

$20.280

$14.020

$13.256

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Future Electronics

Canada . 1,200 parts In-Stock

1+ parts

-

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$9.990

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1,200

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-

$9.990

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EBV Elektronik

Germany . 160 parts In-Stock

1+ parts

-

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-

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160

-

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$16.387

100+ parts

-

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-

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10

$16.387

-

-

-

Digiode

USA . 555 parts In-Stock

1+ parts

$17.364

100+ parts

-

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555

$17.364

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-

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Vyrian

USA . 4,892 parts In-Stock

1+ parts

-

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4,892

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Anansix

USA . 1,395 parts In-Stock

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1,395

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IBS Electronics

USA . 1,200 parts In-Stock

1+ parts

-

100+ parts

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$14.011

10k+ parts

-

1,200

-

-

$14.011

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,466 parts In-Stock

1+ parts

$10.720

100+ parts

$10.452

1k+ parts

$10.398

10k+ parts

-

1,466

$10.720

$10.452

$10.398

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Ampacity Inc.

Singapore . 1,243 parts In-Stock

1+ parts

$10.720

100+ parts

-

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1,243

$10.720

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AZTECH Wire

Italy . 1,146 parts In-Stock

1+ parts

$15.930

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-

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1,146

$15.930

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Continental Prestige Electronics

USA . 869 parts In-Stock

1+ parts

$16.387

100+ parts

-

1k+ parts

-

10k+ parts

$16.059

869

$16.387

-

-

$16.059

Corphita

USA . 3,162 parts In-Stock

1+ parts

$16.450

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-

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3,162

$16.450

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Corohmni

South Africa . 158 parts In-Stock

1+ parts

$21.639

100+ parts

-

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158

$21.639

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Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$63.539

100+ parts

$60.362

1k+ parts

$60.362

10k+ parts

-

550

$63.539

$60.362

$60.362

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IDEA Electronic Components Group

UK . 2,217 parts In-Stock

1+ parts

$68.336

100+ parts

-

1k+ parts

$61.502

10k+ parts

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2,217

$68.336

-

$61.502

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Aztec Data Supply Inc.

USA . 6,431 parts In-Stock

1+ parts

$82.640

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6,431

$82.640

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MKK Technologies

India . 2,190 parts In-Stock

1+ parts

$128.501

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2,190

$128.501

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DigiPath Technology Company

USA . 2,190 parts In-Stock

1+ parts

$128.501

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2,190

$128.501

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Vigor

Singapore . 9,290 parts In-Stock

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9,290

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Microchip USA

USA . 2,174 parts In-Stock

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2,174

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Argo Parts USA

USA . 1,581 parts In-Stock

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1,581

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

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250

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Parana Technologies

USA . 28 parts In-Stock

1+ parts

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100+ parts

$81.706

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28

-

$81.706

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Overview

Unleash the power of innovation with the STM32H745IIT3 microcontroller from STMicroelectronics. Designed to deliver high-quality performance and reliability, this cutting-edge device offers a wide range of applications in various industries. With advanced features like integrated cache, DAC channels, and DMA support, this microcontroller provides unparalleled value and benefits to customers looking to streamline their systems and improve efficiency. Trust in the expertise and reputation of STMicroelectronics to elevate your projects to new heights with the STM32H745IIT3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for package body, ensuring reliability and affordability.

Integrated Cache: YES

Having an integrated cache helps in improving performance by reducing access times to frequently used data.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for flexibility in power requirements and can support a wide range of applications.

CPU Family: CORTEX-M7

Being part of the Cortex-M7 family ensures high performance and efficiency in processing data.

ADC Channels: YES

Presence of Analog-to-Digital Convertor channels enables the microcontroller to interface with analog sensors and signals.

RAM Bytes: 1048576

Large RAM size allows for efficient data storage and processing, making the microcontroller suitable for complex tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Connectivity: CAN(2), ETHERNET, I2C(4), I2S(3), SAI(4), SPI(6), UART(5), USART(4), USB

Versatile connectivity options make it easy to integrate the microcontroller into different types of networks and systems.

PWM Channels: YES

Pulse Width Modulation channels support precise control of analog components, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers STM32H745IIT3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of I/O Lines:

119

No. of Serial I/Os:

11

No. of Terminals:

176

No. of Timers:

22

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1048576

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

480 rpm

Maximum Supply Current:

544 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(4), I2S(3), SAI(4), SPI(6), UART(5), USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(22), WDT(4)

Analog To Digital Convertors:

28-Ch 16-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32H745IIT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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