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STM32H725IGK3TR

STMicroelectronics

STM32H725IGK3TR by STMicroelectronics

STM32H725IGK3TR by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max clock frequency of 50 MHz. It has multiple peripherals including Ethernet, CAN, I2C, SPI, UART, and USB, making it suitable for applications requiring connectivity. With low power mode and a wide range of operating temperatures (-40 to 125 °C), it is ideal for various industrial and automotive applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,552 parts In-Stock

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Digiode

USA . 4,419 parts In-Stock

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Anansix

USA . 624 parts In-Stock

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624

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Nova Conductors

Japan . 68 parts In-Stock

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68

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Distributors (Availability)

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AZTECH Wire

Italy . 368 parts In-Stock

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$7.795

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368

$7.795

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Ampacity Inc.

Singapore . 641 parts In-Stock

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$26.000

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641

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IDEA Electronic Components Group

UK . 540 parts In-Stock

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$28.009

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$25.208

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540

$28.009

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$25.208

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Semicontronic

India . 1,495 parts In-Stock

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$33.000

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$32.175

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$32.010

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$33.000

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$32.010

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Microchip USA

USA . 2,419 parts In-Stock

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$33.186

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Corohmni

South Africa . 520 parts In-Stock

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$44.420

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MKK Technologies

India . 2,334 parts In-Stock

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$52.670

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$52.670

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DigiPath Technology Company

USA . 2,334 parts In-Stock

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$52.670

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Aztec Data Supply Inc.

USA . 2,533 parts In-Stock

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$82.020

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Corphita

USA . 3,311 parts In-Stock

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Argo Parts USA

USA . 3,071 parts In-Stock

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Continental Prestige Electronics

USA . 2,515 parts In-Stock

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Bastille Electronics

Australia . 700 parts In-Stock

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Parana Technologies

USA . 571 parts In-Stock

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$33.490

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Overview

Discover the STM32H725IGK3TR, a high-quality microcontroller by STMicroelectronics. With its advanced features and state-of-the-art technology, this microcontroller offers unparalleled performance for a wide range of applications. Whether you're designing a smart home device or an industrial automation system, the STM32H725IGK3TR is designed to exceed your expectations. With its integrated cache, extensive connectivity options, and low power mode, this microcontroller delivers exceptional value and benefits to our customers. Trust STMicroelectronics, a renowned manufacturer known for its reliability and innovation, and unlock the full potential of your next project with the STM32H725IGK3TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the microcontroller, making it suitable for various applications.

Integrated Cache: YES

The integrated cache improves the microcontroller's performance by storing frequently accessed data, thereby reducing access time and enhancing overall efficiency.

Surface Mount: YES

The surface mount feature allows for easy and compact mounting on a PCB, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can operate effectively in applications that require sufficient power levels.

On Chip Data RAM Width: 8

The wide data RAM width of 8 allows for faster data processing and efficient handling of larger amounts of data.

Package Shape: SQUARE

The square package shape makes the microcontroller evenly balanced and space-efficient, ensuring optimal use of available board space.

Bit Size: 32

The 32-bit architecture enables the microcontroller to handle complex calculations and perform advanced functions, making it ideal for demanding applications.

DAC Channels: YES

The presence of DAC channels allows the microcontroller to convert digital signals into analog voltages, enabling precise control and compatibility with various analog devices.

No. of Terminals: 201

With a high number of terminals, this microcontroller offers extensive connectivity options, allowing for a wide range of peripheral devices to be connected for enhanced functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style, combined with a very thin profile and fine pitch, ensures high-density integration and reliable connections, making it suitable for compact electronic devices.

Minimum Supply Voltage: 1.62 V

The low minimum supply voltage allows the microcontroller to operate efficiently even in low-power applications, conserving energy and extending battery life.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this microcontroller suitable for use in harsh environments or applications that generate significant heat.

CPU Family: CORTEX-M7

The Cortex-M7 CPU family offers high-performance processing capabilities, enabling the microcontroller to handle complex tasks efficiently, making it suitable for demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microcontroller's functionality and reliability even in extremely cold environments.

ADC Channels: YES

The availability of ADC channels allows the microcontroller to convert analog signals into digital data, enabling precise measurements and compatibility with various sensors and input devices.

DMA Channels: YES

With DMA channels, the microcontroller can transfer data between peripherals and memory without CPU intervention, improving data transfer speed and overall system performance.

Terminal Position: BOTTOM

The bottom terminal position makes it convenient for PCB mounting and simplifies the overall design process.

ROM Words: 1048576

With a large ROM capacity of 1048576 words, this microcontroller can store a significant amount of program code, allowing for complex applications and firmware implementations.

Maximum Seated Height: 0.6 mm

The low maximum seated height ensures that the microcontroller can be easily integrated into slim devices without adding unwanted thickness or bulk.

Digital To Analog Convertors: 2-Ch 12-Bit

The 2-channel 12-bit digital-to-analog converters enable precise control of analog output signals, making the microcontroller suitable for audio applications, motor control, and more.

Width: 10 mm

The compact width of 10 mm allows for more flexibility in PCB layout and design, especially in space-constrained applications.

Boundary Scan: YES

The boundary scan feature enables efficient testing and debugging of the microcontroller's connections, ensuring reliability and ease of manufacturing.

Peripherals: ANALOG COMPARATOR(2), BOR, DMA(16), LCD, POR, RTC, TIMER(24), WDT(2)

This microcontroller offers a wide range of peripherals, including analog comparators, DMA controllers, LCD interfaces, real-time clocks, timers, and watchdog timers, providing versatility and enabling seamless integration with various applications.

Maximum Clock Frequency: 50 MHz

With a high maximum clock frequency of 50 MHz, the microcontroller can execute instructions at a faster rate, enabling high-speed processing and responsiveness.

Length: 10 mm

The compact length of 10 mm allows for efficient use of PCB space, making the microcontroller suitable for compact and portable devices.

Peripheral IC Type: MICROCONTROLLER, RISC

As a microcontroller with RISC architecture, this product offers simplified instruction set and efficient processing, making it ideal for embedded systems and control applications.

No. of Timers: 24

The presence of 24 timers allows for precise timing and event management, making the microcontroller suitable for applications that require advanced timing control.

RAM Bytes: 577536

With a generous RAM capacity of 577536 bytes, the microcontroller can handle large data buffers and support complex algorithms, ensuring smooth and efficient operation.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity, enhancing overall performance and energy efficiency.

Terminal Form: BALL

The ball terminal form simplifies the assembly and soldering process, ensuring reliable connections and reducing manufacturing complexities.

Analog To Digital Convertors: 38-Ch 16-Bit, 17-Ch 12-Bit

The microcontroller's combination of 16-bit and 12-bit analog-to-digital converters allows for precise and accurate conversion of analog signals, making it suitable for applications that involve sensor reading and data acquisition.

Maximum Supply Current: 360 mA

With a maximum supply current of 360 mA, this microcontroller can deliver sufficient power to support multiple peripherals and demanding applications.

Nominal Supply Voltage: 1.8 V

The 1.8V nominal supply voltage ensures compatibility with low power and battery-operated applications, maximizing energy efficiency.

No. of DMA Channels: 16

The availability of 16 DMA channels allows for efficient data transfer and peripheral communication, reducing CPU overhead and enhancing system performance.

No. of Serial I/Os: 14

With 14 serial input/output lines, the microcontroller can communicate with a variety of external devices, enabling seamless data exchange and connectivity options.

PWM Channels: YES

The presence of PWM channels enables precise control of motor speed, LED brightness, and other applications that require accurate pulse-width modulation.

Connectivity: ETHERNET, CAN(3), I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(6), SWPMI, UART(5), USART(5), USB

This microcontroller offers a wide range of connectivity options, including Ethernet, CAN, I2C, I2S, LPUART, SAI, SDMMC, SPI, SWPMI, UART, USART, and USB interfaces, providing flexibility and compatibility with various communication protocols and devices.

ROM Programmability: FLASH

The flash ROM programmability allows for easy updating and reprogramming of firmware, ensuring flexibility and adaptability to changing system requirements.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm facilitates reliable soldering and high-density PCB integration, making it suitable for applications with space restrictions.

Format: FLOATING POINT

The floating-point format enables the microcontroller to handle decimal calculations and perform complex mathematical operations with high precision, making it ideal for scientific and numerical applications.

Speed: 550 rpm

The high speed of 550 rpm ensures efficient execution of instructions and fast data processing, enhancing overall system performance.

Low Power Mode: YES

The low power mode feature allows the microcontroller to operate in power-saving states, conserving energy and extending battery life, making it suitable for battery-powered devices.

On Chip Program ROM Width: 8

The wide on-chip program ROM width of 8 enables efficient storage and execution of program code, supporting complex algorithms and diverse applications.

No. of I/O Lines: 128

With 128 I/O lines, this microcontroller offers ample connectivity options for external devices, sensors, and user interfaces, enabling versatile system integration and expandability.

Technical Specifications

Microcontrollers STM32H725IGK3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B201

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

128

No. of Serial I/Os:

14

No. of Terminals:

201

No. of Timers:

24

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA201,15X15,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

577536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

550 rpm

Maximum Supply Current:

360 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, CAN(3), I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(6), SWPMI, UART(5), USART(5), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, DMA(16), LCD, POR, RTC, TIMER(24), WDT(2)

Analog To Digital Convertors:

38-Ch 16-Bit, 17-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H725IGK3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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