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STM32H725IGT3

STMicroelectronics

STM32H725IGT3 by STMicroelectronics

STM32H725IGT3 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 24 timers, 30-Ch ADC, and 2-Ch 12-Bit DAC. With Ethernet, CAN, I2C, SPI connectivity options, it's ideal for applications requiring high-speed processing and extensive peripheral support in a compact form factor. Operating b/w -40 to 125 °C, this MCU is suitable for industrial automation and IoT devices.

Median Price

$11.065

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

1+ parts

$14.970

100+ parts

$10.171

1k+ parts

$9.367

10k+ parts

-

2

$14.970

$10.171

$9.367

-

Future Electronics

Canada . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.160

10k+ parts

-

1,600

-

-

$7.160

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,849 parts In-Stock

1+ parts

$13.699

100+ parts

-

1k+ parts

-

10k+ parts

-

4,849

$13.699

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$13.858

100+ parts

-

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50

$13.858

-

-

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Vyrian

USA . 4,831 parts In-Stock

1+ parts

-

100+ parts

-

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4,831

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Anansix

USA . 2,666 parts In-Stock

1+ parts

-

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-

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2,666

-

-

-

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IBS Electronics

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.565

10k+ parts

-

1,600

-

-

$9.565

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Chip Stock

USA . 225 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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225

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,115 parts In-Stock

1+ parts

$8.020

100+ parts

$7.820

1k+ parts

$7.779

10k+ parts

-

1,115

$8.020

$7.820

$7.779

-

Ampacity Inc.

Singapore . 941 parts In-Stock

1+ parts

$8.020

100+ parts

-

1k+ parts

-

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-

941

$8.020

-

-

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Corphita

USA . 195 parts In-Stock

1+ parts

$12.978

100+ parts

-

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-

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195

$12.978

-

-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$13.580

100+ parts

-

1k+ parts

$13.037

10k+ parts

-

2,000

$13.580

-

$13.037

-

Continental Prestige Electronics

USA . 2,670 parts In-Stock

1+ parts

$13.858

100+ parts

-

1k+ parts

-

10k+ parts

$13.580

2,670

$13.858

-

-

$13.580

Microchip USA

USA . 3,004 parts In-Stock

1+ parts

$36.063

100+ parts

-

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-

10k+ parts

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3,004

$36.063

-

-

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Aztec Data Supply Inc.

USA . 226 parts In-Stock

1+ parts

$55.140

100+ parts

-

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-

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226

$55.140

-

-

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Corohmni

South Africa . 512 parts In-Stock

1+ parts

$62.988

100+ parts

-

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512

$62.988

-

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IDEA Electronic Components Group

UK . 1,604 parts In-Stock

1+ parts

$69.940

100+ parts

-

1k+ parts

$62.946

10k+ parts

-

1,604

$69.940

-

$62.946

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Advanced Electronics

New Zealand . 37 parts In-Stock

1+ parts

$80.036

100+ parts

$76.034

1k+ parts

$76.034

10k+ parts

-

37

$80.036

$76.034

$76.034

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MKK Technologies

India . 1,547 parts In-Stock

1+ parts

$131.518

100+ parts

-

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1,547

$131.518

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DigiPath Technology Company

USA . 1,547 parts In-Stock

1+ parts

$131.518

100+ parts

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1,547

$131.518

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Perfect Parts

USA . 45,696 parts In-Stock

1+ parts

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45,696

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Argo Parts USA

USA . 2,956 parts In-Stock

1+ parts

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2,956

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Robosynatics

Brazil . 900 parts In-Stock

1+ parts

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900

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Lucentia Tech

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$13.551

1k+ parts

$13.551

10k+ parts

$13.551

900

-

$13.551

$13.551

$13.551

Parana Technologies

USA . 755 parts In-Stock

1+ parts

-

100+ parts

$83.624

1k+ parts

-

10k+ parts

-

755

-

$83.624

-

-

Overview

Upgrade your projects with the high-performance STM32H725IGT3 microcontroller by STMicroelectronics. With cutting-edge technology and a wide range of peripherals including Ethernet, CAN, and USB connectivity, this microcontroller offers endless possibilities for applications in industrial automation, IoT, and consumer electronics. Benefit from the reliability and innovation that STMicroelectronics is known for, and take your designs to the next level with the STM32H725IGT3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and heat resistance, making the product suitable for a variety of environments.

Integrated Cache: YES

The integrated cache helps improve the overall performance of the microcontroller by reducing access time to frequently used instructions or data.

Surface Mount: YES

The surface mount capability allows for easy integration onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs for versatility in different applications.

On Chip Data RAM Width: 8

The wide data RAM width allows for faster data processing and manipulation, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

The square package shape provides uniformity and ease of mounting on circuit boards, improving stability and reliability.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle larger data sizes and perform more complex calculations efficiently.

DAC Channels: YES

The presence of DAC channels enables analog signal generation, making the microcontroller suitable for applications requiring precise voltages.

No. of Terminals: 176

The high number of terminals allows for a greater level of connectivity and expandability in the system design.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact and low-profile design with fine pitch, making it ideal for space-constrained applications.

Technical Specifications

Microcontrollers STM32H725IGT3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

119

No. of Serial I/Os:

14

No. of Terminals:

176

No. of Timers:

24

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

577536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

550 rpm

Maximum Supply Current:

360 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, CAN(3), I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(6), SWPMI, UART(5), USART(5), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, DMA(16), LCD, POR, RTC, TIMER(24), WDT(2)

Analog To Digital Convertors:

30-Ch 16-Bit, 12-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H725IGT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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