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STM32H725IET6

STMicroelectronics

STM32H725IET6 by STMicroelectronics

STM32H725IET6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 24 timers, and 30-Ch 16-Bit ADC. It operates at up to 50 MHz clock frequency and features low power mode for energy efficiency. Ideal for applications requiring high-performance computing and precise analog-to-digital conversion.

Median Price

$14.730

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 297 parts In-Stock

1+ parts

$14.730

100+ parts

$9.450

1k+ parts

$8.400

10k+ parts

-

297

$14.730

$9.450

$8.400

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$12.165

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$12.165

-

-

-

Vyrian

USA . 11,580 parts In-Stock

1+ parts

-

100+ parts

-

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-

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11,580

-

-

-

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Digiode

USA . 1,503 parts In-Stock

1+ parts

-

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-

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1,503

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-

-

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Anansix

USA . 1,454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,454

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 539 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

539

$2.000

-

-

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Continental Prestige Electronics

USA . 4,881 parts In-Stock

1+ parts

$12.165

100+ parts

-

1k+ parts

-

10k+ parts

$11.922

4,881

$12.165

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-

$11.922

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$12.165

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$12.165

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-

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Modulus Dynamics

Lithuania . 870 parts In-Stock

1+ parts

$12.843

100+ parts

$12.714

1k+ parts

$12.329

10k+ parts

-

870

$12.843

$12.714

$12.329

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AZTECH Wire

Italy . 272 parts In-Stock

1+ parts

$17.939

100+ parts

-

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-

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272

$17.939

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Semicontronic

India . 578 parts In-Stock

1+ parts

$18.000

100+ parts

$17.550

1k+ parts

$17.460

10k+ parts

-

578

$18.000

$17.550

$17.460

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Corohmni

South Africa . 1,150 parts In-Stock

1+ parts

$22.390

100+ parts

-

1k+ parts

-

10k+ parts

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1,150

$22.390

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Microchip USA

USA . 1,334 parts In-Stock

1+ parts

$31.765

100+ parts

-

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10k+ parts

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1,334

$31.765

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IDEA Electronic Components Group

UK . 1,069 parts In-Stock

1+ parts

$34.259

100+ parts

-

1k+ parts

$30.833

10k+ parts

-

1,069

$34.259

-

$30.833

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$37.780

100+ parts

$35.891

1k+ parts

$35.891

10k+ parts

-

1,000

$37.780

$35.891

$35.891

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MKK Technologies

India . 1,945 parts In-Stock

1+ parts

$64.422

100+ parts

-

1k+ parts

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10k+ parts

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1,945

$64.422

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DigiPath Technology Company

USA . 1,945 parts In-Stock

1+ parts

$64.422

100+ parts

-

1k+ parts

-

10k+ parts

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1,945

$64.422

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-

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Aztec Data Supply Inc.

USA . 774 parts In-Stock

1+ parts

$65.820

100+ parts

-

1k+ parts

-

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774

$65.820

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Corphita

USA . 2,350 parts In-Stock

1+ parts

-

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2,350

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Argo Parts USA

USA . 1,154 parts In-Stock

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1,154

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Parana Technologies

USA . 163 parts In-Stock

1+ parts

-

100+ parts

$40.962

1k+ parts

-

10k+ parts

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163

-

$40.962

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-

Overview

Unlock unlimited possibilities with the STM32H725IET6 microcontroller by STMicroelectronics. Crafted with precision and innovation, this powerful device offers unparalleled performance and efficiency for a wide range of applications. From IoT devices to industrial automation, the STM32H725IET6 delivers exceptional value, advanced features, and reliable performance. Trust in STMicroelectronics to provide cutting-edge technology that empowers your projects and drives success. Elevate your designs with the STM32H725IET6 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Integrated Cache:

YES - Improves processing speed and efficiency, enhancing overall performance of the microcontroller.

Surface Mount:

YES - Allows for easy and compact installation on PCBs, making it suitable for space-constrained designs.

Maximum Supply Voltage:

3.6 V - Supports a wide range of power supply options, offering flexibility in different operating conditions.

On Chip Data RAM Width:

8 - Provides sufficient memory capacity for storing and processing data efficiently.

Package Shape:

SQUARE - Offers a compact form factor for easy integration into designs with limited space.

Bit Size:

32 - Enables the microcontroller to handle complex calculations and tasks effectively.

DAC Channels:

YES - Allows for analog signal generation, enabling the microcontroller to interface with external devices accurately.

No. of Terminals:

176 - Provides multiple connectivity options for interfacing with external components and peripherals.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - Offers a versatile package style suitable for various PCB layouts and designs.

Minimum Supply Voltage:

1.62 V - Supports low-power operations, making it energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature:

85 °C - Ensures reliable performance even in high-temperature environments.

CPU Family:

CORTEX-M7 - Belongs to a high-performance processor family, offering efficient processing capabilities.

Minimum Operating Temperature:

40 °C - Ensures reliable operation in extreme cold conditions.

ADC Channels:

YES - Enables the microcontroller to convert analog signals to digital data accurately.

DMA Channels:

YES - Facilitates efficient data transfer between peripherals and memory, enhancing overall system performance.

Terminal Position:

QUAD - Provides a secure and stable connection on the PCB, ensuring robust electrical connections.

ROM Words:

524288 - Offers ample storage for program instructions and data, enabling versatile application development.

Maximum Seated Height:

1.6 mm - Allows for a low-profile design, suitable for compact and space-saving applications.

Digital To Analog Convertors:

2-Ch 12-Bit - Provides accurate analog signal conversion, enhancing compatibility with external devices.

Width:

24 mm - Offers a compact footprint for easy integration into various electronic designs.

Boundary Scan:

YES - Facilitates testing and debugging during production, ensuring high quality and reliability of the product.

Peripherals:

ANALOG COMPARATOR(2), BOR, DMA(16), LCD, POR, RTC, TIMER(24), WDT(2) - Offers a wide range of integrated peripherals for enhanced functionality and performance.

Maximum Clock Frequency:

50 MHz - Supports high-speed processing, making it suitable for demanding applications.

Length:

24 mm - Provides a balanced form factor for easy placement and layout on the PCB.

Peripheral IC Type:

MICROCONTROLLER, RISC - Utilizes a high-performance RISC architecture for efficient processing and control tasks.

No. of Timers:

24 - Provides multiple timing capabilities for precise control and synchronization in various applications.

RAM Bytes:

577536 - Offers a large memory capacity for storing data and program instructions, enabling versatile applications.

Technology:

CMOS - Utilizes CMOS technology for low power consumption and high noise immunity, ensuring reliable operation.

Terminal Form:

GULL WING - Provides a secure and reliable connection on the PCB, ensuring robust electrical connections.

Analog To Digital Convertors:

30-Ch 16-Bit, 12-Ch 12-Bit - Supports accurate analog-to-digital conversion for precise sensor interfacing and data acquisition.

Maximum Supply Current:

360 mA - Supports high current requirements for various peripherals and components, ensuring stable operation.

Nominal Supply Voltage:

1.8 V - Offers an optimal operating voltage for efficient power consumption and performance.

No. of DMA Channels:

16 - Facilitates efficient data transfer between memory and peripherals, enhancing overall system performance.

No. of Serial I/Os:

14 - Provides multiple communication interfaces for connecting with external devices and peripherals.

PWM Channels:

YES - Enables precise control of output signals, suitable for driving motors and actuators in control applications.

Connectivity:

ETHERNET, CAN(3), I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(6), SWPMI, UART(5), USART(5), USB - Offers versatile connectivity options for interfacing with a wide range of devices and networks.

ROM Programmability:

FLASH - Allows for easy reprogramming and updating of firmware, enabling flexibility in application development.

Terminal Pitch:

0.5 mm - Provides a compact pitch size for high-density PCB layouts, suitable for space-constrained designs.

Format:

FLOATING POINT - Supports precise arithmetic calculations and processing, suitable for applications requiring high computational accuracy.

Speed:

550 rpm - Offers high-speed processing capabilities, suitable for real-time control applications.

Low Power Mode:

YES - Supports power-saving features for energy-efficient operation, ideal for battery-powered devices.

No. of I/O Lines:

119 - Offers a large number of I/O lines for versatile connectivity and interfacing with external components and peripherals.

Technical Specifications

Microcontrollers STM32H725IET6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

119

No. of Serial I/Os:

14

No. of Terminals:

176

No. of Timers:

24

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

577536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

550 rpm

Maximum Supply Current:

360 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, CAN(3), I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(6), SWPMI, UART(5), USART(5), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, DMA(16), LCD, POR, RTC, TIMER(24), WDT(2)

Analog To Digital Convertors:

30-Ch 16-Bit, 12-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H725IET6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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