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STM32H725ZGT6TR

STMicroelectronics

STM32H725ZGT6TR by STMicroelectronics

STM32H725ZGT6TR from STMicroelectronics is a powerful 32-bit microcontroller featuring a Cortex-M7 CPU, 1MB Flash ROM, and 577KB RAM. It supports multiple connectivity options like Ethernet and CAN, making it ideal for industrial automation. With a max clock of 50 MHz and low power modes, it's perfect for energy-efficient applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,764 parts In-Stock

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6,764

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Digiode

USA . 3,499 parts In-Stock

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3,499

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Anansix

USA . 1,485 parts In-Stock

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1,485

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Distributors (Availability)

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AZTECH Wire

Italy . 269 parts In-Stock

1+ parts

$18.790

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269

$18.790

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IDEA Electronic Components Group

UK . 2,374 parts In-Stock

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$35.497

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$31.948

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2,374

$35.497

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$31.948

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MKK Technologies

India . 2,378 parts In-Stock

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$66.750

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2,378

$66.750

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DigiPath Technology Company

USA . 2,378 parts In-Stock

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$66.750

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2,378

$66.750

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Corphita

USA . 3,601 parts In-Stock

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3,601

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Parana Technologies

USA . 1,867 parts In-Stock

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$42.442

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1,867

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$42.442

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Overview

Unlock the potential of your projects with the STM32H725ZGT6TR microcontroller from STMicroelectronics, a trusted leader in innovative technology. Boasting an exceptional blend of performance and efficiency, this versatile MCU is perfect for demanding applications ranging from industrial automation to smart homes. Experience seamless integration and powerful connectivity options, ensuring your designs are future-ready. Elevate your development with the reliability and quality that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material helps ensure the microcontroller remains reliable in various environments, making it suitable for long-lasting applications.

Integrated Cache: YES

The presence of an integrated cache improves the data handling speed, enhancing overall performance in applications requiring quick data retrieval.

Surface Mount: YES

Surface mount technology allows for easier and more compact PCB designs, facilitating integration into modern electronics.

Maximum Supply Voltage: 3.6 V

The moderate maximum supply voltage makes it adaptable for a variety of low-power applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width offers sufficient data processing for various applications without unnecessary complexity.

Package Shape: SQUARE

A square package shape allows for better thermal performance and more efficient layout on circuit boards.

Bit Size: 32

As a 32-bit microcontroller, it provides enhanced processing capabilities, making it suitable for complex applications.

DAC Channels: YES

Having digital-to-analog converters allows for better signal processing and output, ideal for audio and sensor applications.

No. of Terminals: 144

A larger number of terminals provides flexibility in connectivity and integration with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design makes it suitable for space-constrained applications, aiding in compact product designs.

Minimum Supply Voltage: 1.62 V

The low minimum supply voltage contributes to power efficiency, enabling longer device operation on battery power.

Maximum Operating Temperature: 85 °C

A high operating temperature range enhances reliability for industrial and demanding applications.

CPU Family: CORTEX-M7

The Cortex-M7 CPU is optimized for high performance and low energy consumption, perfect for advanced embedded systems.

Minimum Operating Temperature: -40 °C

This wide temperature range allows it to operate in harsh environments, making it suitable for outdoor and industrial uses.

ADC Channels: YES

With integrated ADC channels, this microcontroller can handle analog input, ideal for sensor applications.

DMA Channels: YES

Direct Memory Access channels enable high-speed data transfers without CPU intervention, improving system efficiency.

Terminal Position: QUAD

Quad terminal positioning simplifies board layout, enhancing ease of soldering and connection integrity.

ROM Words: 1048576

A large ROM capacity accommodates extensive code, enabling sophisticated and feature-rich applications.

Maximum Seated Height: 1.6 mm

A low profile height allows for sleek designs while maintaining performance, suitable for portable devices.

Digital To Analog Convertors: 2-Ch 12-Bit

With dual 12-bit DACs, it can output high-precision analog signals, ideal for audio and multimedia applications.

Width: 20 mm

A standardized width aids in compatibility with existing PCB designs and enhances manufacturing efficiency.

Boundary Scan: YES

Boundary scan capability enables easier testing and debugging, significantly reducing development time.

Peripherals: ANALOG COMPARATOR(2), BOR, DMA(16), LCD, POR, RTC, TIMER(24), WDT(2)

Diverse peripherals expand functionality, facilitating integrated solutions for a wide range of applications.

Maximum Clock Frequency: 50 MHz

A 50 MHz clock speed provides excellent processing power for real-time applications.

Length: 20 mm

With a standardized length, it fits well within various layouts and contributes to uniformity in design.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from reduced instruction set architecture, leading to faster execution times and efficiency.

No. of Timers: 24

Having multiple timers available offers extensive options for precise timing and event management in applications.

RAM Bytes: 577536

Ample RAM allows for complex data handling and efficient multitasking in applications.

Technology: CMOS

CMOS technology provides low power consumption and high levels of integration, enhancing performance and efficiency.

Terminal Form: GULL WING

Gull wing leads facilitate easier assembly and more reliable solder joints compared to other terminal types.

Analog To Digital Convertors: 28-Ch 16-Bit, 9-Ch 12-Bit

Multiple ADC channels with varying bit depth provide flexibility for high-quality signal acquisition and processing.

Maximum Supply Current: 360 mA

A high supply current supports demanding applications with multiple peripherals and features operated simultaneously.

Nominal Supply Voltage: 1.8 V

The nominal voltage ensures low power usage while maintaining performance, helpful for battery-operated devices.

No. of DMA Channels: 16

With 16 DMA channels, it supports highly efficient data transfer methods, optimizing system performance.

No. of Serial I/Os: 14

A generous number of serial I/O options facilitates diverse connectivity possibilities with external devices.

PWM Channels: YES

Pulse Width Modulation support allows for efficient motor control and other applications requiring variable signal generation.

Connectivity: ETHERNET, CAN(3), I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(6), SWPMI, UART(5), USART(5), USB

Extensive connectivity options enable versatile integration into a wide range of networks and devices, increasing application potential.

ROM Programmability: FLASH

Flash memory allows for easy updates and modifications to the firmware, enhancing flexibility and long-term usability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch aids in compact PCB designs, essential for modern electronic applications.

Format: FLOATING POINT

Floating-point support enables advanced computational tasks, essential for applications requiring high precision.

Speed: 550 rpm

This speed specification may indicate optimal operational settings for applications where speed control is relevant.

Low Power Mode: YES

Low power mode capabilities are ideal for energy-sensitive applications, extending battery life.

On Chip Program ROM Width: 8

An 8-bit program ROM width is effective for handling appropriate amounts of application programming without excess overhead.

No. of I/O Lines: 97

A high number of I/O lines increases the versatility of this microcontroller, making it capable of managing multiple peripherals simultaneously.

Technical Specifications

Microcontrollers STM32H725ZGT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

97

No. of Serial I/Os:

14

No. of Terminals:

144

No. of Timers:

24

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

577536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

550 rpm

Maximum Supply Current:

360 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, CAN(3), I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(6), SWPMI, UART(5), USART(5), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, DMA(16), LCD, POR, RTC, TIMER(24), WDT(2)

Analog To Digital Convertors:

28-Ch 16-Bit, 9-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H725ZGT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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