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STM32H742AGI6TR

STMicroelectronics

STM32H742AGI6TR by STMicroelectronics

STM32H742AGI6TR by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,524 parts In-Stock

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Digiode

USA . 2,472 parts In-Stock

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Anansix

USA . 1,323 parts In-Stock

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1,323

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Ampacity Inc.

Singapore . 517 parts In-Stock

1+ parts

$6.000

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517

$6.000

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AZTECH Wire

Italy . 720 parts In-Stock

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$6.567

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720

$6.567

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IDEA Electronic Components Group

UK . 1,437 parts In-Stock

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$24.156

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$21.741

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$21.741

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Microchip USA

USA . 6,231 parts In-Stock

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$34.335

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$34.335

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Aztec Data Supply Inc.

USA . 146 parts In-Stock

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$37.820

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$37.820

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MKK Technologies

India . 1,160 parts In-Stock

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$45.425

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$45.425

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DigiPath Technology Company

USA . 1,160 parts In-Stock

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$45.425

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$45.425

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Corohmni

South Africa . 148 parts In-Stock

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$62.162

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Continental Prestige Electronics

USA . 5,440 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 4,035 parts In-Stock

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Corphita

USA . 1,937 parts In-Stock

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Parana Technologies

USA . 387 parts In-Stock

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$28.883

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387

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$28.883

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Discover the STM32H742AGI6TR microcontroller by STMicroelectronics, a high-quality and versatile solution for a wide range of applications. With its advanced features and reliable performance, this microcontroller offers unparalleled value to customers. Whether you're working on industrial automation, consumer electronics, or IoT projects, the STM32H742AGI6TR delivers exceptional speed and connectivity, ensuring seamless operation. Trust in STMicroelectronics' expertise and choose the STM32H742AGI6TR for your next project. It's time to elevate your designs and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This microcontroller is made with a durable plastic/epoxy package body material, ensuring its longevity and resilience.

Integrated Cache: YES

With an integrated cache, this microcontroller can efficiently store frequently used data, enhancing its overall performance.

Surface Mount: YES

The surface mount capability of this microcontroller simplifies the installation process, making it easier to integrate into various electronic devices.

Maximum Supply Voltage: 3.6 V

This microcontroller can operate effectively with a maximum supply voltage of 3.6V, providing flexibility and compatibility with different power sources.

On Chip Data RAM Width: 8

With an on-chip data RAM width of 8, this microcontroller enables fast and efficient data processing, contributing to its high performance.

Address Bus Width: 26

The generous address bus width of 26 allows this microcontroller to handle a large memory space, accommodating extensive data storage and processing requirements.

Package Shape: SQUARE

The square package shape of this microcontroller offers versatility and ease of integration into different electronic designs.

Bit Size: 32

With a bit size of 32, this microcontroller is capable of handling complex calculations and large data sets, making it suitable for demanding applications.

DAC Channels: YES

The presence of DAC (Digital-to-Analog Converter) channels enables this microcontroller to convert digital signals into analog outputs, expanding its range of applications.

No. of Terminals: 169

This microcontroller boasts a considerable number of terminals, providing extensive connectivity options and enabling effortless interfacing with other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style, combined with a very thin profile and fine pitch, makes this microcontroller suitable for compact and space-constrained electronic designs.

Minimum Supply Voltage: 1.62 V

With a minimum supply voltage requirement of 1.62V, this microcontroller can operate efficiently even with low-power sources, enhancing its energy efficiency.

Maximum Operating Temperature: 85 °C

This microcontroller can withstand high operating temperatures up to 85°C, making it suitable for demanding industrial environments.

CPU Family: CORTEX-M7

The Cortex-M7 CPU family ensures powerful and efficient processing capabilities, making this microcontroller an excellent choice for applications that require high-performance computing.

Minimum Operating Temperature: -40 °C

This microcontroller can operate in extremely low temperatures as low as -40°C, making it suitable for harsh environments and outdoor applications.

ADC Channels: YES

With ADC (Analog-to-Digital Converter) channels, this microcontroller can accurately convert analog signals into digital data, expanding its range of sensing and measurement applications.

DMA Channels: YES

The presence of DMA (Direct Memory Access) channels allows this microcontroller to efficiently transfer data between peripherals and memory, optimizing overall system performance.

Terminal Position: BOTTOM

The terminal position at the bottom facilitates PCB layout and connection, making it easier to integrate this microcontroller into electronic designs.

ROM Words: 1048576

With a capacity of 1048576 ROM words, this microcontroller provides ample space for program storage, accommodating complex and feature-rich applications.

Maximum Seated Height: 0.6 mm

The microcontroller's slim maximum seated height of 0.6mm enables it to be integrated into compact and space-saving electronic devices effortlessly.

Digital To Analog Convertors: 2-Ch 12-Bit

Equipped with two channels of 12-bit DAC, this microcontroller can create precise and accurate analog outputs, enhancing its capability in audio and signal generation applications.

Width: 7 mm

With a width of only 7mm, this microcontroller is suitable for compact and miniaturized electronic devices where space is limited.

Boundary Scan: YES

The boundary scan capability of this microcontroller simplifies testing and debugging during the manufacturing process, ensuring high product quality and reliability.

External Data Bus Width: 25

The external data bus width of 25 allows this microcontroller to interface with external memory and peripherals efficiently, enabling seamless data transfer and processing.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(21), WDT(2)

This microcontroller comes with various peripherals, including brown-out reset (BOR), comparators, DMA channels, power-on reset (POR), real-time clock (RTC), timers, and watchdog timer (WDT), expanding its range of application possibilities.

Maximum Clock Frequency: 48 MHz

Capable of running at a maximum clock frequency of 48MHz, this microcontroller ensures fast and efficient data processing, making it suitable for time-critical applications.

Length: 7 mm

With a length of 7mm, this microcontroller offers a compact form factor, enabling easy integration into space-constrained electronic designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller can operate reliably under demanding temperature conditions, ensuring its suitability for rugged environments.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller belongs to the RISC (Reduced Instruction Set Computing) architecture, offering streamlined and efficient instruction execution, making it a preferred choice for high-performance applications.

No. of Timers: 21

With 21 timers, this microcontroller provides extensive timing and synchronization capabilities, enabling precise control and coordination in various applications.

RAM Bytes: 708608

The generous amount of RAM, with a capacity of 708608 bytes, allows this microcontroller to handle large data sets and execute complex algorithms efficiently.

Technology: CMOS

Built with CMOS (Complementary Metal-Oxide-Semiconductor) technology, this microcontroller offers low power consumption, high noise immunity, and excellent performance characteristics.

Terminal Form: BALL

The ball terminal form simplifies the soldering and assembly process, ensuring reliable and robust connections in electronic designs.

Analog To Digital Convertors: 32-Ch 16-Bit

Equipped with 32 channels of 16-bit ADC, this microcontroller can accurately and precisely convert analog signals into digital data, expanding its range of sensing and measurement applications.

Maximum Supply Current: 100 mA

With a maximum supply current of 100mA, this microcontroller operates efficiently within a specified power range, making it suitable for various battery-powered applications.

Nominal Supply Voltage: 3.3 V

This microcontroller operates at a nominal supply voltage of 3.3V, providing compatibility with common power sources and ensuring stable performance.

No. of DMA Channels: 4

With four DMA channels, this microcontroller enables efficient data transfer between peripherals and memory, freeing up the CPU for other critical tasks, leading to improved system performance.

No. of Serial I/Os: 11

Equipped with 11 serial input/output interfaces, this microcontroller offers versatile communication capabilities, allowing seamless integration and interaction with external devices.

PWM Channels: YES

The presence of PWM (Pulse-Width Modulation) channels allows this microcontroller to generate precise and controlled analog output signals, facilitating applications such as motor control and LED dimming.

Connectivity: CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SDMMC(2), UART(4), USART(4), USB(2)

This microcontroller supports various connectivity options, including CAN, I2C, I2S, LPUART, SAI, SDMMC, UART, USART, and USB, providing versatility and compatibility for a wide range of communication needs.

ROM Programmability: FLASH

The flash-based ROM programmability allows for easy and flexible firmware updates and customization, ensuring adaptability and future-proofing for evolving application requirements.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this microcontroller offers precise and compact terminal spacing, making it suitable for densely populated circuit boards.

Format: FLOATING-POINT

Designed with support for floating-point calculations, this microcontroller enables accurate and efficient mathematical operations, expanding its suitability for complex computational applications.

Speed: 480 rpm

With a speed capability of 480 rpm, this microcontroller can handle high-speed data processing operations, ensuring swift execution of tasks in time-critical applications.

Low Power Mode: YES

This microcontroller supports a low power mode, allowing it to operate in energy-conserving states when idle or during periods of low activity, enhancing overall power efficiency.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 allows for efficient storage and execution of program code, enhancing the microcontroller's ability to handle complex software tasks.

No. of I/O Lines: 131

With 131 I/O lines, this microcontroller offers sufficient flexibility for interfacing with external devices and peripherals, accommodating various input/output requirements.

Technical Specifications

Microcontrollers STM32H742AGI6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

25

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B169

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of I/O Lines:

131

No. of Serial I/Os:

11

No. of Terminals:

169

No. of Timers:

21

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

708608

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

480 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SDMMC(2), UART(4), USART(4), USB(2)

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

32-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H742AGI6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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